公开(公告)号：JP2003273056A

公开(公告)日：2003-09-26

申请号：JP2002074484

申请日：2002-03-18

申请人： Ebara Corp ,  株式会社荏原製作所

发明人： MIYAZAKI MITSURU ,  KATSUOKA SEIJI ,  WATANABE TERUYUKI ,  MOTOJIMA YASUYUKI

IPC分类号： C25D17/00 ,  H01L21/00 ,  H01L21/288 ,  H01L21/304 ,  H01L21/687 ,  H01L21/768

CPC分类号： H01L21/288 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67219 ,  H01L21/76843 ,  H01L21/76849 ,  H01L21/76873 ,  Y10T29/41

摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for treating a substrate, in which a substrate is surely treated in a plurality of liquids, with no mixing of liquids, and the footprint of the apparatus is reduced for lower cost of the apparatus. SOLUTION: There are provided a substrate-holding means 10 which holds a substrate W, a vessel 40 so provided that an opening 41 faces a treating surface S of the substrate W, a drive means 55 which vertically moves the vessel 40, a lid 80 which stops the opening 41 of the vessel 40, a first process liquid supply means 60, where the lid 80 is collapsed to open the opening 41 and the drive means 55 makes the vessel 40 approach the treating surface S of the substrate W so that the first treating liquid contacts it, and a second treating liquid supply means 100 where a second treating liquid is made to contact the process surface S of the substrate W, while the opening 41 of the vessel 40 is stopped by the lid 80. COPYRIGHT: (C)2003,JPO

摘要翻译： 要解决的问题：提供一种处理基板的方法和设备，其中基板在多种液体中被可靠地处理，而不会混合液体，并且降低了设备的占地面积，从而降低了成本 的装置。 解决方案：提供了一种保持基板W的基板保持装置10，容器40，使得开口41面向基板W的处理表面S，垂直移动容器40的驱动装置55， 停止容器40的开口41的盖80，第一处理液供给装置60，其中盖80折叠以打开开口41，驱动装置55使容器40接近基板W的处理表面S 第一处理液与第一处理液接触，第二处理液供给装置100使第二处理液与基板W的处理面S接触，同时容器40的开口41被盖80挡住。 版权所有（C）2003，JPO

公开(公告)号：JP2004169075A

公开(公告)日：2004-06-17

申请号：JP2002334277

申请日：2002-11-18

申请人： Ebara Corp ,  株式会社荏原製作所

发明人： KATSUOKA SEIJI ,  SEKIMOTO MASAHIKO ,  YOKOYAMA TOSHIO ,  WATANABE TERUYUKI ,  OGAWA TAKAHIRO ,  KOBAYASHI KENICHI ,  MIYAZAKI MITSURU ,  MOTOJIMA YASUYUKI

IPC分类号： B08B1/04 ,  C23C18/18 ,  C23C18/31 ,  H01L21/304 ,  H01L21/68 ,  H01L21/683

摘要： PROBLEM TO BE SOLVED: To provide a substrate treatment system which delivers a substrate in a state where the substrate is quickly and securely held without causing the risk of falling to thereby exhibit improved throughput. SOLUTION: The substrate treatment system comprises a substrate receiving ring 90 fitted with a seal ring 92, a freely vertically movable substrate holder 60 having a substrate fixing ring 100 for holding the peripheral part of a substrate W between the ring 100 and the seal ring 92 to support the substrate W, and a temporary placement part 94 fitted to a position surrounding the seal ring 92 of the substrate receiving ring 90 and forming a space between the substrate W and the seal ring 92, and where the substrate W is temporarily placed. COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2005191368A

公开(公告)日：2005-07-14

申请号：JP2003432480

申请日：2003-12-26

申请人： Ebara Corp ,  株式会社荏原製作所

发明人： SEKIMOTO MASAHIKO ,  KATSUOKA SEIJI ,  DAI NAOKI ,  WATANABE TERUYUKI ,  OGAWA TAKAHIRO ,  SUZUKI KENICHI ,  KOBAYASHI KENICHI ,  MOTOJIMA YASUYUKI ,  KATO AKIRA

