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公开(公告)号：JP2008265182A
公开(公告)日：2008-11-06
申请号：JP2007112754
申请日：2007-04-23
Applicant: Denso Corp , 株式会社デンソー
Inventor： NOMOTO KAORU , KONDO KOJI
Abstract: PROBLEM TO BE SOLVED: To provide a resin film with a metal foil in which the adhesive strength of the metal foil and the resin film is enhanced.
SOLUTION: The resin film with the metal foil 1 is constituted by affixing the metal foil 3 in which one face and the other face are formed as shiny faces respectively and the resin film 2 formed of a thermoplastic resin. Thereby, the adhesive area of the metal foil 3 and the resin film 2 is increased, and the adhesive strength of the metal foil 3 and the resin film 2 can be enhanced.
COPYRIGHT: (C)2009,JPO&INPITAbstract translation: 要解决的问题：为了提供具有金属箔的树脂膜，其中金属箔和树脂膜的粘合强度增强。 解决方案：具有金属箔1的树脂膜通过将分别形成有一个面和另一个面的金属箔3分别固定在由热塑性树脂形成的树脂膜2上而构成。 由此，金属箔3和树脂膜2的粘合面积增大，能够提高金属箔3和树脂膜2的粘合强度。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2000277875A
公开(公告)日：2000-10-06
申请号：JP8428299
申请日：1999-03-26
Applicant: MITSUBISHI PLASTICS IND , DENSO CORP
Inventor： YAMADA SHINGETSU , TAKAGI JUN , TANIGUCHI KOICHIRO , NOMOTO KAORU , IWAMA HIROYASU
Abstract: PROBLEM TO BE SOLVED: To obtain a smooth surface wiring board having a satisfactory heat resistance, chemical resistance and electrical characteristics at a possibly lower heating temperature of less than 250 deg.C. SOLUTION: A film-like insulator 1 is composed of a thermoplastic resin composition of a temperature rising glass transition temperature of 150-230 deg.C containing a polyaryl ketone resin having a crystal melting peak temperature of 260 deg.C or higher, and an amorphous polyether imide resin, a conductor foil 2 is laminated on the insulator 1 and thermally bonded, so that the thermoplastic resin composition meets the relation between a crystal melting heat quantity ΔHm and the crystallizing heat quantity ΔHc shown by Equation I, conductor circuits 2' are formed, smooth flat plates 7 are laid on the obtained printed wiring board 6 surface and hot pressure bonded, so that an insulation layer 1' satisfies the relation shown by Equation II so that both the insulating layer 1' surface and the conductor circuit 2' surface are at the same height and form a smooth surface. Eq. I: ((ΔHm-ΔHc)/ΔHm) =0.7.
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公开(公告)号：JP2000200950A
公开(公告)日：2000-07-18
申请号：JP53899
申请日：1999-01-05
Applicant: MITSUBISHI PLASTICS IND , DENSO CORP
Inventor： YAMADA SHINGETSU , TAKAGI JUN , TANIGUCHI KOICHIRO , KUWAMURA SHINGO , NOMOTO KAORU
IPC: H05K1/03 , B29C65/44 , B29K73/00 , B29K79/00 , B29L9/00 , B29L31/34 , B32B15/08 , C08L71/10 , C08L73/00 , C08L79/08 , H05K3/00 , H05K3/38
Abstract: PROBLEM TO BE SOLVED: To provide a flexible wiring board and manufacture thereof using a thermoplastic insulation layer and having a conductor foil, such as Cu foil, surely thermally welding to a filmy insulation layer into one body and a solder heat resistance. SOLUTION: A molding material, i.e., a thermoplastic resin compsn. composed of a polyarylketone resin having a crystal melting peak temp. of 260 deg.C or higher 65-35 wt.%, and an amorphous polyetherimide resin 35-65 wt.% is formed into a filmy insulator so as to satisfy the relation (ΔHm-ΔHc)/ΔHmm =0.7 and then is etched to form a conductive circuit.
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公开(公告)号：JP2006049502A
公开(公告)日：2006-02-16
申请号：JP2004227007
申请日：2004-08-03
Applicant: Denso Corp , 株式会社デンソー
Inventor： HARADA TOSHIICHI , KONDO KOJI , NOMOTO KAORU , KONDO KENJI
IPC: H05K3/46
Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer substrate which can elongate the number of times of using a buffer member and can improve an operating rate.
