公开(公告)号：JP2004111701A

公开(公告)日：2004-04-08

申请号：JP2002273113

申请日：2002-09-19

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  MASUDA GENTARO ,  UEHARA TOSHIHISA ,  TOBARI OSAMU

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board which improves adhesive properties of plating to an inner wall of a through hole and durable reliability.
SOLUTION: In the printed wiring board in which a resin film and a conductor pattern 22 are alternatively laminated, a hole 25 is formed in the resin film at a position on an outer periphery of a through hole forming region, a conductive member 51 is provided in the hole 25 so that the member 51 is formed as a part of the inner wall of a through hole 41. The member 51 couples a conductor pattern 22a surrounding the hole 41. Accordingly, a through hole plating 43 plated in the hole 41 connects the pattern 22a and the member 51 and thereby a structure in which the plating 43 is reinforced is provided.
COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2014003000A

公开(公告)日：2014-01-09

申请号：JP2012230105

申请日：2012-10-17

Applicant: Denso Corp ,  株式会社デンソー

Inventor： OTA KOJI ,  MAEDA MANABU ,  SAAI YASUHIRO ,  KONDO KOJI ,  MASUDA GENTARO ,  KAJINO HIDETADA ,  SHIRAISHI YOSHIHIKO

IPC: H05B3/20 ,  B60H1/22

CPC classification number: H05B3/0042 ,  B60H1/2215 ,  H05B3/06 ,  H05B3/26 ,  H05B3/267 ,  H05B2203/002 ,  H05B2203/003 ,  H05B2203/005 ,  H05B2203/007 ,  H05B2203/013 ,  H05B2203/014 ,  H05B2203/032

Abstract: PROBLEM TO BE SOLVED: To inhibit the temperature rise of a portion contacting with an object.SOLUTION: A radiant heater device 1 comprises: multiple heat radiation parts 3; and multiple heating parts 4. The heat radiation parts 3 are formed into thin plates. The multiple heat radiation parts 3 are placed being dispersed. A low heat conduction part 6 is provided between the adjacent two heat radiation parts 3. Each lower heat conduction part 6 is provided mainly by a resin material forming a substrate part 2. Each low heat conduction part 6 encloses an entire periphery of the heat radiation part 3, thereby thermally separating the multiple heat radiation parts 3 from each other. The heat radiation parts 3 radiate radiation heat by heat generated by the heat generation parts 4. When an object contacts with a surface of the device 1, heat of a specific heat radiation part 3 located immediately below the object is radiated to the object. Further, the low heat conduction part 6 inhibits heat from being transmitted from a periphery of the specific heat radiation part 3 to the specific heat radiation part 3. Thus, the temperature rise is inhibited in a portion of the radiant heater device which contacts with the object.

Abstract translation: 要解决的问题：抑制与物体接触的部分的温度升高。解决方案：辐射加热器装置1包括：多个散热部分3; 和多个加热部件4.散热部件3形成为薄板。 放置多个散热部3。 在相邻的两个散热部件3之间设置有低导热部分6.每个下部热传导部分6主要由形成基板部分2的树脂材料提供。每个低导热部分6包围热辐射部分的整个周边 从而将多个散热部分3彼此热分离。 散热部件3通过发热部件4产生的热而辐射辐射热。当物体与设备1的表面接触时，将位于物体正下方的特定散热部件3的热辐射到物体上。 此外，低热传导部6阻止热从特定散热部3的周边向特定的散热部3透射。因此，在与辐射加热装置的接触的部分中，温度上升被抑制 目的。

公开(公告)号：JP2003347748A

公开(公告)日：2003-12-05

申请号：JP2002158041

申请日：2002-05-30

Applicant: Denso Corp ,  株式会社デンソー

Inventor： KONDO KOJI ,  KATAOKA RYOHEI ,  MASUDA GENTARO

IPC: H05K1/02 ,  H01L23/12 ,  H01L23/498 ,  H05K3/10 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4632 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0394 ,  H05K2201/09881 ,  Y10T29/49165 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To secure a sufficient current capacity with respect to a conductor pattern energized with a high current while forming the conductor pattern by using a thin conductor foil in a multilayer wiring board. SOLUTION: Along a conductor pattern 22a required to conduct a high current, a groove 24a is formed in a resin film 23 adjoining the conductor pattern 22a, and conductive paste 50 is filled in the groove 24a. Then, the conductive paste 50 is sintered by heating and pressurizing, and a conductive composition 50 integrated with the conductor pattern 22a is formed. Thereby, a sufficient current capacity can be secured with respect to the conductor pattern 22a that is required to be energized with a large current while using thin conductor foil as the conductor foil for forming the conductor pattern 22a. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：通过在多层布线板中使用薄导体箔形成导体图案，确保相对于以高电流通电的导体图案的足够的电流容量。 解决方案：沿着导电高电流所需的导体图案22a，在邻接导体图案22a的树脂膜23中形成凹槽24a，并且导电膏50填充在凹槽24a中。 然后，通过加热加压烧结导电浆料50，形成与导体图案22a一体化的导电组合物50。 由此，可以使用薄导体箔作为形成导体图案22a的导体箔，相对于需要用大电流通电的导体图案22a确保足够的电流容量。 版权所有（C）2004，JPO

