公开(公告)号：JP2010064196A

公开(公告)日：2010-03-25

申请号：JP2008233466

申请日：2008-09-11

申请人： Ebara Corp ,  株式会社荏原製作所

发明人： KUMEGAWA MASAYUKI ,  YOKOYAMA TOSHIO

IPC分类号： B24B37/00 ,  B24B37/005 ,  B24B37/10 ,  B24B53/017

摘要： PROBLEM TO BE SOLVED: To provide a substrate polishing device which can uniformly polish a rectangular large-sized substrate such as a large-sized glass substrate at a high degree of flatness, can make the whole device compact (small size), and has favorable maintainability. SOLUTION: The substrate polishing device includes: a substrate holding mechanism 3 having a substrate rotating stage 31 rotated while holding the rectangular substrate G with its polishing surface in an upward direction; a polishing head mechanism 4 having a polishing head 41 rotating while holding a polishing tool 10 having a polishing surface smaller than a polishing object surface of the substrate G and pressing the polishing tool 10 to the polishing object surface of the substrate G; and a moving mechanism 5 for horizontally reciprocating the polishing head 41 while supporting the polishing head 41. The polishing tool 10 is rotated while rotating the substrate G, and the substrate G is polished by reciprocating the polishing tool 10 between the center section of the substrate G and an outer peripheral end of the substrate G while the polishing tool 10 is pressed to the substrate G. COPYRIGHT: (C)2010,JPO&INPIT

摘要翻译： 解决的问题为了提供能够以高度的平坦度均匀地研磨诸如大尺寸玻璃基板的矩形大尺寸基板的基板研磨装置，能够使整个装置紧凑（小尺寸）， 并具有良好的可维护性。 基板研磨装置包括：基板保持机构3，其具有基板旋转台31旋转，同时将矩形基板G的抛光表面沿向上方向保持; 抛光头机构4，其具有在保持具有小于基板G的抛光对象表面的抛光表面的抛光工具10并且将抛光工具10按压到基板G的抛光对象表面的同时旋转的抛光头41; 以及用于在支撑抛光头41的同时使抛光头41水平往复运动的移动机构5.抛光工具10在旋转基板G的同时旋转，并且基板G通过使抛光工具10在基板的中心部分之间往复运动而被抛光 G和基板G的外周端，而抛光工具10被压到基板G上。（C）2010，JPO＆INPIT

公开(公告)号：JP2007262526A

公开(公告)日：2007-10-11

申请号：JP2006091237

申请日：2006-03-29

申请人： Ebara Corp ,  株式会社荏原製作所

发明人： YOKOYAMA TOSHIO ,  KATSUOKA SEIJI ,  SEKIMOTO MASAHIKO

IPC分类号： C23C18/31 ,  H01L21/304

摘要： PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus and a substrate treatment method which allows treating liquid such as plating liquid to reliably penetrate even the inner part of a recessed part for wiring of a micronized trench, etc. and can perform prescribed treatment such as plating.
SOLUTION: The substrate treatment apparatus comprises: a treatment chamber 32 which is opened to the upper side and is connected with a vacuum part; and a vertically freely-movable substrate holding head 10 which is arranged on the upper side of the treatment chamber 32 and holds a substrate W on the lower surface, wherein an opening part of the treatment chamber 32 is covered with the substrate holding head 10 which holds the substrate W, the treatment chamber 32 is tightly closed, the inside thereof is evacuated, thereafter, the substrate W is brought into contact with the treatment liquid Q introduced to the treatment chamber 32 and the substrate W is treated.
COPYRIGHT: (C)2008,JPO&INPIT

摘要翻译： 要解决的问题：提供一种基板处理装置和基板处理方法，其能够使诸如电镀液体的液体能够可靠地穿透甚至用于微细化沟槽等的布线的凹部的内部，并且可以执行 规定处理如电镀。 解决方案：基板处理装置包括：处理室32，其向上侧敞开并与真空部连接; 以及设置在处理室32的上侧并且在下表面上保持基板W的可垂直自由移动的基板保持头10，其中处理室32的开口部分被基板保持头10覆盖，基板保持头10 保持基板W，处理室32紧密地关闭，其内部被抽真空，然后使基板W与引入处理室32的处理液Q接触，并且处理基板W. 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2004169075A

