公开(公告)号：JP2004179541A

公开(公告)日：2004-06-24

申请号：JP2002346284

申请日：2002-11-28

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  HATTORI ATSUNORI

IPC: H05K3/34 ,  H05K1/02 ,  H05K3/22 ,  H05K3/38 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a printed board and its forming method with an improvement in the connection reliability of lands to resin film. SOLUTION: The printed board 1 is provided with a land 3 at least on one side of a resin film 2 made of thermoplastic resin. The land 3 is provided with a through hole 4 formed from the surface of the land 3 to the lower surface 3a. The thermoplastic resin, which is the constituting material of the resin film 2, is introduced in the through hole 4 by burying the land 3 in the resin film 2. Since the contact area between the land 3 and the resin film 2 is increased by as much as the through hole 4 is formed, the connection reliability of the land 3 to the resin film 2 can be improved. COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2004153000A

公开(公告)日：2004-05-27

申请号：JP2002316438

申请日：2002-10-30

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI

IPC: H05K3/22 ,  H05K3/38 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed board having a conductor pattern whose surface has high adhesion with a resin film and high connection reliability in soldering, and also to provide a printed board manufactured by the same. SOLUTION: The method of manufacturing the printed board comprises a conductor pattern film 10 preparation process wherein a metal foil pasted to a resin film 1 formed of thermoplastic resin or a prepreg of thermosetting resin is etched to form the conductor pattern 2, a sheet preparation process wherein a sheet 5 is formed which has a difficulty sticking to the resin film 1 and has an opening pattern 5h having a shape reduced in size by a specified ratio with respect to the shape of the conductor pattern 2, a lamination process wherein the sheet 5 is stacked on top of the conductor pattern film 10 with the conductor pattern 2 and the reduced opening pattern 5h opposite to each other, and a conductor pattern forming process wherein the laminate is heated and pressed with a hot pressing plate to embed the conductor pattern 2 in the resin film while deforming the periphery of the conductor pattern 2. COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2004066702A

公开(公告)日：2004-03-04

申请号：JP2002230933

申请日：2002-08-08

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  HASEGAWA KENICHIRO ,  KAJINO HIDETADA ,  TADA KAZUO

IPC: B32B15/08 ,  B29C43/18 ,  B29C65/20 ,  B29K63/00 ,  B29K79/00 ,  B29L9/00 ,  B29L31/34 ,  B32B38/00 ,  H05K3/00 ,  H05K3/38 ,  H05K3/46 ,  B32B31/12

CPC classification number: B29C66/71

Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board prepared by laminating a resin film and a copper foil, which has a high adhesive strength between the resin film and the copper foil so that separation does not occur even if a fine circuit pattern is formed. SOLUTION: A method for sticking the resin film on the copper foil by laminating the resin film 1 and the copper foil 2 comprises a surface treating process wherein the resin film 1 is surface-treated to form cation exchanging groups on the surface, a laminating process wherein the copper foil 2 is laminated on the resin film 1 on which the cation exchanging groups are formed, and an adhering process wherein the laminated resin film 1 and copper foil 2 are heated and pressed by a hot press platen 54 to stick them together. COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2004064009A

公开(公告)日：2004-02-26

申请号：JP2002223642

申请日：2002-07-31

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  YOKOCHI TOMOHIRO ,  NISHIKURA TAKEHIRO ,  MASUDA GENTARO

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method for a printed circuit board that realizes easy separation of the printed circuit board of multilayer structure becoming a product part from the lamination of resin films formed by adhering a plurality of resin films together by a heating/compressing process.
SOLUTION: A plurality of slits 30 are formed so as to surround a product region 60 to be used as a product in each of laminated resin films 23. At this time, the product region 60 is held by an outer frame part via a connection part 31 between slits 30. After the slits are formed, application of heat and compression to a plurality of the resin films 23 laminated adheres the resin films 23 in the heating/compressing process. After the heating/compressing process, the printed circuit board 100 of multilayer structure becoming the product part is obtained by breaking the connection part 31 connecting the product region 60 and the outer frame part.
COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2003304071A

公开(公告)日：2003-10-24

申请号：JP2002106113

申请日：2002-04-09

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  TAKAHASHI KEIGO ,  YOKOCHI TOMOHIRO

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer board which is capable of eliminating air or gas from a gap between the laminated resin films so as to prevent the occurrence of voids in the board. SOLUTION: When a laminate composed of laminated single-sided conductor pattern films 21 is heated and pressed with hot pressing plates 10a and 10b, heat and pressure are applied to the laminate with the pressing plates 10a and 10b each of which has an initial shape that is initially curved toward the laminate and then becomes flat due to elastic deformation. By this setup, the center of the laminate of single-sided conductor pattern films 21 is pressed first, then the compressed part of the laminate starts expanding from its center to peripheral part, so that air left in a gap between single-sided conductor pattern films 21 or gas originated from heated resin is moved to the peripheral part and then discharged out of the laminate. COPYRIGHT: (C)2004,JPO