公开(公告)号：JP2012227553A

公开(公告)日：2012-11-15

申请号：JP2012178213

申请日：2012-08-10

Applicant: Denso Corp ,  株式会社デンソー

Inventor： TADA KAZUO ,  YAZAKI YOSHITARO ,  MASUDA GENTARO ,  MIYAGAWA EIJIRO ,  TANAKA YASUHIRO

IPC: H05K3/46 ,  H01L23/12 ,  H01L23/14

Abstract: PROBLEM TO BE SOLVED: To retrain deterioration of reliability of interlayer connection in a thermoplastic resin film layer.SOLUTION: An intermediate layer film 110 and a pair of adhesion layer films 120, 130 are formed in a thermoplastic resin film, and a pair of patter layer films 21, 31 are formed using a low fluidity resin film with fluidity lower than that of the thermoplastic resin film. A pair of adhesion layer films are overlaid on both faces of the intermediate layer film so that second interlayer connecting conductive pastes 124, 134 are opposed on both faces of a first interlayer connecting conductive paste 113. A pair of pattern layer films are overlaid on a pair of adhesion layer films to constituted a laminate, so that conductor patterns 211b, 311b of a pair of pattern layer films are opposed on the second interlayer connecting conductor pastes on faces of a pair of adhesion layer films on the side not opposed to the intermediate layer film. Thereafter, the laminate is heat-pressed.

Abstract translation: 要解决的问题：为了重新制备热塑性树脂膜层中的层间连接的可靠性的劣化。 解决方案：在热塑性树脂膜中形成中间层膜110和一对粘附层膜120,130，并且使用低流动性树脂膜形成一对图案膜21,31。 热塑性树脂膜。 一层粘附层膜覆盖在中间层膜的两个表面上，使得第二层间连接导电膏124,134在第一层间连接导电浆料113的两个表面上相对。一对图案层膜覆盖在 一对粘合层膜构成层压体，使得一对图案层膜的导体图案211b，311b在第二层间连接导体上相对地粘贴在不与中间层相对的一侧上的一对粘附层膜的表面上 层膜。 之后，对该层叠体进行热压。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2008172030A

公开(公告)日：2008-07-24

申请号：JP2007003924

申请日：2007-01-11

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  KONDO KOJI ,  MASUDA GENTARO ,  YAZAKI YOSHITARO

IPC: H05K3/46 ,  H05K3/00

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer circuit board which can cause less deformation in a conductor pattern or less mutual positional displacement therein, and can suppress an increase in the resistance of a conductive material for interlayer connection, with a high reliability.
SOLUTION: When a laminate 20 of n resin films 10a to 10g is viewed from a compressing direction by thermal pressing plates 80, and when a conductor presence rate (%) as a rate of overlap between conductor patterns 2 of layers is defined as (m/n)×100 (m: the number of overlapped layers of the conductor patterns 2 at an arbitrary position, or an integer from 0 to n); such a pressing pressure correcting sheet 40 having a projection 42 formed thereon is prepared to be associated with a low conductor presence rate region 30 having a conductor presence rate smaller than the maximum conductor presence rate of the laminate 20 in a pressing plane, the sheet 40 is positioned so that the projection 42 is opposed to the low conductor presence rate region 30, and compression is carried out with the pressing pressure correcting sheet 40 disposed between the thermal pressing plate 80 and the laminate 20.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 解决的问题：为了提供一种能够导致导体图案的变形少或相互位移偏移小的多层电路板的制造方法，能够抑制层间连接用导电材料的电阻的增加， 具有高可靠性。 解决方案：当通过热压板80从压缩方向观察n个树脂膜10a至10g的层压体20时，并且当定义作为层的导体图案2之间的重叠率的导体存在率（％）时 作为（m / n）×100（m：任意位置的导体图案2的重叠层数，或0〜n的整数）。 准备具有形成在其上的突起42的这种压力校正片40与导体存在率低于层压体20在压制平面中的最大导体存在率的低导体存在率区域30相关联，片材40 定位成使得突出部42与低导体存在率区域30相对，并且压力校正片40设置在热压板80和层压体20之间进行压缩。（C） 2008年，日本特许厅和INPIT