IPC分类号： B24B37/30 ,  H01L21/288 ,  H01L21/304 ,  H01L21/677 ,  H01L21/68 ,  B24B37/04

摘要： PROBLEM TO BE SOLVED: To reliably suck and retain a substrate by reliably adhering the rear surface periphery of a substrate without a gaps over the entire periphery of a suction seal on the end face of the suction seal. SOLUTION: A substrate retaining device comprises a substrate pressing section 82 for supporting the substrate W while the surface faces down, and a suction head 84 having the suction seal 90 for retaining the substrate by sealing the rear surface periphery of the substrate W supported by the substrate pressing section 82 annularly for suction. A plurality of pressing mechanisms 164 that come into contact with the surface periphery of the substrate W supported by the substrate pressing section 82 and press the substrate W toward the suction head 84 are provided at positions along the circumferential direction at the substrate pressing section 82. COPYRIGHT: (C)2005,JPO&NCIPI

摘要翻译： 要解决的问题：通过在吸入密封件的端面上的吸入密封件的整个周边上可靠地粘附基板的后表面周边而不间隙地可靠地吸附和保持基板。 解决方案：基板保持装置包括：基板按压部82，用于在表面朝下的同时支撑基板W;吸入头84具有用于通过密封基板W的后表面周边来保持基板的吸入密封件90 由基板按压部82支撑，用于抽吸。 与基板按压部82支撑的基板W的表面周边接触并将基板W朝向吸引头84按压的多个按压机构164设置在基板按压部82的周向的位置。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2005191304A

公开(公告)日：2005-07-14

申请号：JP2003431346

申请日：2003-12-25

申请人： Ebara Corp ,  株式会社荏原製作所

发明人： SEKIMOTO MASAHIKO ,  KATSUOKA SEIJI ,  DAI NAOKI ,  WATANABE TERUYUKI ,  OGAWA TAKAHIRO ,  SUZUKI KENICHI ,  KOBAYASHI KENICHI ,  MOTOJIMA YASUYUKI ,  KATO AKIRA

IPC分类号： C23C18/18 ,  H01L21/677 ,  H01L21/68

摘要： PROBLEM TO BE SOLVED: To respond to a request for miniaturizing and making compact a device by securing the dipping depth of a substrate into a treatment liquid.
SOLUTION: A substrate retaining device comprises a substrate holder 84 that has a first annular sealing member 92 and retains a substrate W by bringing the periphery of the treatment surface of the substrate W into contact with the first sealing member 92; and a substrate pressing section 85 that goes down relatively to the substrate holder 84, presses the substrate W supported by the substrate holder 84 downward, and pressure-welds the first sealing member 92 to the substrate W. A second annular sealing member 170 that is pressure-welded to the upper surface of an annular retaining section 82 of the substrate holder 84 and seals the outer periphery of the substrate pressing section 85 when the second annular sealing member 170 goes down relatively to the substrate holder 84 is provided at the substrate pressing section 85.
COPYRIGHT: (C)2005,JPO&NCIPI

摘要翻译： 要解决的问题：通过将基板的浸入深度确保到处理液中来应对小型化和紧凑化装置的要求。 解决方案：衬底保持装置包括：衬底保持器84，其具有第一环形密封构件92，并且通过使衬底W的处理表面的周边与第一密封构件92接触来保持衬底W; 以及相对于基板保持件84下降的基板按压部85，将由基板保持件84支撑的基板W向下压，并将第一密封部件92加压焊接到基板W.第二环状密封部件170 在第二环状密封构件170相对于基板保持件84下降时，被压焊到基板保持件84的环状保持部82的上表面，并密封基板按压部85的外周， 第85条。版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2007314880A

公开(公告)日：2007-12-06

申请号：JP2007136464

申请日：2007-05-23

申请人： Ebara Corp ,  株式会社荏原製作所

发明人： KATSUOKA SEIJI ,  SEKIMOTO MASAHIKO ,  YOKOYAMA TOSHIO ,  WATANABE TERUYUKI ,  OGAWA TAKAHIRO ,  KOBAYASHI KENICHI ,  MIYAZAKI MITSURU ,  MOTOJIMA YASUYUKI ,  OWATARI AKIRA ,  DAI NAOKI

IPC分类号： C23C18/31 ,  B65G49/04 ,  C23C18/16 ,  C25D7/12 ,  C25D17/00 ,  H01L21/00 ,  H01L21/288 ,  H01L21/677 ,  H01L21/683 ,  H01L21/687

CPC分类号： H01L21/67161 ,  C23C18/1628 ,  C23C18/1893 ,  C25D7/123 ,  C25D17/001 ,  C25D17/08 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/67781 ,  H01L21/68707 ,  H01L21/68721 ,  Y10S134/902 ,  Y10T279/11

