摘要:
A communication apparatus (12) includes: a wide-area wireless communicator (46) that transmits and receives information to and from a transport vehicle (4) via a wireless access point (10) through wide-area wireless communication; a short-range wireless communicator (50) that transmits and receives information to and from a communication device (8) through short-range wireless communication having a communication range narrower than a communication range of the wide-area wireless communication; and a controller (54) that converts the information received by the wide-area wireless communicator (46) from wide-area wireless communication information into short-range wireless communication information, and outputs the short-range wireless communication information to the short-range wireless communicator (50), and converts the information received by the short-range wireless communicator (50) from short-range wireless communication information into wide-area wireless communication information, and outputs the wide-area wireless communication information to the wide-area wireless communicator (46).
摘要:
An overhead transport vehicle includes a lifting platform configured to transfer a container, a container contact portion configured to come into contact with a top surface of the container and movably provided along a height direction with respect to the lifting platform, and a height detecting unit configured to detect a relative height position of the container contact portion with respect to the lifting platform. The container contact portion is movably provided along the horizontal direction with respect to the lifting platform.
摘要:
An overhead transport vehicle includes: an article holding unit configured to hold an article; a linear drive unit configured to drive the article holding unit to move linearly; a pivoting drive unit configured to drive the article holding unit to pivot horizontally; and a control unit configured to control the pivoting drive unit in accordance with an orientation of the article held by the article holding unit and an orientation of a load port on which the article is placed.
摘要:
A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.
摘要:
A board conveyance device and conveyance belt inspection method that enable easy detection of a problem with conveyance belts (21F, 21R). The board conveyance device (1) includes: endless conveyance belts (21F, 21R) on which is set a conveyance path (A) for conveying a board (B); a board sensor (22, 23) configured to detect the presence of the board (B) at a specified detection position on the conveyance path (A); and a control section (6) configured to, in a case in which the board (B) is not being conveyed on the conveyance path (A), move the conveyance belts (21F, 21R) and determine a problem with the conveyance belts (21F, 21R) based on a detection result of the board sensor (22,
摘要:
Techniques are provided to improve the quality of the thin films deposited on substrates. A substrate transporting mechanism is configured to transport a plurality of substrates arranged in a line along a transport path extending in a first container from an entrance to an exit, and to load and unload substrates into and out of a second container in order. The driving units to drive the substrate transporting mechanism are configured to be detachable from the substrate transporting mechanism provided in the first container and are respectively provided in a substrate loading chamber and a substrate unloading chamber.
摘要:
A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure