Abstract:
PROBLEM TO BE SOLVED: To provide prepregs, laminates, printed wiring board structures and materials and printed wiring boards that make it possible to construct printed wiring boards with improved thermal properties. SOLUTION: In one embodiment, prepregs 124 include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs 124 have substrate materials that include carbon. In other embodiments, the prepregs 124 include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates 120 and 122 that can act as ground and/or power planes. COPYRIGHT: (C)2009,JPO&INPIT