Abstract translation: 解决的问题：提供一种能够从叠层树脂膜之间的间隙除去空气或气体以防止板中空隙发生的多层板的制造方法。 解决方案：当由层压的单面导体图案膜21构成的层压体被加热并用热压板10a和10b加压时，将热和压力施加到层压板，压板10a和10b分别具有 初始形状最初朝向层压体弯曲，然后由于弹性变形而变得平坦。 通过这种设置，首先压制单面导体图案膜21的层叠体的中心，然后层压体的压缩部分从其中心开始膨胀到周边部分，使得留在单面导体图案 将来自加热树脂的膜21或气体移动到周边部分，然后从层压体排出。 版权所有（C）2004，JPO

公开(公告)号：JP2003060348A

公开(公告)日：2003-02-28

申请号：JP2001335179

申请日：2001-10-31

Applicant: Denso Corp ,  株式会社デンソー

Inventor： KONDO KOJI ,  HARADA TOSHIICHI ,  NAKAMURA KATSUMI ,  KAMIYA TETSUAKI

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a printed board which can simplify a manufacturing process, even if the printed board has an electrode part which connecting mounting components in a surface.
SOLUTION: A one-side conductor pattern film 21 (shown, in Figs. (a) to (c)) where a conductor pattern 22 is formed only in one side of a resin film 23, a via hole 24 is formed and conductive paste 50 is filled, and a one-side conductive pattern film 21a, which is formed in a similar method, of which conductor pattern 22 consists of an electrode part 32 alone, are laminated (shown in Fig. (d)). It is subjected to hot pressing, thereby, a printed board 100, where the electrode part 32 alone is exposed in a surface thereof, is formed without having to form a solder resist layer.
COPYRIGHT: (C)2003,JPO

Abstract translation: 要解决的问题：即使印刷电路板具有将表面上的安装部件连接的电极部件，也可以提供能够简化制造工序的印刷电路板。 解决方案：形成仅在树脂膜23的一侧形成导体图案22的单面导体图案膜21（如图（a）至（c）所示），形成通孔24，并且导电膏 并且以类似的方法形成导体图案22由单独的电极部32组成的单面导电图案膜21a（如图（d）所示）。 对其进行热压，由此形成仅在其表面露出电极部32的印刷电路板100，而不必形成阻焊层。

公开(公告)号：JP2002359470A

公开(公告)日：2002-12-13

申请号：JP2001204024

申请日：2001-07-04

Applicant: DENSO CORP

Inventor： YAZAKI YOSHITARO ,  SHIRAISHI YOSHIHIKO ,  KONDO KOJI ,  HARADA TOSHIICHI ,  YOKOCHI TOMOHIRO

IPC: B29C43/18 ,  B29C43/20 ,  B29K101/10 ,  B29K105/08 ,  B29L9/00 ,  H05K1/09 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a printed board that can prevent deterioration in reliability of interlayer connection, and to provide a method of manufacturing the board. SOLUTION: Conductive paste (not shown), containing tin particles and silver particles is packed in a cylindrical via hole 24 (not shown) made in a resin film 23 formed between conductor patterns 22 using thermoplastic resin; then the conductive paste is heated and pressed from the upper and lower surfaces, so that the volume of the metallic particles in the paste is reduced, when the particles are integrally sintered into a conductive composition 51. When the particles are sintered into the composition 51, the resin film 23 around the via hole 24 is extruded into the hole 24. Consequently, the cross section of the composition 51 turns into arched in both sides, and the side face sections 51a of composition 51 near the junctions 51b with the conductor patterns 22 are formed in inclined states. Therefore, the concentration of stresses can be prevented, when the printed board is deformed.

公开(公告)号：JP2001230513A

公开(公告)日：2001-08-24

申请号：JP2000036571

申请日：2000-02-15

Applicant: DENSO CORP

Inventor： HARADA TOSHIICHI ,  SUZUKI TADAO ,  MATSUNAGA YASUAKI

IPC: H05K3/28 ,  H05K1/18 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To improve bonding reliability to impacts, such as impact of falling and both warp and bending, in bonding wherein an electrode of a surface mount ing component is bonded on a land of a surface part through soldering. SOLUTION: A land 22 of a printed board 11 is formed into an elliptical shape having sufficiently large area to a solder bonding surface 22a, to which a solder ball 13 is bonded. An aperture part 23a arranged on a resist film 23 is formed into a circular shape, where rightward eccentricity is made to the land 22 and a part of the aperture part 23a is protruded from the land 22. As a result, a part of an outer peripheral edge of the land 22 is made an over- resist structure covered with the resist film 23, and the rest is made a nonover- resist structure, where a fine gap S is formed to the resist film 23.

