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公开(公告)号：JP2015026737A
公开(公告)日：2015-02-05
申请号：JP2013155899
申请日：2013-07-26
Applicant: 株式会社デンソー , Denso Corp
Inventor： TAKAGITA HIRONORI , ASAI YASUTOMI
IPC: H01L23/36
CPC classification number: H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014
Abstract: 【課題】半導体装置1において剥離の発生を生じ難くする。【解決手段】半導体装置1は、半導体素子10、リードフレーム20、リードフレーム20に対して半導体素子10の反対側に配置されている絶縁シート30と、ヒートシンク40とを備える。絶縁シート30は、リードフレーム20に接合されている導電層31と、ヒートシンク40に接合されている導電層32と、導電層31、32の間に配置されて導電層31、32のそれぞれに接合されている絶縁層33とを備える。これにより、リードフレーム20および導電層31の間には、電位差が生じない。このため、リードフレーム20および導電層31の間には、電気化学反応が生じない。ヒートシンク40および導電層32の間には、電位差が生じない。このため、ヒートシンク40および導電層32の間には、電気化学反応が生じない。【選択図】図1
Abstract translation: 要解决的问题：阻止在半导体器件1处发生剥离。解决方案：半导体器件1包括半导体元件10，引线框20，绝缘片30，其相对于半导体元件10设置在与半导体元件10相对的一侧 引线框架20和散热器40.绝缘片30包括连接到引线框架20的导电层31，连接到散热器40的导电层32和设置在导电层31,32之间的绝缘层33 并且被连接到每个导电层31,32。因此，引线框架20和导电层31之间不会发生电位差。因此，在引线框架20和导电层31之间不发生电化学反应。没有电位 发生在散热器40和导电层32之间。因此在散热器40和导电层32之间不发生电化学反应。
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公开(公告)号：JP2014090103A
公开(公告)日：2014-05-15
申请号：JP2012239723
申请日：2012-10-31
Applicant: Denso Corp , 株式会社デンソー , Sanken Electric Co Ltd , サンケン電気株式会社
Inventor： HANDA NORIMASA , SAKAI KOHEI , ASAI YASUTOMI , YOSHIZAKI SHIGEO , TANAKA ATSUHIKO
CPC classification number: H01L2924/0002 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To appropriately prevent a short-circuit between islands adjacent each other, in a molded package in which a plurality of the islands disposed to be apart from each other in plain on an insulating sheet are sealed with a mold resin.SOLUTION: A molded package includes: an insulating sheet 10 in which a one face 10a side is formed of a resin layer 11 comprising an electrically insulating resin; a plurality of islands 20 mounted to be apart from each other in plane on the one face 10a of the insulating sheet 10; an electronic component 30 mounted on one face 21 of each of the islands 20; and a mold resin 70 sealing the one face 10a of the insulating sheet 10, the islands 20 and the electronic components 30. The resin layer 11 has a thermal conductivity greater than that of the mold resin 70. A portion located between side faces 23 of the islands 20 adjacent each other in the one face 10a of the insulating sheet 10 constitutes a projecting part 13 rising while being in contact with both side faces 23.
Abstract translation: 要解决的问题：为了适当地防止彼此相邻的岛之间的短路，在其中通过模制树脂密封在绝缘片上彼此分开设置成彼此平行的多个岛的模制包装中。 ：成型封装包括：绝缘片10，其中一个面10a侧由包含电绝缘树脂的树脂层11形成; 安装在绝缘片10的一个面10a上彼此分开的多个岛20; 安装在每个岛20的一个面21上的电子部件30; 以及模制树脂70，其密封绝缘片10的一个面10a，岛20和电子部件30.树脂层11的导热率大于模制树脂70的导热率。位于 在绝缘片10的一个面10a中彼此相邻的岛20构成在与两个侧面23接触的同时上升的突出部13。
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公开(公告)号：JP2009164564A
公开(公告)日：2009-07-23
申请号：JP2008201839
申请日：2008-08-05
Applicant: Denso Corp , 株式会社デンソー
Inventor： YAMAGISHI TETSUTO , NOMURA TORU , IMAIZUMI NORIHISA , ASAI YASUTOMI
CPC classification number: H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/15321 , H01L2924/181 , H01L2924/1815 , H01L2924/19015 , H01L2924/19107 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To reduce stress on a substrate due to a molding resin applied from one surface side of a ceramic substrate in a molding step, in an electronic device composed by loading a first electronic component on one surface of the ceramic substrate and a second electronic component on the other surface, attaching a metal plate having function of heat radiation or the like to the other surface of the ceramic substrate, and half molding them. SOLUTION: The first electronic component 20 is loaded on one surface side of the ceramic substrate 10, the second electronic component 30 is loaded on the other surface of the ceramic substrate 10, the second electronic component 30 is sealed with the molding resin 80, and the metal plate 50 is attached to a part other than the part where the second electronic component 30 is positioned of the other surface of the ceramic substrate 10 through an adhesive 40. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：为了减少由于在模制步骤中从陶瓷基板的一个表面侧施加的模塑树脂而导致的基板上的应力，在通过在陶瓷的一个表面上装载第一电子部件而构成的电子装置中 衬底和另一表面上的第二电子部件，将具有热辐射等功能的金属板附着到陶瓷衬底的另一个表面上，并将其半成型。 解决方案：将第一电子部件20装载在陶瓷基板10的一个表面侧，将第二电子部件30装载在陶瓷基板10的另一个面上，将第二电子部件30用模制树脂 80，并且金属板50通过粘合剂40附接到除了第二电子部件30位于陶瓷基板10的另一表面的部分之外的部分。版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2008305944A
公开(公告)日：2008-12-18
申请号：JP2007151282
申请日：2007-06-07
Applicant: Denso Corp , 株式会社デンソー
Inventor： NAKAMURA TOSHIHIRO , OTANI YUJI , ISHINO HIROSHI , ASAI YASUTOMI
Abstract: PROBLEM TO BE SOLVED: To improve the folding-proof strength of the whole of a substrate without altering the constituting materials of the substrate, in a ceramic laminating wiring substrate wherein a plurality of ceramic layers are laminated.
SOLUTION: In the ceramic laminating wiring substrate including the one in whose inside a plurality of ceramic layers made of ceramics 11-13 are laminated and a wiring 16 is provided in each of the ceramic layers 11-13, the thicknesses of the most outer layers 11, 13 positioned in the most outer sides of the respective ceramic layers 11-13 are made larger than the ones of the layers 12 positioned in the more inner sides than the most outer layers 11, 13.
COPYRIGHT: (C)2009,JPO&INPITAbstract translation: 要解决的问题：在层叠多个陶瓷层的陶瓷层叠布线基板中，为了提高基板整体的抗折强度而不改变基板的构成材料。 解决方案：在陶瓷层叠布线基板中，包括其内部由陶瓷11-13制成的多个陶瓷层内部的陶瓷层叠布线基板，并且在每个陶瓷层11-13中设置布线16， 位于相应陶瓷层11-13的最外侧的大多数外层11,13被制成比位于比最外层11,13更内侧的层12更大。版权所有： （C）2009，JPO＆INPIT
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公开(公告)号：JP2008016818A
公开(公告)日：2008-01-24
申请号：JP2007097453
申请日：2007-04-03
Applicant: Denso Corp , 株式会社デンソー
Inventor： ASAI YASUTOMI , ISHINO HIROSHI
CPC classification number: H01L24/40 , H01L21/6835 , H01L24/32 , H01L24/33 , H01L24/41 , H01L24/48 , H01L24/83 , H01L2224/03003 , H01L2224/03013 , H01L2224/05124 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0603 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/40091 , H01L2224/40225 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/48491 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/15787 , H01L2924/181 , H01L2924/3511 , H01L2924/00 , H01L2924/01026 , H01L2924/01028 , H01L2924/3512 , H01L2224/45099 , H01L2924/00012 , H01L2224/37099
Abstract: PROBLEM TO BE SOLVED: To actualize manufacturing of a semiconductor device in a simple process and miniatuarizing of the semiconductor device, where the semiconductor device is composed so as to electrically take out each electrode of a semiconductor element having electrodes on the both of back and forth surfaces to the outside. SOLUTION: A semiconductor element 10 is a power element having electrodes 13 to 15 on a back surface 12 and a forth surface 11, and metal layers 21, 22 are connected to the back surface 12 and the forth surface 11 of the semiconductor element 10. This makes the electrodes 13 to 15 on the back surface 12 and the forth surface 11 be electrically connected to the metal layers 21, 22 placed on respective surfaces, and allows the electrodes 13 to 15 to be connected to the outside through the metal layers 21, 22. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation: 要解决的问题：为了实现半导体器件的制造和半导体器件的微型化，其中半导体器件被组成以电取出具有两个电极的电极的半导体元件的每个电极 前后表面到外面。 解决方案：半导体元件10是在后表面12和第四表面11上具有电极13至15的功率元件，并且金属层21,22连接到半导体的背表面12和第四表面11 这使得后表面12和第四表面11上的电极13至15电连接到放置在各个表面上的金属层21,22，并且允许电极13至15通过 金属层21,22。（C）2008，JPO＆INPIT
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Patent Agency Ranking