公开(公告)号：JP2003037363A

公开(公告)日：2003-02-07

申请号：JP2001224958

申请日：2001-07-25

Applicant: Denso Corp ,  株式会社デンソー

Inventor： KONDO KOJI ,  MASUDA GENTARO ,  HATTORI YOSHIO

IPC: H05K3/40 ,  H05K3/00 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a simplified method of manufacturing an element board for a multilayer board, a multilayer board manufactured by the use of the element board, and an element board for a multilayer board. SOLUTION: This manufacturing method comprises a conductor pattern forming process S1 of enabling the conductor foil of a rolled single-sided conductor foil film 11 equipped with a thermoplastic resin film layer film to undergo pattern etching, a via hole forming process S2 of forming bottomed via holes, a filling process S3 of filling the bottomed via holes with conductive paste, and a hot press process S4 of sintering metal particles contained in the conductive paste so as to solidify the conductive paste. A single-sided conductor pattern film 21 composed of linked element boards for forming multilayer boards is taken up into a roll. When the multilayer board is manufactured, the single-sided conductor pattern film 21 is cut out into the element boards, and the element boards are laminated and pressed as heated.

Abstract translation: 要解决的问题：提供一种制造用于多层板的元件板的简化方法，使用元件板制造的多层板和用于多层板的元件板。 解决方案：该制造方法包括导体图案形成工艺S1，其能够使配备有热塑性树脂膜层的轧制单面导体箔膜11的导体箔经历图案蚀刻，形成底部通孔的通孔形成工艺S2 用导电浆料填充有底通孔的填充工序S3以及烧结包含在导电浆料中的金属颗粒的热压工艺S4，以使导电膏固化。 由用于形成多层板的连接元件板构成的单面导体图案膜21被卷取成卷。 当制造多层板时，将单面导体图案膜21切割成元件板，并且元件板被加热层压和压制。

公开(公告)号：JP2013065810A

公开(公告)日：2013-04-11

申请号：JP2012048300

申请日：2012-03-05

Applicant: Denso Corp ,  株式会社デンソー

Inventor： MASUDA GENTARO ,  KONDO KOJI ,  KONDO KENJI ,  KAJINO HIDETADA

IPC: H05K3/46 ,  H01L23/12

CPC classification number: H05K3/4626 ,  H05K1/186 ,  H05K3/4069 ,  H05K2201/0195 ,  H05K2201/09781 ,  H05K2203/061

Abstract: PROBLEM TO BE SOLVED: To restrict deterioration in the reliability of connections between an electronic component 2 and a conductive pattern 121 on a multilayer substrate 10 on which the electronic component 2 is mounted.SOLUTION: In a multilayer substrate formed by hot-pressing a laminate 10a composed of second resin films 13 using thermoplastic resin as film backing and first resin films 12 using thermosetting resin as film backing and having conductive patterns 121 formed on one side thereof which are alternately laminated one on another, and a base film 11 on which an electronic component 2 is mounted, the base film 11 has terminal connection through holes 111 formed therein for connecting the conductive patterns 121 and electrode terminals 2a of the electronic component 2, and a component mounting part 101 overlapping the electronic component 2 when viewed from the laminated direction of the laminate 10a is composed in such a way that the number of conductive patterns 121 in the laminated direction is greater in overlapping parts 101a which overlap the terminal connection through holes 111 than in non-overlapping parts 101b which do not overlap the terminal connection through holes 111.

Abstract translation: 要解决的问题：为了限制安装有电子部件2的多层基板10上的电子部件2与导电图案121之间的连接的可靠性的劣化。 解决方案：在通过使用热塑性树脂作为膜背衬热压由第二树脂膜13构成的层压体10a和使用热固性树脂作为膜背衬的第一树脂膜12形成的多层基板中，并且在其一侧上形成导电图案121 它们彼此交替层叠，并且其上安装有电子部件2的基膜11，基膜11具有形成在其中的用于连接电子部件2的导电图案121和电极端子2a的端子连接通孔111， 并且当从层压体10a的层叠方向观察时，与电子部件2重叠的部件安装部101构成为使得层叠方向上的导电图案121的数量比与端子连接通过的重叠部分101a重叠 孔111比不与端子连接通孔111重叠的非重叠部分101b 右：（C）2013，JPO＆INPIT

公开(公告)号：JP2003086948A

公开(公告)日：2003-03-20

申请号：JP2001333021

申请日：2001-10-30

Applicant: DENSO CORP

Inventor： KONDO KOJI ,  HARADA TOSHIICHI ,  KAMIYA TETSUAKI ,  ONODA RYUICHI ,  KAMIYA YASUTAKA ,  MASUDA GENTARO ,  YAZAKI YOSHITARO ,  YOKOCHI TOMOHIRO

