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公开(公告)号:JP5622804B2
公开(公告)日:2014-11-12
申请号:JP2012166823
申请日:2012-07-27
申请人: 株式会社半導体エネルギー研究所
发明人: 恒徳 鈴木 , 恒徳 鈴木 , 野村 亮二 , 亮二 野村 , 幹央 湯川 , 幹央 湯川 , 信晴 大澤 , 信晴 大澤 , 圭恵 森若 , 圭恵 森若 , 良信 浅見 , 良信 浅見 , 岳尚 佐藤 , 岳尚 佐藤
IPC分类号: H01L29/786 , H01L21/336 , H01L27/105 , H01L27/28 , H01L45/00 , H01L49/00 , H01L51/05 , H01L51/50 , H05B33/02 , H05B33/08 , H05B33/22
CPC分类号: H01L27/12 , H01L27/1244 , H01L27/1266 , H01L27/1285 , H01L27/1292 , H01L29/78603
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公开(公告)号:JP5568578B2
公开(公告)日:2014-08-06
申请号:JP2012009572
申请日:2012-01-20
申请人: 株式会社半導体エネルギー研究所
CPC分类号: H05B33/10 , B41J2/04 , B41J2/14201 , B41J2202/09 , H01L51/0005 , H01L51/56
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公开(公告)号:JP5486671B2
公开(公告)日:2014-05-07
申请号:JP2012280731
申请日:2012-12-25
申请人: 株式会社半導体エネルギー研究所
CPC分类号: H01L27/1021
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公开(公告)号:JP5401574B2
公开(公告)日:2014-01-29
申请号:JP2012061508
申请日:2012-03-19
申请人: 株式会社半導体エネルギー研究所
IPC分类号: H01L27/28 , H01L21/8242 , H01L27/10 , H01L27/108 , H01L51/05
CPC分类号: H01L27/1082 , B82Y10/00 , G11C11/34 , G11C13/0014 , G11C2213/79 , H01L23/4828 , H01L27/105 , H01L27/1203 , H01L27/1244 , H01L27/28 , H01L29/458 , H01L29/7869 , H01L2924/0002 , H01L2924/00
摘要: A semiconductor device that can transmit and receive data without contact is popular partly as some railway passes, electronic money cards, and the like; however, it has been a prime task to provide an inexpensive semiconductor device for further popularization. In view of the above current conditions, a semiconductor device of the present invention includes a memory with a simple structure for providing an inexpensive semiconductor device and a manufacturing method thereof. A memory element included in the memory includes a layer containing an organic compound, and a source electrode or a drain electrode of a TFT provided in the memory element portion is used as a conductive layer which forms a bit line of the memory element.
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公开(公告)号:JP5354884B2
公开(公告)日:2013-11-27
申请号:JP2007268777
申请日:2007-10-16
申请人: 株式会社半導体エネルギー研究所
IPC分类号: H01L21/28 , H01L21/02 , H01L21/3205 , H01L21/336 , H01L21/768 , H01L23/522 , H01L27/12 , H01L27/28 , H01L29/786 , H01L41/09 , H01L41/18 , H01L41/193 , H01L51/05 , H01L51/50 , H05B33/26
摘要: PROBLEM TO BE SOLVED: To provide an element structure in which defects are not easily generated, and to provide a semiconductor device having the same. SOLUTION: An element has a structure in which a layer containing an organic compound is interposed between a pair of electrode layers of a first electrode layer and a second electrode layer. At least one of the pair of the electrode layers has a Young's modulus of ≤7.5×10 10 N/m 2 . A layer containing an organic compound is formed using an organic compound appropriate to usage of an element to be formed, and a memory element, a light-emitting element, a piezoelectric element, or an organic transistor element is formed. COPYRIGHT: (C)2008,JPO&INPIT
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公开(公告)号:JP5311712B2
公开(公告)日:2013-10-09
申请号:JP2005376427
申请日:2005-12-27
申请人: 株式会社半導体エネルギー研究所
IPC分类号: C07D209/88 , C09K11/06 , H01L51/50
摘要: PROBLEM TO BE SOLVED: To provide a luminescent substance resistant to repeated oxidation reaction, and to provide a light-emitting element resistant to repeated reductive reaction as well. SOLUTION: The luminescent substance is an anthracene derivative of the general formula(1)( wherein, R 1 is H or a 1-4C alkyl; R 2 is H, a 1-4C alkyl or 6-12C aryl; R 3 is H, a 1-4C alkyl or 6-12C aryl; Ph 1 is phenyl; and X 1 is a 6-15C arylene group ). COPYRIGHT: (C)2007,JPO&INPIT
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公开(公告)号:JP5272092B2
公开(公告)日:2013-08-28
申请号:JP2012093976
申请日:2012-04-17
申请人: 株式会社半導体エネルギー研究所
IPC分类号: H05B33/02 , H01L21/28 , H01L21/3205 , H01L21/336 , H01L21/768 , H01L23/522 , H01L27/10 , H01L27/105 , H01L27/28 , H01L29/786 , H01L29/788 , H01L29/792 , H01L45/00 , H01L49/00 , H01L51/05 , H01L51/50 , H05B33/22
CPC分类号: H01L27/12 , H01L27/1244 , H01L27/1266 , H01L27/1285 , H01L27/1292 , H01L29/78603
摘要: It is an object of the present invention to manufacture, with high yield, semiconductor devices in each of which an element which has a layer containing an organic compound is provided over a flexible substrate. A method for manufacturing a semiconductor device includes: forming a separation layer over a substrate; forming an element-forming layer by forming an inorganic compound layer, a first conductive layer, and a layer containing an organic compound over the separation layer, and forming a second conductive layer which is in contact with the layer containing an organic compound and the inorganic compound layer; and after attaching a first flexible substrate over the second conductive layer, separating the separation layer and the element-forming layer at the separation layer.
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公开(公告)号:JP5230119B2
公开(公告)日:2013-07-10
申请号:JP2007118045
申请日:2007-04-27
申请人: 株式会社半導体エネルギー研究所
IPC分类号: H01L27/10 , H01L29/786 , H01L51/05
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公开(公告)号:JP5008323B2
公开(公告)日:2012-08-22
申请号:JP2006074366
申请日:2006-03-17
申请人: 株式会社半導体エネルギー研究所
IPC分类号: H01L51/05 , G06K19/07 , G06K19/077 , H01L21/3205 , H01L21/768 , H01L23/532 , H01L27/10 , H01L27/28 , H01L29/786
CPC分类号: H01L2924/0002 , H01L2924/00
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