公开(公告)日：2004-06-17

申请号：JP2002334277

申请日：2002-11-18

申请人： Ebara Corp ,  株式会社荏原製作所

发明人： KATSUOKA SEIJI ,  SEKIMOTO MASAHIKO ,  YOKOYAMA TOSHIO ,  WATANABE TERUYUKI ,  OGAWA TAKAHIRO ,  KOBAYASHI KENICHI ,  MIYAZAKI MITSURU ,  MOTOJIMA YASUYUKI

IPC分类号： B08B1/04 ,  C23C18/18 ,  C23C18/31 ,  H01L21/304 ,  H01L21/68 ,  H01L21/683

摘要： PROBLEM TO BE SOLVED: To provide a substrate treatment system which delivers a substrate in a state where the substrate is quickly and securely held without causing the risk of falling to thereby exhibit improved throughput. SOLUTION: The substrate treatment system comprises a substrate receiving ring 90 fitted with a seal ring 92, a freely vertically movable substrate holder 60 having a substrate fixing ring 100 for holding the peripheral part of a substrate W between the ring 100 and the seal ring 92 to support the substrate W, and a temporary placement part 94 fitted to a position surrounding the seal ring 92 of the substrate receiving ring 90 and forming a space between the substrate W and the seal ring 92, and where the substrate W is temporarily placed. COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2014216392A

公开(公告)日：2014-11-17

申请号：JP2013090694

申请日：2013-04-23

申请人： 株式会社荏原製作所 ,  Ebara Corp

发明人： YOKOYAMA TOSHIO ,  KUNISAWA JUNJI

IPC分类号： H01L21/304

CPC分类号： H01L21/30

摘要： 【課題】基板の洗浄工程におけるスループットを向上させることができる基板処理装置及び処理基板の製造方法を提供する。【解決手段】基板処理装置は、基板Wに接触させて基板Wを洗浄する洗浄装置41と、洗浄装置41を、基板Wの洗浄を行う洗浄位置P3と、基板Wの洗浄を行っていないときに待機する洗浄位置P3から離れた待機位置P1と、の間で移動させる移動装置42と、待機位置P1にて洗浄装置41を事前洗浄する事前洗浄装置50と、基板Wを、基板Wの洗浄が行われる処理位置に、処理位置の外側から搬送する搬送装置と、制御部62とを備える。制御部62は、基板Wを処理位置に向けて搬送しながら、洗浄装置41を洗浄位置P3に向けて移動させるように、移動装置42及び搬送装置を制御する。【選択図】図2

摘要翻译： 要解决的问题：提供一种能够改善在基板的清洗步骤中的投入的基板处理装置及其制造方法。一种基板处理装置，包括：清洗基板 W与衬底W接触; 移动装置42，用于在清洁基板W的清洁位置P3与清洁位置P3之间的待机位置P1之间移动清洁装置41，其中当基板W未被清洁时，基板W待机; 用于在待机位置P1预清洁清洁装置41的预清洁装置50; 用于将衬底W从衬底W被清洁的处理位置的外部输送到处理位置的传送装置; 控制部分62控制移动装置42和输送装置，以便在将基板W运送到处理位置的同时将清洁装置41运送到清洁位置P3。

公开(公告)号：JP2013038249A

公开(公告)日：2013-02-21

申请号：JP2011173704

申请日：2011-08-09

申请人： Ebara Corp ,  株式会社荏原製作所

发明人： YOKOYAMA TOSHIO ,  KUNISAWA JUNJI ,  MIYAZAKI MITSURU

IPC分类号： H01L21/304

摘要： PROBLEM TO BE SOLVED: To prevent photo-corrosion of copper wiring and the like caused by radiation of light on a process target surface of a substrate, and, although the processible number of substrates decreases, allow processing such as cleaning that prevents photo-corrosion of copper wiring and the like caused by radiation of light in maintenance of a part of processing units in a substrate processing apparatus to be performed.SOLUTION: A substrate processing apparatus comprises: a plurality of processing areas 30, 32, 34 in which a plurality of processing units 40a, 40b, 42a, 42b, 44a, 44b on which a light shielding treatment has been performed are arranged one above the other and housed inside; transfer areas 36, 38 housing carrier machines 46, 48 and provided between the processing areas; light shielding walls 50, 52 shielding light between the processing areas and the transfer areas; and maintenance doors 54b, 54d shielding front faces of the transfer areas from light. The processing units are linked to the light shielding walls in a light blocking state.

