公开(公告)号：EP4055208A1

公开(公告)日：2022-09-14

申请号：EP20800167.7

申请日：2020-11-05

申请人： The Swatch Group Research and Development Ltd

发明人： AGUSTONI, Enzo ,  MOSTEIRO VAZQUEZ, M. Yoann ,  ERDEMLI, M. François

IPC分类号： C23F3/06 ,  B24B1/00 ,  B24B31/06 ,  C23F3/00

公开(公告)号：EP3775076A2

公开(公告)日：2021-02-17

申请号：EP19777843.4

申请日：2019-03-11

申请人： FUJIFILM Electronic Materials U.S.A, Inc.

发明人： LIN, David (TAWEI) ,  HU, Bin ,  WEN, Liqing (RICHARD)

IPC分类号： C09G1/02 ,  C09G1/04 ,  C23F3/00

公开(公告)号：EP1096556B1

公开(公告)日：2017-05-03

申请号：EP99307999

申请日：1999-10-11

申请人： CABOT MICROELECTRONICS CORP

发明人： BRUSIC VLASTA ,  EDELSTEIN DANIEL C ,  FENNEY PAUL M ,  GUTHRIE WILLIAM ,  JASO MARK ,  KAUFMAN FRANK B ,  LUSTIG NAFTALI ,  ROPER PETER ,  RODBELL KENNETH ,  THOMPSON DAVID B

IPC分类号： B24C11/00 ,  H01L21/321 ,  B24B37/00 ,  C09G1/00 ,  C09G1/02 ,  C09K13/00 ,  C09K13/04 ,  C23F3/00

CPC分类号： C09G1/02 ,  C09K13/04 ,  C23F3/00 ,  H01L21/3212

公开(公告)号：EP2280093A1

公开(公告)日：2011-02-02

申请号：EP10185974.2

申请日：1999-09-02

申请人： Praxair S.T. Technology, Inc.

发明人： Joyce, James, Eliott ,  Hunt, Thomas, John ,  Gilman, Paul, Sanford

IPC分类号： C23C14/34 ,  C23F3/00 ,  C23F1/16

CPC分类号： C23C14/3414 ,  C23F1/26 ,  Y10T428/12472 ,  Y10T428/12993 ,  Y10T428/24355

摘要： A method is provided for achieving an enhanced finish on a sputter target surface that results in good film uniformity, low particle counts, and little to no burn-in time. The method involves chemically etching the surface of the sputter target by immersing the surface one or more times in an etching solution, with intermediate rinsing steps. The result is a surface substantially free of mechanical deformation that exhibits a surface similar to a sputtered target with a surface roughness of 10-30 µin.

摘要翻译： 提供了一种用于在溅射靶表面上实现增强的光洁度的方法，其导致良好的膜均匀性，低的颗粒计数，以及很少甚至没有烧蚀时间。 该方法包括通过在中间漂洗步骤中将表面浸入蚀刻溶液中一次或多次来对溅射靶的表面进行化学蚀刻。 结果是基本上没有机械变形的表面，其表面类似于具有10-30μin的表面粗糙度的溅射靶。

公开(公告)号：EP1485440A4

公开(公告)日：2005-11-09

申请号：EP03716012

申请日：2003-02-11

申请人： EKC TECHNOLOGY INC

发明人： SMALL ROBERT J ,  SCOTT BRANDON S

IPC分类号： B24B1/00 ,  B24B37/04 ,  C09G1/02 ,  C09G1/04 ,  C09K3/14 ,  C23F3/00 ,  H01L21/304 ,  H01L21/321

CPC分类号： H01L21/3212 ,  B24B37/044 ,  C03C19/00 ,  C09G1/02 ,  C09K3/1436 ,  C09K3/1445 ,  C09K3/1463 ,  C23F3/00 ,  C23F3/04 ,  G11B5/3163 ,  G11B5/3169 ,  Y02P20/582

摘要： The present invention provides a composition for chemical-mechanical polishing which comprises at least one abrasive particle having a surface at least partially coated by a activator. The activator comprises a metal other than a metal of Group 4(b), Group 5(b) or Group 6(b). The composition further comprises at least one oxidizing agent. The composition is believed to be effective by virtue of the interaction between the activator coated on the surface of the abrasive particles and the oxidizing agent, at the activator surface, to form free radicals. The invention further provides a method that employs the composition in the polishing of a feature or layer, such as a metal film, on a substrate surface. The invention additionally provides a substrate produced this method.