公开(公告)号：JP2015014586A

公开(公告)日：2015-01-22

申请号：JP2013225557

申请日：2013-10-30

Applicant: 株式会社デンソー ,  Denso Corp

Inventor： TANAKA YASUHIRO ,  SAKAIDA ATSUSUKE ,  TANIGUCHI TOSHIHISA ,  GOKO MICHIHISA ,  YAZAKI YOSHITARO ,  SHIRAISHI YOSHIHIKO ,  HARADA TOSHIICHI ,  SHIMIZU MOTONORI ,  SAITO KEITA

IPC: G01N25/20

CPC classification number: G07C5/08 ,  B60R16/023 ,  G01K1/08 ,  G01K17/00 ,  G01K17/08

Abstract: 【課題】使用環境によらず、発熱体の異常を判定できる車両用の異常判定装置を提供する。【解決手段】熱可塑性樹脂からなる絶縁基材の第1、第2ビアホールに金属原子が所定の結晶構造を維持し、かつ互いに異なる金属で構成された第1、第2層間接続部材が埋め込まれ、第1、第2層間接続部材が交互に直列接続された熱流束センサ10と、車両に搭載された発熱体30の異常判定を行う制御部20とを備える。そして、熱流束センサ10を発熱体30に備えて発熱体30と外気との間の熱流束に応じたセンサ信号を出力させ、制御部20に、センサ信号に基づき、発熱体30と外気との間の熱流束が所定の範囲内から外れているとき、発熱体30が異常であると判定させる。【選択図】図6

Abstract translation: 要解决的问题：提供一种用于能够在任何使用环境下确定加热元件的异常的车辆的异常判定装置。解决方案：一种用于车辆的异常判定装置，包括：热通量传感器10，其具有第一和第二层间连接 由金属原子保持规定的晶体结构而形成的相互不同的金属的构件嵌入热塑性绝缘基板的第一和第二通孔中并串联连接; 以及控制单元20，其确定安装在车辆上的加热元件30中的异常。 热量传感器10安装在加热元件30上，并根据加热元件30和外部空气之间的热通量输出传感器信号。 当加热元件30和外部空气之间的热通量超出规定范围时，控制单元20基于传感器信号确定加热元件30具有异常。

公开(公告)号：JP2015014585A

公开(公告)日：2015-01-22

申请号：JP2013220113

申请日：2013-10-23

Applicant: 株式会社デンソー ,  Denso Corp

Inventor： YAZAKI YOSHITARO ,  SHIRAISHI YOSHIHIKO ,  TANAKA YASUHIRO ,  HARADA TOSHIICHI ,  SHIMIZU MOTONORI ,  SAKAIDA ATSUSUKE ,  TANIGUCHI TOSHIHISA ,  GOKO MICHIHISA ,  SAITO KEITA

IPC: G01H1/00

CPC classification number: G01H17/00 ,  G01H1/00 ,  G01K17/00

Abstract: 【課題】設置箇所の形状に関わらずに、検出素子の設置が可能な振動検出器を提供する。【解決手段】振動検出器の構成を、外部からの振動によって変形と摩擦の少なくとも一方が生じることにより熱を発生する発熱部材と、発熱部材からの熱流束を検出する検出素子とを備え、検出素子の検出結果に基づいて、振動に関する情報を検出する構成とする。そして、検出素子として、熱可塑性樹脂からなる絶縁基材100に厚さ方向に貫通する複数の第1、第2ビアホール101、102が形成されていると共に、第1、第2ビアホール101、102に互いに異なる金属で構成された第1、第2層間接続部材130、140が埋め込まれ、第1、第2層間接続部材130、140が交互に直列接続された構造を有し、さらに、第1、第2層間接続部材を形成する金属が、複数の金属原子が当該金属原子の結晶構造を維持した状態で焼結された焼結合金であるものを採用する。【選択図】図3

Abstract translation: 要解决的问题：提供一种实现安装检测元件的振荡检测器，而与安装场所的形状无关。解决方案：一种振动检测器，包括：加热构件，当至少一个变形和摩擦由 从外面振荡; 以及检测来自加热构件的热通量的检测元件，检测器根据检测元件的检测结果检测关于振动的信息。 检测元件具有如下结构：多个第一通孔101和第二通孔102在厚度方向上穿透热塑性绝缘基板100; 并且由相互不同的金属形成的第一和第二层间连接构件130和140嵌入在第一和第二可见孔101和102中并且彼此串联连接。 作为形成第一和第二层间连接构件的金属中的任一种，使用在维持金属原子的每个晶体结构的状态下烧结的具有多个金属原子的烧结合金。