摘要： PROBLEM TO BE SOLVED: To provide a plating processing unit where not only plating processing can be securely performed with high quality, but also, the compacting of the whole unit and the reduction of unit cost can be attained. SOLUTION: Regarding the plating processing unit where, in a state where a substrate W held by an attracting head 789 is inserted into a processing tank, the processing face of the substrate W is subjected to liquid contact processing with a plating solution, the attracting head 789 is composed so as to be mounted with a ring-shaped substrate attracting portion 795 vacuum-attracting the back surface of the substrate W so as to be a ring shape to the peripheral lower surface of the base 791 and also functioning as a seal for preventing intrusion of the plating solution into the inside of the vacuum-attracted portion of the back surface of the substrate W. The base 791 has opening parts for opening the space between the substrate W attached to the substrate attracting portion 795 and the base 791. COPYRIGHT: (C)2008,JPO&INPIT

摘要翻译： 要解决的问题：为了提供一种电镀处理单元，其不仅可以以高质量可靠地执行电镀处理，而且可以实现整个单元的压实和单元成本的降低。 解决方案：关于电镀处理单元，其中在由吸引头789保持的基板W插入处理槽的状态下，使基板W的处理面与电镀液进行液体接触处理， 吸引头789构成为安装有环状基板吸引部795，其将基板W的背面真空吸附成环状，从而形成为基部791的周边下表面，并且还起到 用于防止电镀溶液侵入到基板W的背面的真空吸引部分的内部的密封。基部791具有用于打开附着到基板吸引部795的基板W与安装在基板吸引部795之间的空间的开口部 基地791.版权所有（C）2008年，JPO＆INPIT

公开(公告)号：JP2010118685A

公开(公告)日：2010-05-27

申请号：JP2010022270

申请日：2010-02-03

申请人： Ebara Corp ,  株式会社荏原製作所

发明人： KATSUOKA SEIJI ,  SEKIMOTO MASAHIKO ,  WATANABE TERUYUKI ,  KATO AKIRA ,  YOKOYAMA TOSHIO ,  SUZUKI KENICHI ,  KOBAYASHI KENICHI

IPC分类号： H01L21/683 ,  B05B15/12 ,  B05C3/09 ,  B05C9/06 ,  B05C11/10 ,  B05C13/00 ,  B05C15/00 ,  B05D3/12 ,  B65H1/00 ,  C23C2/00 ,  C23C18/16 ,  C23C18/31 ,  C25D17/06 ,  H01L21/00 ,  H01L21/288 ,  H01L21/68 ,  H01L21/768

CPC分类号： H01L21/288 ,  C23C2/003 ,  C23C18/1619 ,  C23C18/163 ,  C23C18/1642 ,  H01L21/6708 ,  H01L21/67742 ,  H01L21/6838 ,  H01L21/76849

摘要： PROBLEM TO BE SOLVED: To perform processing by holding a substrate while preventing the separation and the fall of the substrate without need for increasing adsorption to the substrate or mechanical strength. SOLUTION: The substrate supporting apparatus incldues a rotatable supporting head 184 having a ring-like seal for supporting the substrate while sealing the rear side circumferential rim of the substrate. The supporting head 184 includes a restriction mechanism 260 for generating negative pressure to the rear side of the substrate sealed with the ring-like seal accompanied by the rotation of the supporting head 184 while supporting the substrate. COPYRIGHT: (C)2010,JPO&INPIT

摘要翻译： 要解决的问题：通过保持基板同时防止基板的分离和下降而不需要增加对基板的吸附或机械强度来进行加工。 解决方案：基板支撑装置包括具有环状密封件的可旋转支撑头184，用于支撑基板，同时密封基板的后侧圆周边缘。 支撑头184包括限制机构260，用于在支撑基板的同时伴随着支撑头184的旋转而用密封的环状密封件向衬底的后侧产生负压。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2008110471A

公开(公告)日：2008-05-15

申请号：JP2007225805

申请日：2007-08-31

申请人： Ebara Corp ,  株式会社荏原製作所

发明人： KATSUOKA SEIJI ,  SEKIMOTO MASAHIKO ,  KUNISAWA JUNJI ,  MIYAZAKI MITSURU ,  WATANABE TERUYUKI ,  KOBAYASHI KENICHI ,  KUMEGAWA MASAYUKI ,  YOKOYAMA TOSHIO