IPC: H05K3/28 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer substrate having electrodes on both surfaces capable of reducing a manufacturing cost without complicating a processing step. SOLUTION: The method for manufacturing the multilayer substrate comprises the steps of laminating a one-side conductor pattern film 21 (Figs. (a) to (c)) in which a conductor pattern 22 is formed only on one side surface of a resin film 23, a via hole 24 is formed and a conductive paste 50 is charged and a one-side conductor pattern film 31 in which a conductor pattern 22 is formed only on one side surface of the film 23, and the film 23 is perforated and removed so as to expose an electrode 23, laminating a cover layer 36 which is perforated to expose an electrode 37 on a lowermost layer (Fig. (d)), and hot pressing the laminate to thereby manufacture the multilayer substrate 100 having the electrodes on both of the surfaces.

公开(公告)号：JP2001210998A

公开(公告)日：2001-08-03

申请号：JP2000017810

申请日：2000-01-21

Applicant: DENSO CORP

Inventor： TAKAGAKI TAKASHIGE ,  KONDO KOJI ,  MASUDA GENTARO

IPC: H05K13/04

Abstract: PROBLEM TO BE SOLVED: To provide a method for preventing a flexible substrate from being curled and a reinforcing board which can surely fix the substrate and easily separate from an adhesive and is applicable to the other substrate, when the substrate reinforced by placing the reinforcing board with the adhesive is mounted on an electronic part and then the substrate is separated from the reinforcing board. SOLUTION: An adhesive 2 is placed on the whole surface of the reinforcing board 3. Although the adhesive 2 may be densely placed on the whole surface of the reinforcing board 3, it may be placed in stripes with gaps or in many uniformly distributed islands. In the adhesive 2 in stripes with gaps, the magnitude of adhesive force can be adjusted by the gaps. When the substrate 1 is separated from the reinforcing board 3, a small metal wire is inserted like a wedge between the substrate 1 and the adhesive 2 on the reinforcing board 3 and is moved along the surface of the reinforcing board 3, whereby the substrate 1 can be separated without being excessively bent.

公开(公告)号：JP2014000944A

公开(公告)日：2014-01-09

申请号：JP2012230103

申请日：2012-10-17

Applicant: Denso Corp ,  株式会社デンソー

Inventor： OTA KOJI ,  MAEDA MANABU ,  SAAI YASUHIRO ,  KONDO KOJI ,  MASUDA GENTARO ,  KAJINO HIDETADA ,  SHIRAISHI YOSHIHIKO

IPC: B60H1/22

CPC classification number: H05B3/0042 ,  B60H1/2215 ,  H05B3/06 ,  H05B3/26 ,  H05B3/267 ,  H05B2203/002 ,  H05B2203/003 ,  H05B2203/005 ,  H05B2203/007 ,  H05B2203/013 ,  H05B2203/014 ,  H05B2203/032

Abstract: PROBLEM TO BE SOLVED: To suppress a rise in temperature of a part which comes into contact with a body.SOLUTION: A radiation heater device 1 includes a plurality of heat radiation parts 3 and a plurality of heat generation parts. A heat radiation part 3 is formed in a thin plate shape. The plurality of heat radiation parts 3 are dispersedly arranged. A low heat conduction part 6 is provided between two adjacent heat radiation parts 3. The low heat conduction part 6 is provided using a resin material mainly forming a substrate part 2. The low heat conduction part 6 surrounds the entire periphery of the heat radiation parts 3 to thermally separate the plurality of heat radiation parts 3 from one another. The heat radiation parts 3 radiate heat generated by the heat generation parts 4. When a body comes into contact with a surface of the device 1, heat of a specific heat radiation part 3 right below the body is radiated to the body. Further, the low heat conduction part 6 suppress heat transfer from a periphery of the specific heat radiation part 3 to the specific heat radiation part 3. Consequently, a rise in temperature of a part in contact with the body is suppressed.

Abstract translation: 要解决的问题：抑制与身体接触的部位的温度上升。解决方案：辐射加热器装置1包括多个散热部分3和多个发热部分。 散热部3形成为薄板状。 多个散热部3分散配置。 在两个相邻的散热部件3之间设置有低导热部分6.低导热部分6使用主要形成基板部分2的树脂材料设置。低导热部分6围绕散热部分的整个周边 3以将多个散热部分3彼此热分离。 散热部3散发由发热部4产生的热量。当身体与装置1的表面接触时，身体正下方的比热辐射部3的热量散发到身体。 此外，低热传导部6抑制从特定放热部3的周边向特定的散热部3的热传递。因此，抑制与身体接触的部分的温度上升。