COMMUNICATION APPARATUS, METHOD FOR CONTROLLING COMMUNICATION APPARATUS, AND COMMUNICATION SYSTEM

    公开(公告)号:EP4258722A1

    公开(公告)日:2023-10-11

    申请号:EP21903056.6

    申请日:2021-10-29

    摘要: A communication apparatus (12) includes: a wide-area wireless communicator (46) that transmits and receives information to and from a transport vehicle (4) via a wireless access point (10) through wide-area wireless communication; a short-range wireless communicator (50) that transmits and receives information to and from a communication device (8) through short-range wireless communication having a communication range narrower than a communication range of the wide-area wireless communication; and a controller (54) that converts the information received by the wide-area wireless communicator (46) from wide-area wireless communication information into short-range wireless communication information, and outputs the short-range wireless communication information to the short-range wireless communicator (50), and converts the information received by the short-range wireless communicator (50) from short-range wireless communication information into wide-area wireless communication information, and outputs the wide-area wireless communication information to the wide-area wireless communicator (46).

    OVERHEAD CONVEYING VEHICLE
    2.
    发明公开

    公开(公告)号:EP4230496A1

    公开(公告)日:2023-08-23

    申请号:EP21894290.2

    申请日:2021-09-02

    发明人: KOBAYASHI, Makoto

    IPC分类号: B61B3/02 B65G49/07 H01L21/677

    摘要: An overhead transport vehicle includes a lifting platform configured to transfer a container, a container contact portion configured to come into contact with a top surface of the container and movably provided along a height direction with respect to the lifting platform, and a height detecting unit configured to detect a relative height position of the container contact portion with respect to the lifting platform. The container contact portion is movably provided along the horizontal direction with respect to the lifting platform.

    OVERHEAD CARRIER AND OVERHEAD CARRYING SYSTEM

    公开(公告)号:EP4134289A1

    公开(公告)日:2023-02-15

    申请号:EP21794458.6

    申请日:2021-02-15

    发明人: ITO, Yasuhisa

    摘要: An overhead transport vehicle includes: an article holding unit configured to hold an article; a linear drive unit configured to drive the article holding unit to move linearly; a pivoting drive unit configured to drive the article holding unit to pivot horizontally; and a control unit configured to control the pivoting drive unit in accordance with an orientation of the article held by the article holding unit and an orientation of a load port on which the article is placed.

    SUBSTRATE CONVEYANCE DEVICE AND METHOD FOR INSPECTING CONVEYOR BELT
    8.
    发明公开
    SUBSTRATE CONVEYANCE DEVICE AND METHOD FOR INSPECTING CONVEYOR BELT 审中-公开
    SUBSTRATFÖRDERVORRICHTUNGUND VERFAHREN ZUR INSPEKTION EINESFÖRDERBANDES

    公开(公告)号:EP3190069A4

    公开(公告)日:2017-09-06

    申请号:EP14901377

    申请日:2014-09-04

    申请人: FUJI MACHINE MFG

    发明人: KODAMA TOSHIHIRO

    IPC分类号: B65G43/02 B65G49/07 H05K13/02

    摘要: A board conveyance device and conveyance belt inspection method that enable easy detection of a problem with conveyance belts (21F, 21R). The board conveyance device (1) includes: endless conveyance belts (21F, 21R) on which is set a conveyance path (A) for conveying a board (B); a board sensor (22, 23) configured to detect the presence of the board (B) at a specified detection position on the conveyance path (A); and a control section (6) configured to, in a case in which the board (B) is not being conveyed on the conveyance path (A), move the conveyance belts (21F, 21R) and determine a problem with the conveyance belts (21F, 21R) based on a detection result of the board sensor (22,

    摘要翻译: 一种能够容易地检测输送带(21F,21R)的问题的基板输送装置和输送带检查方法。 基板搬运装置(1)包括:设置用于搬运基板(B)的搬运路径(A)的环形搬运带(21F,21R); 基板传感器(22,23),其构造成检测在所述传送路径(A)上的指定检测位置处的所述基板(B)的存在; 以及控制部(6),其在基板(B)未在输送路径(A)上输送的情况下使输送带(21F,21R)移动并判断输送带 基于所述基板传感器(22,21R,21R)的检测结果,

    SEMICONDUCTOR MANUFACTURING DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR
    9.
    发明公开
    SEMICONDUCTOR MANUFACTURING DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR 审中-公开
    半导体制造装置以及制造半导体的方法

    公开(公告)号:EP3174089A1

    公开(公告)日:2017-05-31

    申请号:EP15824999.5

    申请日:2015-07-08

    摘要: Techniques are provided to improve the quality of the thin films deposited on substrates. A substrate transporting mechanism is configured to transport a plurality of substrates arranged in a line along a transport path extending in a first container from an entrance to an exit, and to load and unload substrates into and out of a second container in order. The driving units to drive the substrate transporting mechanism are configured to be detachable from the substrate transporting mechanism provided in the first container and are respectively provided in a substrate loading chamber and a substrate unloading chamber.

    摘要翻译: 提供技术来改善沉积在基底上的薄膜的质量。 衬底传送机构被构造成沿着在第一容器中延伸的传送路径从入口到出口地布置成一条线的多个衬底传送,并且将衬底依次装入第二容器和从第二容器卸载。 用于驱动基板输送机构的驱动单元被构造成可从设置在第一容器中的基板输送机构拆卸并且分别设置在基板装载室和基板卸载室中。

    MICRO DEVICE TRANSFER HEAD WITH SILICON ELECTRODE
    10.
    发明公开
    MICRO DEVICE TRANSFER HEAD WITH SILICON ELECTRODE 有权
    麻醉药品 - ÜBERTRAGUNGSKOPFMIT EINER SILICIUMELEKTRODE

    公开(公告)号:EP3118894A1

    公开(公告)日:2017-01-18

    申请号:EP16188068.7

    申请日:2013-05-16

    申请人: Apple Inc.

    IPC分类号: H01L21/677 B81C1/00 B65G49/07

    摘要: A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure

    摘要翻译: 描述了从SOI衬底形成微器件传输阵列的微器件转移头阵列和方法。 在一个实施例中,微器件传送头阵列包括基底衬底和在基底衬底上的图案化硅层。 图案化硅层可以包括硅互连和与硅互连电连接的硅电极阵列。 每个硅电极包括突出在硅互连上方的台面结构。 介电层覆盖每个台面结构的顶面