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公开(公告)号:JP5365861B2
公开(公告)日:2013-12-11
申请号:JP2009181198
申请日:2009-08-04
Applicant: Jsr株式会社
IPC: H01L23/373 , C08J5/18
Abstract: PROBLEM TO BE SOLVED: To provide a heat-transfer sheet capable of efficiently conducting heat at high efficiency, and a method capable of easily manufacturing the heat-transfer sheet capable of efficiently conducting heat. SOLUTION: In this heat-transfer sheet where thermally-conductive particles are included in a sheet base body formed of a polymer material in a state oriented in the thickness direction of the sheet base body, the thermally-conductive particle is a composite particle in which at least a part of a surface of a base particle is covered with fine particles having a particle size smaller than that of the base particle. COPYRIGHT: (C)2011,JPO&INPIT
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公开(公告)号:JP5218686B2
公开(公告)日:2013-06-26
申请号:JP2012062305
申请日:2012-03-19
Applicant: Jsr株式会社
IPC: B23K35/363 , B23K1/00 , B23K101/42 , H05K3/34
CPC classification number: B23K35/3612 , B23K35/3613 , B23K35/362 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/11849 , H01L2224/13082 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13118 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/81011 , H01L2224/81024 , H01L2224/81191 , H01L2224/81815 , H01L2224/81911 , H01L2924/15788 , H05K3/3436 , H05K3/3489 , H01L2924/00014 , H01L2924/01082 , H01L2924/01083 , H01L2924/01049 , H01L2924/01051 , H01L2924/0103 , H01L2924/01047 , H01L2924/00
Abstract: A flux composition includes an alditol (A) and a polymer (B) which has a repeating structural unit represented by Formula (1): (wherein R1 is a hydrogen atom or a methyl group, and Z is a hydroxyl group, an oxo group, a carboxyl group, a formyl group, an amino group, a nitro group, a mercapto group, a sulfo group, an oxazoline group, an imide group, a group having an amide structure, or a group having any of these groups). The flux composition allows substrates with bumps such as pillar bumps to be electrically connected to each other by reflowing of such bumps without causing any exposure of the bumps from the flux during reflowing, thus resulting in a satisfactory electrically connected structure.
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公开(公告)号:JP5035240B2
公开(公告)日:2012-09-26
申请号:JP2008512026
申请日:2007-03-16
Applicant: Jsr株式会社
CPC classification number: G03F7/0047 , C08K5/372 , C08L101/12 , H01L21/312
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