公开(公告)号：JP2005333119A

公开(公告)日：2005-12-02

申请号：JP2005116157

申请日：2005-04-13

Applicant: Hitachi Chem Co Ltd ,  日立化成工業株式会社

Inventor： WATANABE ITSUO ,  FUJINAWA MITSUGI ,  ARIFUKU MASAHIRO ,  KANAZAWA TOMOKO ,  KUWANO ATSUSHI

IPC: C09J7/00 ,  C09J5/06 ,  C09J9/02 ,  C09J11/04 ,  C09J201/06 ,  H01B1/22 ,  H01L21/60 ,  H01R11/01 ,  H05K3/32

CPC classification number: H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/83192 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a circuit connection material for the electricity/electronics which is excellent in low-temperature fast curability and has a long pot life in the circuit connection material, a circuit terminal connection structure and a connection method. SOLUTION: An unisotropically conductive circuit connection adhesive-film-material adheres and fixes a semiconductor chip and a substrate by the face down system, and also connects electrically the electrodes of the both. The material has a two-layered structure and consists essentially of components as follows: (1) a curing agent which generates free radicals by heating, (2) a resin containing hydroxy groups of a molecular weight of 10,000 or more, (3) a radically polymerizable substance, and (4) conductive particles. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种电气/电子设备的电路连接材料，其具有优异的低温快速固化性，并且在电路连接材料中具有长的适用期，电路端子连接结构和连接方法。 解决方案：各向异性导电的电路连接粘合剂膜材料通过面朝下系统粘附并固定半导体芯片和基板，并且还电连接两者的电极。 该材料具有两层结构，主要由以下成分组成：（1）通过加热产生自由基的固化剂，（2）含有分子量为10,000以上的羟基的树脂，（3）a 自由基聚合性物质，（4）导电性粒子。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2004292617A

公开(公告)日：2004-10-21

申请号：JP2003086447

申请日：2003-03-26

Applicant: Sekisui Chem Co Ltd ,  積水化学工業株式会社

Inventor： FUKUI KOJI

IPC: C09K3/10 ,  C08K3/34 ,  C08K5/00 ,  C08L43/04 ,  C08L71/00 ,  C08L101/10 ,  C09J11/04 ,  C09J11/06 ,  C09J133/04 ,  C09J163/00 ,  C09J171/00 ,  C09J183/04 ,  C09J201/06 ,  C09J201/10

Abstract: PROBLEM TO BE SOLVED: To obtain a curable composition which comprises a crosslinkable hydrolysable silyl group-having organic polymer capable of being quickly cured with moisture in the atmosphere, is not only quickly cured with the moisture in the atmosphere to give a cured product having excellent elasticity and durability, but also hardly causes a phase separation when stored, and has excellent storage stability and high adhesiveness. SOLUTION: This curable composition is characterized by comprising the organic polymer (a) having at least the crosslinkable hydrolysable silyl groups and an epoxy group-having compound (b). A sealing material comprises the curable composition. An adhesive comprises the curable composition. COPYRIGHT: (C)2005,JPO&NCIPI

公开(公告)号：JP2004277711A

公开(公告)日：2004-10-07

申请号：JP2004019754

申请日：2004-01-28

Applicant: Dainippon Ink & Chem Inc ,  大日本インキ化学工業株式会社

Inventor： TSUNASHIMA KEIJI ,  SHIRAGA JUN ,  OCHI YASUO

IPC: C09J133/00 ,  C09J11/06 ,  C09J133/06 ,  C09J201/06

Abstract: PROBLEM TO BE SOLVED: To obtain a repeelable aqueous pressure-sensitive adhesive composition having excellent pressure-sensitive adhesive properties, capable of being easily peeled from a surface of an adherend, even when allowed to stand for a long time after completion of adhering to the adherend, and capable of exhibiting excellent resistance to whitening by water, even when used in a field in which the resistance to whitening by water is required, and to provide a pressure-sensitive adhesive product.
SOLUTION: The repeelable aqueous pressure-sensitive adhesive composition contains polymer particles [X] which comprise a polymer containing carbonyl and carboxyl groups and having an acid value of 3-30 and have an average particle diameter of ≤300 nm and a hydrazine derivative [Y] which has at least two hydrazino groups in its molecule, wherein a film formed out of the repeelable aqueous pressure-sensitive adhesive composition has a glass transition temperature of ≤-25°C and a gel fraction of ≥80 wt%, and contains a water extract in an amount of ≤2 wt%. The pressure-sensitive adhesive product is composed of the composition and a layer of a base material.
COPYRIGHT: (C)2005,JPO&NCIPI

