公开(公告)号：JP2012166425A

公开(公告)日：2012-09-06

申请号：JP2011028466

申请日：2011-02-14

Applicant: Denso Corp ,  株式会社デンソー

Inventor： TERA AKINOSUKE ,  YAMAOKA TADASHI ,  ARAI TAKESHI ,  AKITA NAOYUKI ,  ASAI YASUTOMI

IPC: B29C33/02 ,  B29C33/38 ,  B29C33/58

Abstract: PROBLEM TO BE SOLVED: To provide a molding apparatus capable of irradiating with plasma a mold surface while closing the mold.SOLUTION: The apparatus includes a mold 10 where a molten material is sent in and plasma electrodes 12, 13 to generate plasma; wherein plasma irradiation holes 101a, 102a are provided to the mold 10 for irradiating an interior space 11 of the mold 10 with plasma generated by the plasma electrodes 12, 13, the plasma irradiation holes 101a, 102a may has pin holes 101a, 102a for inserting release pins 12, 13 and the plasma electrodes may include the release pins 12, 13.

Abstract translation: 要解决的问题：提供一种能够在关闭模具的同时照射等离子体模具表面的成型设备。 解决方案：该装置包括：模具10，其中熔融材料被送入和等离子体电极12,13以产生等离子体; 其中等离子体照射孔101a，102a设置在模具10中，用于用等离子体电极12,13产生的等离子体照射模具10的内部空间11，等离子体照射孔101a，102a可以具有用于插入的针孔101a，102a 释放销12,13，等离子体电极可以包括释放销12,13。版权所有：（C）2012，JPO＆INPIT

公开(公告)号：JP2012056289A

公开(公告)日：2012-03-22

申请号：JP2010204596

申请日：2010-09-13

Applicant: Denso Corp ,  株式会社デンソー

Inventor： KOIKE HARUHISA ,  SAITO TAKASHIGE ,  TOYODA INEO ,  ARAI TAKESHI ,  YAMAOKA TADASHI ,  NIIOBI AKIRA

IPC: B29C45/14 ,  B29C45/02

Abstract: PROBLEM TO BE SOLVED: To get rid of a fear of flowing-out of a resin in a molding mold from a filling space where the resin is filled to a non-filling space where the resin is not filled, and to prevent excessive pressure from applying on an insert component during closing the mold.SOLUTION: The lower mold 10 and upper mold 20 are closed so that the respective partition walls 12 and 22 enclose the boundary between the mold part 40a and the non-mold part 40b of the insert component 40, and the molten thermoplastic resin is filled from a gate 30 to the filling spaces 14 and 24. The filled thermoplastic resin is cooled and stiffened by cooling sources 70 and 70. The thermoplastic resin which may flow out from the filling spaces 14 and 24 through a clearance between the partition walls 12 and 22 and the insert component 40 to the non-filling spaces 15 and 25 is cooled and stiffened by letting a coolant 50 flow in the flow passages 13 and 23 formed inside at the tip ends of the partition walls 12 and 22.

Abstract translation: 要解决的问题：为了避免模塑中的树脂从填充空间填充树脂未填充树脂的填充空间中流出的担心，并且防止 在关闭模具期间施加在插入部件上的过大的压力。 解决方案：下模具10和上模具20被关闭，使得相应的隔壁12和22包围模具部件40a和插入部件40的非模制部件40b之间的边界，并且熔融热塑性树脂 从浇口30填充到填充空间14和24中。填充的热塑性树脂被冷却源70和70冷却并加强。热​​塑性树脂可以通过间隔壁之间的间隙从填充空间14和24流出 如图12和图22所示，插入部件40到非填充空间15和25通过使冷却剂50流入形成在分隔壁12和22的末端内部的流动通道13和23中来冷却和加强。

版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2014054753A

公开(公告)日：2014-03-27

申请号：JP2012200223

申请日：2012-09-12

Applicant: Denso Corp ,  株式会社デンソー

Inventor： YAMAOKA TADASHI ,  ARAI TAKESHI ,  KUSANO TAKESHI

IPC: B29C33/12 ,  B29C45/14

CPC classification number: B29C45/14549 ,  B29C45/14467 ,  B29C45/14639 ,  B29C45/73 ,  B29C45/7646 ,  B29C2045/14934 ,  B29C2945/7604 ,  B29C2945/7626 ,  B29C2945/76381 ,  B29C2945/76538 ,  B29C2945/76859 ,  B29C2945/76933 ,  B29C2945/76946

Abstract: PROBLEM TO BE SOLVED: To provide a die for insert-forming capable of reducing a load on a wire cable.SOLUTION: A die for insert-forming 1 comprises: a first space 100 for filling a resin around a conductor 4 of a wire cable 3 and a covering part 5; a second space 200 which has a cross-sectional area smaller than that of the first space 100 and fills a resin around the covering part 5; and support parts 30 and 31 for supporting the covering part 5. The resin is prevented from being leaked out from a gap between the support parts 30 and 31 and the wire cable 3 by setting the cross-sectional area and length of the second space 200 so that a molten resin 8 is stopped to flow in the middle of the second space 200. Thus, a pressing force of the support parts to the wire cable can be reduced.