公开(公告)号：JP2006069062A
公开(公告)日：2006-03-16
申请号：JP2004255715
申请日：2004-09-02
Applicant: Denso Corp , 株式会社デンソー
Inventor： OKA KENGO , ASAI YASUTOMI , OTANI YUJI
Abstract: PROBLEM TO BE SOLVED: To properly control the warpage of an alumina laminated substrate obtained by baking a laminate in which at least two alumina sheets are laminated. SOLUTION: In a method for producing the alumina laminated substrate 10 by firing the laminate 20 in which a plurality of the alumina sheets 11, 12, 13. and 14 formed by a doctor blade method are laminated, in a process for laminating the layers of the alumina sheets 11-14, the molding directions Y of the alumina sheets 11-14 are made to meet at right angles among the alumina sheets 11-14 in the lamination so that the contraction of the laminate 20 is suppressed. The directions of the surfaces A and backs B of the alumina sheets 11-14 during molding are changed among the alumina sheets 11-14 in the lamination so that the warpage of the laminate 20 is suppressed. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题：为了适当地控制通过烘焙其中层压有至少两个氧化铝片的层压体而获得的氧化铝层压基板的翘曲。 解决方案：在通过烧结层压体20制造氧化铝层叠基板10的方法中，层叠有多个通过刮刀方法形成的氧化铝片11,12,13和14的叠层体， 氧化铝片材11-14的层，氧化铝片材11-14的成型方向Y在层压体中使氧化铝片材11-14之间成直角相交，从而抑制层压体20的收缩。 在层叠时，氧化铝片11-14的成型中的氧化铝片11-14的表面A和背面B的方向发生变化，从而能够抑制层叠体20的翘曲。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2009224674A
公开(公告)日：2009-10-01
申请号：JP2008069462
申请日：2008-03-18
Applicant: Denso Corp , 株式会社デンソー
Inventor： YAMAKAWA HIROYUKI , ASAI YASUTOMI , KOBAYASHI WATARU , SUZUKI TOSHIO
CPC classification number: H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2924/13091 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: PROBLEM TO BE SOLVED: To simplify the process to form a plurality of island portions by dividing a plate-like raw material when manufacturing an electronic apparatus which is constituted by exposing the other sides of each island portion from a mold resin, while sealing with the mold resin the plurality of island portions on one plane of which the components are mounted. SOLUTION: Components 21-23 are mounted in portions corresponding to each island portion 10 among one plate side of the plate-like raw material 100, continuously, while the one plate side of the plate-like raw material 100 is sealed with a mold resin 30 together with the components 21-23, the other plate side of the plate-like raw material 100 is exposed from the mold resin 30, in the other plate side of the plate-like raw material 100, an insulating film 200 having an identical plane pattern with the arrangement pattern of each island portion 10 is formed, then, making the insulating film 200 as a mask, the plate-like raw material 100 is divided into the plurality of island portions 10 by etching from the other plane side of the plate-like raw material 100 up to the mold resin 30. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 解决的问题：为了简化通过在制造通过从模制树脂暴露每个岛部的另一侧而构成的电子设备时分割板状原料而形成多个岛部的工序，同时 在模具树脂的一个平面上安装有多个岛部的多个岛部分密封。 解决方案：组件21-23在板状原料100的一个板侧中的每个岛部10对应的部分中连续地安装，同时板状原料100的一个板侧用 模具树脂30与部件21-23一起，板状原料100的另一个板侧从模制树脂30暴露在板状原料100的另一个板侧，绝缘膜200 形成具有与各岛部10的排列图案相同的平面图案，然后，将绝缘膜200作为掩模，将板状原料100从另一方面进行蚀刻而分割为多个岛状部10 板状原料100的一侧直到模制树脂30.版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP2009149046A
公开(公告)日：2009-07-09
申请号：JP2008075585
申请日：2008-03-24
Applicant: Denso Corp , 株式会社デンソー
Inventor： SAGAWA HARUHIDE , KOBAYASHI WATARU , NAKAMURA TOSHIHIRO , ISHINO HIROSHI , OTANI YUJI , IMADA SHINJI , ASAI YASUTOMI
Abstract: PROBLEM TO BE SOLVED: To reduce poor dividing by making the application of a maximum bending stress to the end section of an aimed dividing groove easier in a manufacturing method of a board for manufacturing individualized boards by dividing the board by the dividing grooves.