IPC分类号： B24B7/24 ,  B24B37/00 ,  B24B37/015 ,  B24B37/04 ,  B24B37/12 ,  B24B37/30 ,  B24B41/06 ,  B24B53/017 ,  B24B53/02 ,  B24B55/02

CPC分类号： B24B37/04 ,  B24B55/02 ,  Y10S451/914

摘要： PROBLEM TO BE SOLVED: To provide a substrate polishing device, a substrate polishing method, and a substrate receiving method for polishing a substrate such as a large-size glass substrate with high degree of flatness and washing and drying it. SOLUTION: This substrate polishing device is provided with a substrate holding mechanism part 4 provided with a head 40 for holding the substrate G to be polished and a polishing mechanism part 3 provided with a turn table 60 to which a polishing pad 61 is attached to polish the substrate G by relative movement of the substrate G and the polishing pad 61 by pressing the substrate G sucked and held by the head 40 against the polishing pad on the turn table 60. This substrate polishing device is also provided with a pusher mechanism part 2 for delivering the substrate G before polishing to the head 40 and receiving the substrate G after polishing, a washing/drying part for washing and drying the substrate G after polishing, and a dresser unit 8 for putting the polishing pad 61 in a condition suitable for polishing. COPYRIGHT: (C)2008,JPO&INPIT

摘要翻译： 要解决的问题：提供一种用于抛光具有高度平整度的大尺寸玻璃基板的基板的抛光和干燥的基板研磨装置，基板研磨方法和基板接收方法。 解决方案：该基板研磨装置设置有基板保持机构部分4，该基板保持机构部分4设置有用于保持待抛光的基板G的头部40以及抛光机构部分3，抛光机构部分3设置有抛光垫61，抛光垫61 通过将由头部40吸收和保持的基板G压靠在转台60上的抛光垫上，通过基板G和抛光垫61的相对运动来附着以抛光基板G.该基板抛光装置还设置有推动器 用于在抛光之前将基板G输送到头部40并在抛光之后接收基板G的机构部分2，用于在抛光之后洗涤和干燥基板G的洗涤/干燥部分，以及用于将抛光垫61放置在其中的修整器单元8 条件适合抛光。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007284797A

公开(公告)日：2007-11-01

申请号：JP2007136465

申请日：2007-05-23

申请人： Ebara Corp ,  株式会社荏原製作所

发明人： KATSUOKA SEIJI ,  SEKIMOTO MASAHIKO ,  YOKOYAMA TOSHIO ,  WATANABE TERUYUKI ,  OGAWA TAKAHIRO ,  KOBAYASHI KENICHI ,  MIYAZAKI MITSURU ,  MOTOJIMA YASUYUKI ,  OWATARI AKIRA ,  DAI NAOKI

IPC分类号： C23C18/18 ,  C23C18/16 ,  C23C18/31 ,  C25D7/12 ,  C25D17/00 ,  H01L21/00 ,  H01L21/304 ,  H01L21/677 ,  H01L21/687

CPC分类号： H01L21/67161 ,  C23C18/1628 ,  C23C18/1893 ,  C25D7/123 ,  C25D17/001 ,  C25D17/08 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/67781 ,  H01L21/68707 ,  H01L21/68721 ,  Y10S134/902 ,  Y10T279/11

摘要： PROBLEM TO BE SOLVED: To provide a substrate processing method and an apparatus which can securely carry out a pre-treatment in order to perform a plating treatment that enables uniform plating in the necessary area of the surface of a substrate. SOLUTION: When a cleaning treatment and a catalyst-imparting treatment are performed as pre-plating treatments before the surface of a substrate W is electroless plated, the cleaning treatment is carried out in a wider area of the surface of the substrate W than that area to which a catalyst is imparted by the catalyst-imparting treatment (the catalyst impartation area S 1 2 ). The area to which the catalyst is imparted to the surface of the substrate by the catalyst-imparting treatment is, e.g., the same as that area of the surface of the substrate W in which uniform plating is to be carried out. COPYRIGHT: (C)2008,JPO&INPIT

摘要翻译： 要解决的问题：提供一种基板处理方法和可以可靠地执行预处理的装置，以便进行能够在基板的表面的必要区域中均匀镀覆的电镀处理。 解决方案：当在基板W的表面无电镀之前进行清洗处理和催化剂赋予处理作为预镀处理时，清洁处理在基板W的表面的更宽区域中进行 比通过催化剂赋予处理（催化剂赋予区域S 1 <清洁区域S 2 ）赋予催化剂的区域更多。 通过催化剂赋予处理赋予催化剂表面的区域例如与要进行均匀镀覆的基板W的表面的面积相同。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007274003A