公开(公告)号：JP3568693B2

公开(公告)日：2004-09-22

申请号：JP20393396

申请日：1996-08-01

Applicant: ダイセル化学工業株式会社

Inventor： 博之 大島 ,  金治 岩崎 ,  聡子 柳田 ,  邦雄 清水

IPC: C09J131/04 ,  C09J11/04 ,  C09J11/06 ,  C09J201/06

公开(公告)号：JP2004186429A

公开(公告)日：2004-07-02

申请号：JP2002351575

申请日：2002-12-03

Applicant: Furukawa Electric Co Ltd:The ,  古河電気工業株式会社

Inventor： AOGAKI TOMOYUKI ,  KANO YOSHIHISA

IPC: C09J7/02 ,  C09J133/00 ,  C09J163/00 ,  C09J201/06 ,  C09J201/08 ,  H01L21/301 ,  H01L21/52

Abstract: PROBLEM TO BE SOLVED: To provide an adhesive tape with satisfactory preservation stability which can be used as a dicing tape at the time of dicing, and as a strong adhesion tape at the time of mounting. SOLUTION: This thermosetting adhesive tape for dicing die bonding for a semiconductor wafer is configured by forming an adhesive layer on at least one face of a substrate so as to be used in a bonding process for fixing or dicing a wafer or the like, and piling up with a lead frame or a semiconductor chip at the time of manufacturing a semiconductor device. In this case, (1) a storage elastic modulus (A) at 23°C of the adhesive of the adhesive layer ranges from 0.05 to 10MPa, (2) a storage elastic modulus (B) at a thermosetting start temperature ranges from 0.005 to 1MPa, and (3) storage elastic modulus (C) after thermosetting is a value which is 10 to 500 times as large as the storage elastic modulus (B). COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：JP2004517973A

公开(公告)日：2004-06-17

申请号：JP2002521553

申请日：2001-08-22

Applicant: ビーエーエスエフ コーティングス アクチェンゲゼルシャフトBASF Coatings AG

Inventor： マイゼンブルク ウーヴェ ,  ヨースト カール−ハインツ ,  バウムガルト フーベルト ,  トボル ペトラ ,  シュヴァルム ラインホルト

IPC: C08L101/02 ,  C08F299/06 ,  C08G18/08 ,  C08G18/28 ,  C08G18/32 ,  C08G18/78 ,  C08G18/81 ,  C09D4/00 ,  C09D5/00 ,  C09D5/02 ,  C09D5/46 ,  C09D161/26 ,  C09D161/28 ,  C09D175/04 ,  C09D175/14 ,  C09D201/06 ,  C09J4/00 ,  C09J4/02 ,  C09J161/26 ,  C09J161/28 ,  C09J175/04 ,  C09J201/06

CPC classification number: C08G18/3212 ,  C08G18/0823 ,  C08G18/284 ,  C08G18/285 ,  C08G18/7837 ,  C08G18/8175 ,  C08G2170/80 ,  C09D175/14

Abstract: 統計学的平均で（ｉ）少なくとも１個の第１カルバメート基および／または第２カルバメート基、（ｉｉ）化学線で活性化しうる結合を少なくとも１個有する少なくとも１個の官能基および（ｉｉｉ）少なくとも１個の分散性のイオン性官能基を有する少なくとも１つのポリマーを含有する新規の水性分散液；その製造法、および熱的におよび化学線で硬化しうる被覆剤、接着剤および封止剤を製造するための該水性分散液の使用ならびにこの新規の水性分散液を含有するかまたは該水性分散液からなる新規の被覆剤、接着剤および封止剤。

