公开(公告)号：EP4426077A3

公开(公告)日：2024-11-13

申请号：EP24188063.2

申请日：2015-08-20

Applicant: LG Innotek Co., Ltd.

Inventor： BAE, Yun Mi ,  KWON, Soon Gyu ,  KIM, Sang Hwa ,  LEE, Sang Young ,  LEE, Jin Hak ,  LEE, Han Su ,  JEONG, Dong Hun ,  JEONG, In Ho ,  CHOI, Dae Young ,  HWANG, Jung Ho

IPC: H05K3/10 ,  H05K3/24

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

公开(公告)号：EP3145284A1

公开(公告)日：2017-03-22

申请号：EP16183691.1

申请日：2016-08-11

Applicant: LG Innotek Co., Ltd.

Inventor： HWANG, Jung Ho ,  LEE, Han Su ,  CHOI, Dae Young ,  KWON, Soon Gyu ,  JEONG, Dong Hun ,  JEONG, In Ho ,  SON, Kil Dong ,  KIM, Sang Hwa ,  LEE, Sang Young ,  JEON, Jae Hoon ,  LEE, Jin Hak ,  BAE, Yun Mi

IPC: H05K3/10

CPC classification number: H05K3/188 ,  H05K1/0298 ,  H05K1/09 ,  H05K3/002 ,  H05K3/108 ,  H05K3/244 ,  H05K2201/0347 ,  H05K2201/098 ,  H05K2203/0548 ,  H05K2203/0588 ,  H05K2203/0723 ,  H05K2203/1184

Abstract: Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first portion formed on the insulating layer and including a corner portion of an upper portion which has a predetermined curvature and a second portion formed on the first portion and configured to cover an upper surface of the first portion including the corner portion.

Abstract translation: 公开了一种印刷电路板和一种制造该印刷电路板的方法。 印刷电路板包括绝缘层和形成在绝缘层上的电路图案，其中电路图案包括第一部分和第二部分，第一部分形成在绝缘层上并且包括具有预定曲率的上部的拐角部分， 形成在所述第一部分上并构造成覆盖包括所述角部的所述第一部分的上表面。

公开(公告)号：EP4040924A1

公开(公告)日：2022-08-10

申请号：EP22157740.6

申请日：2016-08-11

Applicant: LG Innotek Co., Ltd.

Inventor： HWANG, Jung Ho ,  LEE, Han Su ,  CHOI, Dae Young ,  KWON, Soon Gyu ,  JEONG, Dong Hun ,  JEONG, In Ho ,  SON, Kil Dong ,  KIM, Sang Hwa ,  LEE, Sang Young ,  JEON, Jae Hoon ,  LEE, Jin Hak ,  BAE, Yun Mi

IPC: H05K3/10 ,  H05K3/24

Abstract: Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first portion formed on the insulating layer and including a corner portion of an upper portion which has a predetermined curvature and a second portion formed on the first portion and configured to cover an upper surface of the first portion including the corner portion.

公开(公告)号：EP4426077A2

公开(公告)日：2024-09-04

申请号：EP24188063.2

申请日：2015-08-20

Applicant: LG Innotek Co., Ltd.

Inventor： BAE, Yun Mi ,  KWON, Soon Gyu ,  KIM, Sang Hwa ,  LEE, Sang Young ,  LEE, Jin Hak ,  LEE, Han Su ,  JEONG, Dong Hun ,  JEONG, In Ho ,  CHOI, Dae Young ,  HWANG, Jung Ho

IPC: H05K3/24

CPC classification number: H05K3/108 ,  H05K2201/033820130101 ,  H05K2201/09820130101 ,  H05K2201/098920130101 ,  H05K2201/09920130101 ,  H05K2203/118420130101 ,  H05K3/244

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

公开(公告)号：EP3119169A1

公开(公告)日：2017-01-18

申请号：EP15181783.0

申请日：2015-08-20

Applicant: LG Innotek Co., Ltd.

Inventor： BAE, Yun Mi ,  KWON, Soon Gyu ,  KIM, Sang Hwa ,  LEE, Sang Young ,  LEE, Jin Hak ,  LEE, Han Su ,  JEONG, Dong Hun ,  JEONG, In Ho ,  CHOI, Dae Young ,  HWANG, Jung Ho

IPC: H05K3/10 ,  H05K3/24

CPC classification number: H05K1/11 ,  C25D3/38 ,  C25D3/48 ,  C25D5/022 ,  C25D5/48 ,  C25D7/123 ,  H05K1/09 ,  H05K3/108 ,  H05K3/181 ,  H05K3/188 ,  H05K3/244 ,  H05K2201/0338 ,  H05K2201/098 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2203/1184

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract translation: 印刷电路板包括绝缘层，绝缘层上的电路图案以及电路图案上的表面处理层。 表面处理层包括具有比电路图案的顶表面的宽度更宽的宽度的底表面。