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公开(公告)号:JP5486092B2
公开(公告)日:2014-05-07
申请号:JP2012542826
申请日:2011-05-23
Applicant: 福田金属箔粉工業株式会社 , 日鍛バルブ株式会社
CPC classification number: F01L3/02 , B22F5/008 , B23K10/027 , B23K35/30 , B23K35/3046 , B23K2201/003 , C22C1/02 , C22C1/0433 , C22C19/00 , C22C19/07 , C23C30/00 , F01L3/04 , F01L2101/00 , F01L2103/00 , F01L2103/01 , F01L2800/18 , F01L2820/01
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公开(公告)号:JP5342603B2
公开(公告)日:2013-11-13
申请号:JP2011114330
申请日:2011-05-23
Applicant: 福田金属箔粉工業株式会社
Abstract: PROBLEM TO BE SOLVED: To provide a copper particulate for a paste for low temperature firing, which can form a dense and low-resistant fired film on a resin substrate, and to provide a method for forming a fired copper film. SOLUTION: In the paste containing copper particulates dispersed therein, which is used when a wiring pattern is applied on the substrate in screen printing and a conductive fired film is formed in a firing step, the copper particulate for the paste for low temperature firing contains 30-70 mass% of a copper particulate having an average particle diameter of 40 nm or less and 70-30 mass% of a copper particulate that has mass at least 100 times or more than that of the copper particulate and an average particle diameter of 200-800 nm. The method for forming the low-resistant fired film on the resin substrate comprises: using the paste which contains the copper particulates for the paste for low temperature firing dispersed therein; and firing the paste at a firing temperature of 250°C or lower in a hydrogen-containing nitrogen gas atmosphere. COPYRIGHT: (C)2013,JPO&INPIT
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86.
公开(公告)号:JP5250388B2
公开(公告)日:2013-07-31
申请号:JP2008281051
申请日:2008-10-31
Applicant: 福田金属箔粉工業株式会社 , 国立大学法人東北大学
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公开(公告)号:JP2013060633A
公开(公告)日:2013-04-04
申请号:JP2011200151
申请日:2011-09-14
Applicant: Fukuda Metal Foil & Powder Co Ltd , 福田金属箔粉工業株式会社 , Ihi Corp , 株式会社Ihi
Inventor: OTOBE KATSUNORI , NAGAI SHOZO , TANOUE TATSURO , TAKAHASHI JUN
Abstract: PROBLEM TO BE SOLVED: To provide an age-hardenable Co-based alloy suitable for surface hardening.SOLUTION: The Co-based alloy for surface hardening is composed of, by mass, 25.0-45.0% Cr, 8.0-35.0% Fe, 1.0-5.0% Si, 0.2-2.0% B, ≤6.0% in total at least one of W and Mo, ≤12.0% Ni, ≤3.0% Cu and Mn, ≤1.0% Al, Ti and Nb, ≤0.2% C, and ≤12.0% in total of Ni, Cu, Mn, Al, Ti, Nb and C, and the balance 30.0-60.0% Co with inevitable impurities.
Abstract translation: 要解决的问题:提供适合于表面硬化的时效硬化的Co基合金。 解决方案:用于表面硬化的Co基合金由以质量计25.0-45.0%Cr,8.0-35.0%Fe,1.0-5.0%Si,0.2-2.0%B,≤6.0%总计组成 W和Mo中的至少一个,≤12.0%的Ni,≤3.0%的Cu和Mn,≤1.0%的Al,Ti和Nb,≤0.2%的C和Ni,Cu,Mn,Al,Ti的总和≤12.0% Nb和C,余量为30.0-60.0%Co与不可避免的杂质。 版权所有(C)2013,JPO&INPIT
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公开(公告)号:JPWO2011048937A1
公开(公告)日:2013-03-07
申请号:JP2011537195
申请日:2010-10-04
Applicant: 国立大学法人京都大学 , 福田金属箔粉工業株式会社
CPC classification number: H05K3/105 , H05K3/1283 , H05K2203/1105 , H05K2203/1157 , H05K2203/125 , H05K2203/1476
Abstract: 【課題】短時間かつ低温処理によって低抵抗な導体膜とその製造方法を提供する。【解決手段】Cu2Oを主成分とする銅系ナノ粒子の高濃度分散液を調製するステップSa1と、前記高濃度分散液を基材上に塗布及び乾燥してCu2Oを主成分とする塗膜を得るステップSa2と、大気圧中で前記塗膜を200℃以下の温度で加熱するステップSa3−1と、還元性雰囲気中で前記塗膜を250℃以下の温度で加熱するステップSa3−2とを備える。【選択図】図1
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90.
公开(公告)号:JP2013045742A
公开(公告)日:2013-03-04
申请号:JP2011184766
申请日:2011-08-26
Applicant: Yokohama Rubber Co Ltd:The , 横浜ゴム株式会社 , Fukuda Metal Foil & Powder Co Ltd , 福田金属箔粉工業株式会社
Inventor: TSUBURAYA KEIKO , ARAKAWA KAZUO , ISHIKAWA KAZUNORI , KAJITA OSAMU , ONISHI TOSHIKI , SUGITANI YUJI
IPC: H01B1/22 , C09C3/00 , H01L31/04 , H01L31/042
CPC classification number: Y02E10/50
Abstract: PROBLEM TO BE SOLVED: To reduce the cost of a conductive composition.SOLUTION: The conductive composition contains conductive particles, a silver salt of an organic acid, and a solvent. The conductive particles are a silver-coated metal powder in which at least part of the surface of a metal powder is coated with silver. The metal powder is a nickel powder or a copper powder and has an average particle diameter of 1.0-20 μm. Fifteen to twenty-five percent by mass of the silver-coated metal powder is the silver coating.
Abstract translation: 要解决的问题:降低导电组合物的成本。 导电组合物含有导电颗粒,有机酸的银盐和溶剂。 导电粒子是银涂层的金属粉末,金属粉末的表面的至少一部分被银涂覆。 金属粉末是镍粉末或铜粉末,平均粒径为1.0〜20μm。 银涂层金属粉末的15〜25质量%是银涂层。 版权所有(C)2013,JPO&INPIT
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