SOLUTION: On one board face 101 of the board 100, a plurality of dividing grooves 10 which extend in X direction are formed in a manner to be arranged in Y direction which is orthogonal to X direction. Then, on both end sections which are separated in Y direction on the one board face 101 of the board 100, an area being closer to the end section being pushed up by a pin 220 from both end sections further in X direction is depressed by a depressing member 210. Under this state, the pushing up by the pin 220 is performed from the other board face 102 side of the board 100.
COPYRIGHT: (C)2009,JPO&INPITAbstract translation: 要解决的问题：为了通过将基板划分为分隔槽，在制造单独板的制造方法中，通过在目标分割槽的端部施加最大的弯曲应力来减少差的分割 。 解决方案：在板100的一个板面101上，以与X方向正交的Y方向布置在X方向上延伸的多个分割槽10。 然后，在板100的一个基板面101上在Y方向上分离的两端部，通过销220从X方向的两端部向上方推压更靠近端部的区域被一个 在这种状态下，由板220向上推动从板100的另一个板面102侧执行。（C）版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2009064870A
公开(公告)日：2009-03-26
申请号：JP2007229962
申请日：2007-09-05
Applicant: Denso Corp , 株式会社デンソー
Inventor： ASAI YASUTOMI
CPC classification number: H01L2224/48227 , H01L2224/49175 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012
Abstract: PROBLEM TO BE SOLVED: To prevent warp and crack in a ceramic substrate even when the ceramic substrate is pressed to a heat sink owing to molding pressure while resin is sealed, in a mold package that is formed by attaching the ceramic substrate to a metallic heat sink and by half-molding these elements with a molding resin.
SOLUTION: When a force is applied to the ceramic substrate 10 and the heat sink 20 which are mutually attached with each other with each one plate surface 11, 21 in the direction orthogonal to one plate surface 11 of the ceramic substrate 10, the heat sink 20 is bent easier than the ceramic substrate 10 regarding bending where displacement occurs in the relevant orthogonal direction.
COPYRIGHT: (C)2009,JPO&INPITAbstract translation: 要解决的问题：为了防止陶瓷基板中的翘曲和裂纹，即使在树脂被密封时，由于模制压力将陶瓷基板压在散热器上，在通过将陶瓷基板附接到 金属散热器和通过用模制树脂将这些元件半模塑。 解决方案：当在与陶瓷基板10的一个板表面11正交的方向上的每个板表面11,21彼此相互连接的陶瓷基板10和散热器20上施加力时， 相对于陶瓷基板10，相对于相关正交方向发生位移发生弯曲，散热器20弯曲得更容易。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2008004745A
公开(公告)日：2008-01-10
申请号：JP2006172526
申请日：2006-06-22
Applicant: Denso Corp , 株式会社デンソー
Inventor： KUNIEDA HIROYOSHI , OTANI YUJI , IMAI HIROKAZU , ASAI YASUTOMI
CPC classification number: H01L2924/0002 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To allow a substrate to be fixed to a heat sink without screwing in an electronic apparatus, in which the substrate having a heating element mounted thereon is placed on the heat sink via a heat transfer grease, and heat is dissipated from the substrate to the heat sink via the heat transfer grease. SOLUTION: The apparatus includes the substrate 10 that is provided with the heating element 20 on the surface 11 thereof, and the heat sink 30. The substrate 10 is placed on the heat sink 30 while the backside 12 of the substrate 10 faces the heat sink 30, and a heat transfer grease 40 is disposed in a space where the backside 12 of the substrate 10 and heat sink 30 face each other. The substrate 10 and heat sink 30 are bonded by adhesives 50 that are located in the outer periphery ends 13 of the substrate 10. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation: 要解决的问题：为了使基板固定在散热器上，而不会拧入其中安装有加热元件的基板通过传热油脂放置在散热片上的电子设备中，并且加热 通过传热润滑脂从基板散热到散热片。 解决方案：该装置包括在其表面11上设置有加热元件20的基板10和散热器30.基板10放置在散热器30上，同时基板10的背面12面对 散热器30和传热润滑脂40设置在基板10和散热片30的背面12彼此面对的空间中。 基板10和散热器30通过位于基板10的外周端部13中的粘合剂50粘合。（C）2008，JPO＆INPIT
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