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公开(公告)号:EP4040924A1
公开(公告)日:2022-08-10
申请号:EP22157740.6
申请日:2016-08-11
Applicant: LG Innotek Co., Ltd.
Inventor: HWANG, Jung Ho , LEE, Han Su , CHOI, Dae Young , KWON, Soon Gyu , JEONG, Dong Hun , JEONG, In Ho , SON, Kil Dong , KIM, Sang Hwa , LEE, Sang Young , JEON, Jae Hoon , LEE, Jin Hak , BAE, Yun Mi
Abstract: Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first portion formed on the insulating layer and including a corner portion of an upper portion which has a predetermined curvature and a second portion formed on the first portion and configured to cover an upper surface of the first portion including the corner portion.
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2.
公开(公告)号:EP3145284A1
公开(公告)日:2017-03-22
申请号:EP16183691.1
申请日:2016-08-11
Applicant: LG Innotek Co., Ltd.
Inventor: HWANG, Jung Ho , LEE, Han Su , CHOI, Dae Young , KWON, Soon Gyu , JEONG, Dong Hun , JEONG, In Ho , SON, Kil Dong , KIM, Sang Hwa , LEE, Sang Young , JEON, Jae Hoon , LEE, Jin Hak , BAE, Yun Mi
IPC: H05K3/10
CPC classification number: H05K3/188 , H05K1/0298 , H05K1/09 , H05K3/002 , H05K3/108 , H05K3/244 , H05K2201/0347 , H05K2201/098 , H05K2203/0548 , H05K2203/0588 , H05K2203/0723 , H05K2203/1184
Abstract: Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first portion formed on the insulating layer and including a corner portion of an upper portion which has a predetermined curvature and a second portion formed on the first portion and configured to cover an upper surface of the first portion including the corner portion.
Abstract translation: 公开了一种印刷电路板和一种制造该印刷电路板的方法。 印刷电路板包括绝缘层和形成在绝缘层上的电路图案,其中电路图案包括第一部分和第二部分,第一部分形成在绝缘层上并且包括具有预定曲率的上部的拐角部分, 形成在所述第一部分上并构造成覆盖包括所述角部的所述第一部分的上表面。
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