SOLUTION: The method of manufacturing the multilayer substrate 100 includes a laminating step of laminating a resin film 11 made of a thermoplastic resin and a conductor pattern 12 to form a laminate 20; and a heating and pressurizing step of heating and pressurizing the laminate 20 by a hot press plate 50 from both upper and lower surfaces, in the state that the buffer member 50 arranged between the laminate 20 and the hot press plate 50 for reducing the pressure difference to be applied to the respective parts of the laminate 20 from the hot press plate 50 is interposed between the front surface of the laminate 20 and the hot press plate 50. The individual buffer members 60 are prepared according to the disposition of the conductor pattern 12 to the resin film 11. In the heating and pressurizing step, in the state that the laminate 20 and the buffer member 60 corresponding to the conductor pattern 12 of the laminate 20 are positioned, the laminate 20 is heated and pressurized by the hot press plate 50.
COPYRIGHT: (C)2006,JPO&NCIPIAbstract translation: 要解决的问题：提供一种可以延长使用缓冲构件的次数并可以提高工作速率的多层基板的制造方法。 解决方案：制造多层基板100的方法包括层压由热塑性树脂制成的树脂膜11和导体图案12以形成层压体20的层压步骤; 以及在层叠体20和热压板50之间设置的缓冲部件50，用于降低压力差的状态下，通过热压板50从上下表面对叠层体20进行加热加压的加热加压工序 从层压体20的前表面和热压板50之间插入层压体20的各部分，由热压板50构成。各个缓冲部件60根据导体图案12的配置 在加热和加压步骤中，在层压体20和对应于层压体20的导体图案12的缓冲构件60定位的状态下，层压体20被热压板加热和加压 50.版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2004146540A
公开(公告)日：2004-05-20
申请号：JP2002308979
申请日：2002-10-23
Applicant: Denso Corp , 株式会社デンソー
Inventor： NOMOTO KAORU , TAKIGUCHI MASAYUKI
Abstract: PROBLEM TO BE SOLVED: To provide a connection type circuit substrate and the manufacturing method thereof capable of improving the relative positional accuracy of two sheets of circuit substrates and rigidly fixing both of the circuit substrates.
SOLUTION: The first circuit substrate 1 and the second circuit substrate 2 are fixed to an auxiliary plate 3 by an adhesive agent 4 whereby an adhering area is remarkably enlarged, compared with a case wherein the circuit substrates are bonded at the side ends thereof.
COPYRIGHT: (C)2004,JPO-
Patent Agency Ranking
公开(公告)号：JP2001060755A
公开(公告)日：2001-03-06
申请号：JP26260599
申请日：1999-09-16
Applicant: DENSO CORP
Inventor： ECHIGO SUSUMU , NOMOTO KAORU , AOYAMA MASAYUKI , SUZUKI TADAO
Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board which can be improved in both thermal shock resisting characteristic and drop impact resisting characteristic. SOLUTION: In a printed wiring board, at least one of a solder resist layer 13, first resist layer L1R, first insulating layer L1i, solder resist layer 17, sixth resist layer L6R, and sixth insulating layer L6i is formed by using a resin material, having a tensile breaking strain of 1% or higher at a strain rate of 40%/sec at 25 deg.C and Izod impact strength of 1.0 kgf.cm/cm or higher at 25 deg.C. Alternatively, a material containing a resin material having 0.05 or higher peak dynamic loss tangent value caused at a temperature between -100 deg.C and -50 deg.C by β-relaxation in dynamic viscoelasticity measurement and 0.02 or higher peak dynamic loss tangent value caused at a temperature between 0 deg.C and 100 deg.C by β'-relxation in a similar measurement at a rate of 80 wt.% or higher, preferably, 90 wt.% or higher is used.