公开(公告)号：EP1586007A2

公开(公告)日：2005-10-19

申请号：EP04702994.7

申请日：2004-01-16

申请人： FEI COMPANY

发明人： Stewart, Diane K. ,  Casey, J. David, Jr. ,  Beaty, John ,  Musil, Christian R. ,  Berger, Steven ,  Sijbrandij, Sybren J.

IPC分类号： G03F9/00 ,  G21K5/10 ,  C23F1/00 ,  C23F1/02 ,  C23F3/00 ,  C03C15/00

CPC分类号： G03F1/74 ,  H01J2237/31744

摘要： Transmissivity is restored to a gallium stained substrate by directing an electron beam to the substrate in the presence of an etching gas. For higher concentration of implanted gallium, the transparency can be substantially restored without reducing the thickness of the substrate. For lower doses of implanted gallium, the transmission is restored to 100% although the thickness of the substrate is reduced. The invention is suitable for use in the repair of photolitography masks.

公开(公告)号：EP1198620A4

公开(公告)日：2004-12-22

申请号：EP00936165

申请日：2000-05-19

申请人： MATTSON TECHNOLOGY IP INC

发明人： VERHAVERBEKE STEVEN

IPC分类号： C23F3/00 ,  C11D3/39 ,  C11D11/00 ,  C23F1/18 ,  H01L21/306 ,  H01L21/3213 ,  B08B3/00 ,  C23C22/63 ,  C23G1/10

CPC分类号： C23F1/18 ,  C11D3/3947 ,  C11D11/0047 ,  H01L21/02052 ,  H01L21/32134

摘要： The present invention provides methods of wet processing electronic components having surfaces containing copper. In the methods of the present invention, copper containing electronic components are contacted with a copper oxidizing solution containing an oxidizing agent, and subsequently contacted with an etching solution. The methods of the present invention are particularly useful for cleaning copper containing components.

摘要翻译： 本发明提供了具有含有铜表面的湿法处理的电子元件的方法。 在本发明的方法中，含有铜的电子元件与在含氧化剂的铜氧化性溶液接触，并在蚀刻溶液随后接触。 本发明的方法可用于清洁铜含有组分是特别有用的。

公开(公告)号：EP1258514A1

公开(公告)日：2002-11-20

申请号：EP02008277.2

申请日：2002-04-22

申请人： ROLLWASCH ITALIANA S.p.A.

发明人： Mamone, Giancarlo

IPC分类号： C09G1/02 ,  C09K3/14 ,  B24B31/14 ,  C23F3/00 ,  B01D21/01 ,  B24B1/00 ,  B24B31/06 ,  H01L21/306

CPC分类号： B24B1/04 ,  B01D21/01 ,  B24B31/06 ,  B24B31/14 ,  C08K3/08 ,  C08K2003/0812 ,  C09K3/1436 ,  C09K3/1454

摘要： A granular abrasive substance for the surface treatment of products in general, which comprises a mixture of polyester and abrasive in powder form with a hardening catalyst. The particularity of the invention is constituted by the fact that it comprises, in the mixture, aluminum in the metallic state and its salts, and a pH regulator.

摘要翻译： 一种用于表面处理产品的颗粒状研磨物质，其通常包括粉末形式的聚酯和磨料与硬化催化剂的混合物。 本发明的特殊性由以下事实构成：在混合物中，其包含金属状态的铝及其盐，以及pH调节剂。

公开(公告)号：EP0844290B1

公开(公告)日：2002-03-13

申请号：EP97309476.6

申请日：1997-11-25

申请人： Cabot Microelectronics Corporation

发明人： Grumbine, Steven K. ,  Streinz, Christopher C. ,  Mueller, Brian L.

IPC分类号： C09G1/02 ,  C23F3/00 ,  H01L21/321

CPC分类号： C23F3/00 ,  C09G1/02 ,  H01L21/3212

公开(公告)号：EP0985059A4

公开(公告)日：2001-05-16

申请号：EP98911675

申请日：1998-03-16

申请人： RODEL INC

发明人： WANG JIUN-FANG ,  SETHURAMAN ANANTHA R ,  COOK LEE MELBOURNE

IPC分类号： C09G1/02 ,  C09K3/14 ,  C23F3/00 ,  H01L21/304 ,  H01L21/321 ,  C23F1/14 ,  H01L21/306

CPC分类号： H01L21/3212 ,  C09G1/02 ,  C09K3/1463 ,  C23F3/00

摘要： An aqueous slurry is provided which is useful for the chemical-mechanical polishing of substrates containing titanium comprising: water, submicron abrasive particles, an oxidizing agent, and a combination of complexing agents comprising a phthalate compound and a compound which is a di- or tri-carboxylic acid with at least one hydroxyl group in an alpha position relative to one of the carboxyl groups.