公开(公告)号：JP2010245126A

公开(公告)日：2010-10-28

申请号：JP2009089487

申请日：2009-04-01

Applicant: Denso Corp ,  株式会社デンソー

Inventor： SUKEGAWA TAKUSHI ,  AKITA NAOYUKI

IPC: H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a both-side simultaneous reflow soldering method that applies a viscous liquid between a substrate and an electronic component so as to simultaneously solder both sides.
SOLUTION: Both-side simultaneous reflow soldering method has steps of applying solder paste to one side of a printed board on which a substrate electrode is formed, turning over the printed board to apply the solder paste to the other side of the printed board on which the substrate electrode is formed, applying the viscous liquid to the other side of the printed substrate where the substrate electrode is not formed and an electronic component is mounted, mounting the electronic component at the other side of the printed board, turning back the printed board to mount the electronic component at one side of the printed board, and annealing both sides of the printed board in a reflow furnace to simultaneously solder both the sides.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种在基板和电子部件之间施加粘性液体以同时焊接两侧的双面同时回流焊接方法。 解决方案：双面同时回流焊接方法具有将焊膏施加到其上形成有基板电极的印刷电路板的一侧的步骤，翻转印刷电路板以将焊膏施加到印刷的另一侧 在其上形成基板电极的基板上，将粘性液体施加到未形成基板电极的印刷基板的另一侧并安装电子部件，将电子部件安装在印刷电路板的另一侧，回转 该印刷电路板将电子部件安装在印刷电路板的一侧，并且在回流炉中对印刷电路板的两侧进行退火以同时焊接两侧。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2005123332A

公开(公告)日：2005-05-12

申请号：JP2003355348

申请日：2003-10-15

Applicant: Denso Corp ,  株式会社デンソー

Inventor： AKITA NAOYUKI ,  KUBOTA KATSUNORI ,  OKOCHI KAZUTAKA

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a circuit board having improved connection reliability of the connecting part and to provide a method of manufacturing the same. SOLUTION: The circuit board 90 is formed of a multilayer substrate 50 in which conductor patterns 12, 22, 32 are arranged in the multilayered form on an insulated substrate 60, and the conductor patterns 12, 22, 32 are conductively connected with interlayer connecting materials 14, 24, 34 and an electronic component 70 connected to a land 12 provided on the substrate surface via a junction material 80. For a first via hole 13 adjacent to the land 12, a second and a third via holes 23, 33 not adjacent to the first via hole 13 are provided by shifting these via holes up to the positions not overlapping with the bonding portion forming location of the land 12 and bonding material 80 in the laminating direction. Since only a first interlayer connecting material 14 within the first via hole 13 exists just under the bonding portion, a stress in the laminating direction working to the bonding portion can be reduced and connection reliability of the bonding portion of the circuit board 90 can be improved. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种具有改进的连接部件的连接可靠性的电路板，并提供其制造方法。 解决方案：电路板90由多层基板50形成，其中导体图案12,22,32以多层形式布置在绝缘基板60上，并且导体图案12,22,32与 层间连接材料14,24,34以及通过连接材料80连接到设置在基板表面上的焊盘12的电子部件70.对于与焊盘12相邻的第一通孔13，具有第二和第三通孔23， 通过将这些通孔移动到与层叠方向上的焊盘12的接合部形成位置和接合材料80不重叠的位置来设置不与第一通孔13相邻的部分33。 由于在第一通孔13内只有第一层间连接材料14位于接合部分的正下方，所以可以降低对接合部分起作用的层叠方向的应力，能够提高电路基板90的接合部的连接可靠性 。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2002344092A

公开(公告)日：2002-11-29

申请号：JP2001148405

申请日：2001-05-17

Applicant: DENSO CORP

Inventor： AKITA NAOYUKI ,  ECHIGO SUSUMU

IPC: H05K1/02 ,  H05K7/14

Abstract: PROBLEM TO BE SOLVED: To provide a printed board, capable of suppressing travel of the shock at the time of fall, etc., to a mounting section for mounting components, without increasing the size of the case for housing the printed board. SOLUTION: An arcuate slit section 21 is formed between a fixing section 2 for fixing a printed board on a case and a wiring section 5, on which mounting components 7, etc., are mounted, and the sections 2 and 5 are connected by a connecting section 22 between the section 21. Accordingly, without having provide to a shock-absorbing member separately from the printed board 1, the shock propagating to the section 2 from the case due to a fall is absorbed by the deformation of the section 22, having rigidity lower than that of the section 2 or 5, and thereby suppressing the propagation of the shock to the section 5.

公开(公告)号：JP2000114315A

公开(公告)日：2000-04-21

申请号：JP27608098

申请日：1998-09-29

Applicant: DENSO CORP

Inventor： AOYAMA MASAYUKI ,  MATSUNAGA YASUAKI ,  AKITA NAOYUKI ,  KONDO KOJI ,  HIRAMATSU TOMOYUKI

IPC: H05K1/18 ,  H01L21/60 ,  H01L23/12 ,  H01L23/498 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To prolong the service lives of solder bumps which bond a BGA(ball grid array) package to a multilayered printed wiring board. SOLUTION: Of outermost peripheral electrodes 3b and 3c in an array-like arrangement, arranged in such a way that the end sections of the electrodes 3b and 3c positioned to the outermost side of the array-like arrangement, are positioned to the outer side of the end sections of outermost peripheral electrodes 1b positioned to the outermost side of the array-like arrangement. More specifically, the surfaces of the electrodes 3b and 3c are made to cross the surfaces of solder bumps 9 at acute angles in the outermost end section of the array-like arrangement. By making a mounting structure for electronic components constructed in this way, the service lives of the solder bumps 9 can be prolonged, because the stresses to the junctions between the electrodes 3b and 3c and solder bumps 9 can be relaxed.