Abstract translation: 要解决的问题：提供一种用于插入成型的模具，其能够减少线缆上的负载。解决方案：用于插入成型的模具1包括：第一空间100，用于将线缆的导体4周围填充树脂 3和覆盖部分5; 第二空间200，其横截面积小于第一空间100的横截面面积，并且填充覆盖部分5周围的树脂; 以及用于支撑覆盖部分5的支撑部分30和31.通过设定第二空间200的横截面积和长度，防止树脂从支撑部分30和31与线缆3之间的间隙泄漏 使得熔融树脂8停止在第二空间200的中间流动。因此，可以减少支撑部分对线缆的挤压力。

公开(公告)号：JP2013212666A

公开(公告)日：2013-10-17

申请号：JP2012085001

申请日：2012-04-03

Applicant: Denso Corp ,  株式会社デンソー

Inventor： YAMAOKA TADASHI ,  ARAI TAKESHI ,  GOTO MASAMI ,  KOIKE HARUHISA ,  SAITO TAKASHIGE

IPC: B29C45/14 ,  B29C45/73

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a resin molded product which suppresses the form of an insertion article being specified while suppressing the generation of burr, and the damage being generated in the insertion article.SOLUTION: A method for manufacturing a resin molded product includes a preparation process for preparing a mold having a cavity (43), a communication hole (44) and an injection hole (45), an arrangement process for arranging a part of an insertion member to the cavity by arranging the insertion member (20) to the communication hole, and an injection process for injecting a melted mold resin (30) from the injection hole into the cavity after the arrangement process. In the arrangement process, a gap which communicates the cavity and the exterior is constituted between the wall face of the mold constituting the communication hole and the insertion member. In the injection process, a control medium (CM) whose temperature is lower than that of the mold during the injection process and whose pressure is higher than the atmospheric pressure is injected into the cavity through the gap until the cavity is filled with the melted mold resin.

Abstract translation: 要解决的问题：提供一种制造树脂成型体的方法，其抑制了产生毛刺的特定的插入物的形状，以及在插入物中产生的损伤。解决方案：树脂的制造方法 模制产品包括用于制备具有空腔（43），连通孔（44）和注射孔（45）的模具的制备方法，用于通过布置插入构件将插入构件的一部分布置到空腔的布置方法 （20）连接到所述连通孔，以及用于在所述布置处理之后将熔融的模制树脂（30）从所述注射孔注入到所述腔中的注射过程。 在该配置处理中，在构成连通孔的模具的壁面与插入部件之间构成空腔与外部连通的间隙。 在注射过程中，在注射过程中温度低于模具并且其压力高于大气压力的控制介质（CM）通过间隙注入空腔中，直到空腔中充满熔化的模具 树脂。

公开(公告)号：JP2013008919A

公开(公告)日：2013-01-10

申请号：JP2011141930

申请日：2011-06-27

Applicant: Denso Corp ,  株式会社デンソー

Inventor： YAMAOKA TADASHI ,  ARAI TAKESHI ,  AKITA NAOYUKI ,  ASAI YASUTOMI

IPC: H01L21/56 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L23/3135 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To increase the bonding strength of a coating film to a circuit component for suppressing the occurrence of separation between layers and a crack in a package.SOLUTION: A method for manufacturing a package into which a circuit component (20) is integrally sealed with a mold resin (40) comprises: a coating step where at least one part of the surface of the circuit component (20) opposed to the mold resin (40) is covered with a coating film (30) for suppressing the separation from the mold resin (40); and a molding step where the mold resin (40) is shaped, whereby the circuit component (20) covered with the coating film (30) is integrally sealed. In the coating step, a coating material (31) for forming the coating film (30) is exposed to plasma (33) and brought into its active condition before deposition on the surface of the circuit component (20), and then deposited on the surface of the circuit component (20) in an active condition.

Abstract translation: 要解决的问题：为了提高涂膜与电路部件的接合强度，以抑制层间的分离发生和包装中的裂纹。 解决方案：一种用于制造电路部件（20）与模制树脂（40）一体密封的封装的方法包括：涂覆步骤，其中所述电路部件（20）的表面的至少一部分相对 模塑树脂（40）被覆盖有用于抑制与模制树脂（40）分离的涂膜（30）。 以及模塑树脂（40）成形的成型步骤，由涂覆膜（30）覆盖的电路部件（20）被一体地密封。 在涂布步骤中，用于形成涂膜（30）的涂料（31）暴露于等离子体（33）中并在沉积到电路部件（20）的表面之前进入其活性状态，然后沉积在 处于活动状态的电路部件（20）的表面。 版权所有（C）2013，JPO＆INPIT