公开(公告)号：JP2004161931A

公开(公告)日：2004-06-10

申请号：JP2002330998

申请日：2002-11-14

Applicant: Kanazawa Inst Of Technology ,  学校法人金沢工業大学

Inventor： OGAWA TOSHIO ,  OSAWA SATOSHI

IPC: C09J193/00 ,  C09J201/06

Abstract: PROBLEM TO BE SOLVED: To provide a biodegradable resin emulsion that is capable of freely controlling a biodegradation period and has stable quality, water resitance and good adhesive strength and that is manufactured at a low cost.
SOLUTION: The biodegradable resin emulsion type adhesive is characterized in that it is obtained by having particles of a biodegradable resin and a natural powder material dispersed therein and in that it is a resin wherein the biodegradable resin contains 60 mol% or more of a hydroxyalkanoate unit and the natural powder material is a natural industrial waste.
COPYRIGHT: (C)2004,JPO

Abstract translation: 待解决的问题：提供一种能够自由控制生物降解时间并具有质量稳定性，耐水性和良好的粘合强度并且以低成本制造的生物可降解树脂乳液。 解决方案：生物可降解树脂乳液型粘合剂的特征在于通过将生物降解性树脂和天然粉末材料分散在其中而获得，其中生物可降解树脂含有60摩尔％以上的 羟基链烷酸酯单元和天然粉末材料是天然工业废物。 版权所有（C）2004，JPO

公开(公告)号：JP2004512414A

公开(公告)日：2004-04-22

申请号：JP2002537817

申请日：2001-10-24

Applicant: ヘンケル・コマンディットゲゼルシャフト・アウフ・アクチエンHenkel Kommanditgesellschaft Auf Aktien

Inventor： ヴィルフリート・ヒュープナー ,  ヴォルフガング・クラウク ,  トーマス・バッホン ,  ヘルマン・クルト ,  ヨハン・クライン

IPC: C09K3/10 ,  C08F8/00 ,  C08G71/02 ,  C08G71/04 ,  C08G85/00 ,  C09D183/04 ,  C09D201/06 ,  C09D201/10 ,  C09J183/04 ,  C09J201/06 ,  C09J201/10

CPC classification number: C08G71/04 ,  C08G71/02 ,  Y10T428/249985

Abstract: 本発明は少なくとも１つの尿素基および少なくとも１つのシリル基を有する化合物の製造方法に関する。 該方法によれば、少なくとも１つのアミノ基を有する化合物をカルバメート、すなわち、少なくとも１つのアミノ基を有する化合物または１つのシリル基を有するカルバメートのいずれかと反応させる。 本発明はまた、本方法に従って製造された化合物、かかる化合物の使用、ならびにかかる化合物を含有する表面コーティング製品、シーラント、接着剤、集成フォームおよび絶縁フォームに関する。

公开(公告)号：JP2003231876A

公开(公告)日：2003-08-19

申请号：JP2002033944

申请日：2002-02-12

Applicant: SUMITOMO BAKELITE CO

Inventor： YABUKI KENTARO ,  HOZUMI TAKESHI ,  BABA TAKAYUKI ,  ARAI MASATAKA

IPC: C09J7/00 ,  C09J161/00 ,  C09J163/00 ,  C09J201/00 ,  C09J201/06 ,  H01L21/60

Abstract: PROBLEM TO BE SOLVED: To provide an adhesive film having flux activity and increasing workability in bonding, and to provide a semiconductor package and a semicon ductor device each using the adhesive film. SOLUTION: This adhesive film is applicable to mounting a semiconductor element or a semiconductor device and is characterized by comprising a first resin having one or more phenolic hydroxy, a second resin working as an antioxidant and curable, a third resin and a forth resin having lower weight-average molecular weight than that of the third resin. The semiconductor package is characterized in that the semiconductor element and an interposer are mounted with the adhesive film. The semiconductor device is characterized by that the semiconductor package and a printed circuit board are mounted with the adhesive sheet. COPYRIGHT: (C)2003,JPO

公开(公告)号：JP2003524037A

公开(公告)日：2003-08-12

申请号：JP2001562585

申请日：2001-02-15

IPC: C08J3/24 ,  C08C19/22 ,  C08F8/30 ,  C09J201/06