公开(公告)日：2007-10-18

申请号：JP2007136463

申请日：2007-05-23

申请人： Ebara Corp ,  株式会社荏原製作所

发明人： KATSUOKA SEIJI ,  SEKIMOTO MASAHIKO ,  YOKOYAMA TOSHIO ,  WATANABE TERUYUKI ,  OGAWA TAKAHIRO ,  KOBAYASHI KENICHI ,  MIYAZAKI MITSURU ,  MOTOJIMA YASUYUKI ,  OWATARI AKIRA ,  DAI NAOKI

IPC分类号： H01L21/683 ,  C23C18/16 ,  C23C18/31 ,  C25D7/12 ,  C25D17/00 ,  H01L21/00 ,  H01L21/677 ,  H01L21/687

CPC分类号： H01L21/67161 ,  C23C18/1628 ,  C23C18/1893 ,  C25D7/123 ,  C25D17/001 ,  C25D17/08 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/67781 ,  H01L21/68707 ,  H01L21/68721 ,  Y10S134/902 ,  Y10T279/11

摘要： PROBLEM TO BE SOLVED: To provide a substrate holding device, a substrate treatment device, and a substrate mounting/dismounting method to/from the substrate holding device, which allow a substrate to be positively peeled off free from sealant materials, without bending a vacuum-suctioned substrate by this vacuum suction power. SOLUTION: In the substrate holding device which suctions and holds a rear surface of the substrate on an undersurface of an suction head 2089, the substrate holding device is fitted with a ring-shaped substrate suction section 2095 which is located at the external circumference of the undersurface of the suction head 2089 and annularly vacuum-suctions the rear surface of the substrate, and which prevents and seals the penetration of a processing solution from a vacuum-suctioned portion in the rear surface of the substrate to inside, and a pusher 2100 which presses the substrate suctioned on the substrate suction section 2095 in the direction of being separated from the suction head 2089. COPYRIGHT: (C)2008,JPO&INPIT

摘要翻译： 要解决的问题：为了向基板保持装置提供基板保持装置，基板处理装置和基板安装/拆卸方法，其允许基板被无密封材料积极剥离，而没有 通过该真空抽吸动力来弯曲真空吸附的基板。 解决方案：在吸引头2089的下表面上吸附并保持基板的后表面的基板保持装置中，基板保持装置装配有位于外部的环状基板吸入部2095 抽吸头2089的下表面的圆周和环形真空吸附衬底的后表面，并且防止和密封处理溶液从衬底的后表面中的真空吸附部分穿透到内部，并且 推动器2100将吸附在基板抽吸部2095上的基板沿着与吸头2089分离的方向按压。（C）2008，JPO＆INPIT

公开(公告)号：JP2004214222A

公开(公告)日：2004-07-29

申请号：JP2002373859

申请日：2002-12-25

申请人： Ebara Corp ,  株式会社荏原製作所

发明人： KATSUOKA SEIJI ,  SEKIMOTO MASAHIKO ,  YOKOYAMA TOSHIO ,  WATANABE TERUYUKI ,  OGAWA TAKAHIRO ,  KOBAYASHI KENICHI ,  MIYAZAKI MITSURU ,  MOTOJIMA YASUYUKI

IPC分类号： H01L21/683 ,  H01L21/02 ,  H01L21/304 ,  H01L21/68

摘要： PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus and a substrate treatment method by which the mixing of treatment liquids can be avoided even when a substrate is treated by a plurality of the treatment liquids in one apparatus. SOLUTION: The substrate treatment apparatus has a treatment tank (a first treatment means) 10 in which a plating solution (a treatment liquid) Q is collected on the inside and the substrate W is plated and treated (a dipping treatment), a cover 40 opening and closing the opening section 11 of the tank 10, a spray nozzle (a second treatment means ) 60 installed on the top face of the cover 40, and a substrate holding means 80 adsorbing and holding the rear of the substrate W. The means 80 is lowered under the state in which the cover 40 is removed from the opening section 11 of the tank 10, the substrate W is dipped in the plating solution Q, and the substrate W is plated and treated. The substrate W is washed and treated by the nozzle 60 under the state in which the means 80 is elevated and the opening section 11 of the tank 10 is closed by the cover 40. COPYRIGHT: (C)2004,JPO&NCIPI