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公开(公告)号：JP5157864B2
公开(公告)日：2013-03-06
申请号：JP2008312790
申请日：2008-12-09
Applicant: 日立電線株式会社
CPC classification number: B32B15/015 , B23K35/002 , B23K35/22 , B23K35/30 , B23K35/3053 , C22C9/00 , C22C9/01 , C22C9/06 , C22C19/00 , C22C19/002 , C22C19/05 , C22C21/00 , C22C21/02 , C22C21/06 , C22C21/10 , C22C21/12 , C22C38/40 , Y10T428/12736 , Y10T428/1275 , Y10T428/12771 , Y10T428/12778 , Y10T428/12861 , Y10T428/12882 , Y10T428/12903 , Y10T428/12917 , Y10T428/31678
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Patent Agency Ranking
公开(公告)号：JP5251849B2
公开(公告)日：2013-07-31
申请号：JP2009271886
申请日：2009-11-30
Applicant: 日立電線株式会社
CPC classification number: H01L24/27 , H01L24/29 , H01L24/73 , H01L2224/16225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2924/01322 , H01L2924/13055 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: PROBLEM TO BE SOLVED: To perform the joining of a semiconductor element and a frame or a substrate by using a material in which lead is not used and to secure high reliability. SOLUTION: As the joining material between the semiconductor element and the frame or the substrate, the joining material based on a clad material in which an Al-based alloy layer 102 is held by a Zn-base alloy layers 101 is used. The Zn-Al alloy 103 exists in the clad material, but the ratio of the Zn-Al alloy 103 is taken as ≤40% of the whole. The average crystal grain size of the Zn-alloy layer 101 is 0.85-50 μm. By performing the joining by using such a clad material, the void ratio in the joined part is suppressed to ≤10%. Further, the wettability between the semiconductor and the frame or the substrate is secured. Thus, the high reliability in the joined part is secured. COPYRIGHT: (C)2011,JPO&INPIT
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公开(公告)号：JP5346607B2
公开(公告)日：2013-11-20
申请号：JP2009023765
申请日：2009-02-04
Applicant: 日立電線株式会社
IPC: H01R4/02 , B23K35/22 , B23K35/26 , B23K35/28 , C22C13/00 , C22C18/00 , C22C18/04 , C22C20/00 , H01B13/00 , H01R4/18
Abstract: PROBLEM TO BE SOLVED: To provide an inexpensive terminal of high connection strength, capable of reducing connection resistance between conductor wires and connection resistance between a conductor and the terminal, and to provide a method of connecting the terminal and an electric wire. SOLUTION: The terminal 1 includes a bonding part 4 for electric connection by bonding to the conductor 3 of the electric wire 2, and a contact part 5 for electric connection by contact with a mating terminal formed integrally with the bonding part 4, the bonding part 4 has a fusible bonding layer 6 molten at a prescribed temperature, on a face bonded to the conductor 3 of the electric wire 2, and has a base material layer 7 not molten at the temperature, on an opposite face of the fusible bonding layer 6, and the fusible bonding layer 6 is compositely integrated preliminarily with the base material layer 7. COPYRIGHT: (C)2010,JPO&INPIT
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