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公开(公告)号：JP2001015897A
公开(公告)日：2001-01-19
申请号：JP18601499
申请日：1999-06-30
Applicant: MITSUBISHI PLASTICS IND , DENSO CORP
Inventor： YAMADA SHINGETSU , TAKAGI JUN , TANIGUCHI KOICHIRO , NOMOTO KAORU , MIYAKE TOSHIHIRO , TAKAGAKI TAKASHIGE
Abstract: PROBLEM TO BE SOLVED: To provide a coverlay film which is used for protecting a conductor circuit provided in a printed wiring board, excellent in thermal resistance, high in adhesion to a printed wiring board at a low heating temperature of 260 deg.C or below, effectively bonded to the printed wiring board at a low temperature in a short time, and excellent in insulating properties. SOLUTION: A coverlay film for protecting a conductor circuit provided in a printed wiring board is formed of thermoplastic resin composition which contains 65 to 35 wt.% polyarylketone resin and 35 to 65 wt.% amorphous polyether imide resin, the glass transition temperature of the thermoplastic resin composition measured through a differential scanning calorimetry at a rise in temperature is 150 to 230 deg.C, and the characteristics of the resin composition are so set as to satisfy a formula, [(ΔHm-ΔHc)/ΔHm]
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公开(公告)号：JP2004241195A
公开(公告)日：2004-08-26
申请号：JP2003027280
申请日：2003-02-04
Applicant: Denso Corp , 株式会社デンソー
Inventor： NOMOTO KAORU
IPC: F21S8/10 , F21W101/10 , F21Y101/00 , H01J61/54 , H05B41/24
Abstract: PROBLEM TO BE SOLVED: To provide a head lamp device for a vehicle, in which lowering of discharge start voltage is realized without degrading the instantaneous lighting, and small size and light weight and low cost of the stabilizer and low cost of the gas arc tube by lowering the filling gas pressure are realized. SOLUTION: A filament 15 is arranged inside or in the vicinity of the gas arc tube 1 in which a pair of main electrode terminals are sealed and this filament 15 is made to emit light for a short time from the start of lighting. COPYRIGHT: (C)2004,JPO&NCIPI
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公开(公告)号：JP2003068134A
公开(公告)日：2003-03-07
申请号：JP2002166636
申请日：2002-06-07
Applicant: Denso Corp , 株式会社デンソー
Inventor： YAMAGUCHI HIRONAO , NOMOTO KAORU , TAKIGUCHI MASAYUKI , YONEIMA KENJI
IPC: F21V29/00 , B60Q1/00 , F21S8/10 , F21S8/12 , F21V7/16 , F21V13/00 , F21V14/04 , F21W101/10 , F21Y101/00
CPC classification number: B60Q1/007 , B60Q1/0088 , F21S41/196 , F21S43/50
Abstract: PROBLEM TO BE SOLVED: To provide a headlamp of vehicle 1 capable of restraining internal temperature rise of a lighting circuit part by exposing part of the light circuit part 8 fixed to a reflector 3 to cool it by the outside air while keeping the inside of a lamp housing 2 airtight regardless of the attitude of the reflector 3.
SOLUTION: This vehicular headlamp comprises: an opening part 2b opened in the housing 2 on the side facing to the lighting control circuit 8 for exposing an end face 81a of the control circuit 8 to the outside, and a diaphragm 9 formed into a nearly annular shape with a material having flexibility, having its outer circumferential side firmly fixed to the entire circumferential edge of the opening part 2b and having its inner circumferential side firmly fixed to or pressingly brought into contact with the outer circumferential side of the end of the end face 81a. Thereby, while always keeping the airtightness inside the lamp housing 2, the end face 81a of a case 81 of the control circuit 8 fixed to the reflector 3 is cooled by the outside air to restrain the internal temperature rise of the control circuit 8, so that thermal load on circuit elements can be reduced.
COPYRIGHT: (C)2003,JPOAbstract translation: 要解决的问题：提供一种车辆1的前照灯，其能够通过使固定在反射器3上的部分光电路部分8露出来来限制照明电路部分的内部温度上升，同时保持内部的温度 灯壳2与反光体3的姿态无关。解决方案：该车辆前照灯包括：开口部分2b，其在壳体2的面对照明控制电路8的一侧开口，用于暴露控制电路8的端面81a 以及形成为具有柔性的材料的近似环状的隔膜9，其外周侧牢固地固定在开口部2b的整个周缘上，并且其内周侧牢固地固定或压入 与端面81a的端部的外周侧接触。 由此，在将灯壳体2保持气密的同时，固定在反射体3上的控制电路8的壳体81的端面81a被外部空气冷却，以抑制控制电路8的内部温度升高 可以减少电路元件的热负荷。
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公开(公告)号：JP2002271028A
公开(公告)日：2002-09-20
申请号：JP2001069607
申请日：2001-03-13
Applicant: DENSO CORP , MITSUBISHI PLASTICS IND
Inventor： NOMOTO KAORU , NAKAZAWA SHUSAKU , KONDO KOJI , NIDAN AKIRA , YAMADA SHINGETSU , TANIGUCHI KOICHIRO
Abstract: PROBLEM TO BE SOLVED: To efficiently manufacture a coil-incorporated multi-layered resin board which has a relatively large-sized coil. SOLUTION: A coil-incorporated multi-layered resin 29 is formed by laminating insulating resin layers 36 alternately with coil patterns 37 and uniting them together by heating and pressing them, and the coil patterns 37 of respective layers are electrically connected by a via hole conductor 38 formed penetrating the respective insulating resin layers 36. Each insulating resin layer 36 is formed of mixed resin of 65 to 35 wt.% polyaryl ketone resin of >=260 deg.C in crystal fusion peak temperature and 35 to 65 wt.% polyether imide as a crystallized delay polymer. The coil patterns 37 are formed by a subtractive method. The via hole conductor 38 is formed by charging conductor paste in the via hole 39 formed in the insulating resin layers 36 by screen printing.
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