摘要翻译： 要解决的问题：为了防止由于在基板的工艺目标表面上的光辐射引起的铜布线的光腐蚀，并且尽管基板的可加工数量减少，但允许诸如清洁之类的处理 在要进行的基板处理装置中维护一部分处理单元的光线辐射引起的铜布线等的光腐蚀。 解决方案：一种基板处理设备包括：多个处理区域30,32,34，其中已经执行了遮光处理的多个处理单元40a，40b，42a，42b，44a，44b被布置 一个在另外一个，并在里面; 传送区域36,38壳体承载机46,48，并设置在处理区域之间; 遮光壁50,52屏蔽处理区域和转印区域之间的光; 维护门54b，54d遮挡传送区域的前表面。 处理单元以遮光状态连接到遮光壁。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2010118685A

公开(公告)日：2010-05-27

申请号：JP2010022270

申请日：2010-02-03

申请人： Ebara Corp ,  株式会社荏原製作所

发明人： KATSUOKA SEIJI ,  SEKIMOTO MASAHIKO ,  WATANABE TERUYUKI ,  KATO AKIRA ,  YOKOYAMA TOSHIO ,  SUZUKI KENICHI ,  KOBAYASHI KENICHI

IPC分类号： H01L21/683 ,  B05B15/12 ,  B05C3/09 ,  B05C9/06 ,  B05C11/10 ,  B05C13/00 ,  B05C15/00 ,  B05D3/12 ,  B65H1/00 ,  C23C2/00 ,  C23C18/16 ,  C23C18/31 ,  C25D17/06 ,  H01L21/00 ,  H01L21/288 ,  H01L21/68 ,  H01L21/768

CPC分类号： H01L21/288 ,  C23C2/003 ,  C23C18/1619 ,  C23C18/163 ,  C23C18/1642 ,  H01L21/6708 ,  H01L21/67742 ,  H01L21/6838 ,  H01L21/76849

摘要： PROBLEM TO BE SOLVED: To perform processing by holding a substrate while preventing the separation and the fall of the substrate without need for increasing adsorption to the substrate or mechanical strength. SOLUTION: The substrate supporting apparatus incldues a rotatable supporting head 184 having a ring-like seal for supporting the substrate while sealing the rear side circumferential rim of the substrate. The supporting head 184 includes a restriction mechanism 260 for generating negative pressure to the rear side of the substrate sealed with the ring-like seal accompanied by the rotation of the supporting head 184 while supporting the substrate. COPYRIGHT: (C)2010,JPO&INPIT

摘要翻译： 要解决的问题：通过保持基板同时防止基板的分离和下降而不需要增加对基板的吸附或机械强度来进行加工。 解决方案：基板支撑装置包括具有环状密封件的可旋转支撑头184，用于支撑基板，同时密封基板的后侧圆周边缘。 支撑头184包括限制机构260，用于在支撑基板的同时伴随着支撑头184的旋转而用密封的环状密封件向衬底的后侧产生负压。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009057601A

公开(公告)日：2009-03-19

申请号：JP2007225991

申请日：2007-08-31

申请人： Ebara Corp ,  株式会社荏原製作所

发明人： YOKOYAMA TOSHIO ,  SEKIMOTO MASAHIKO ,  KOBA TAKASHI ,  TSUJINO JUNICHIRO ,  OWATARI AKIRA

IPC分类号： C23C18/31 ,  H01L21/288 ,  H01L21/3205 ,  H01L23/52

摘要： PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus and a substrate treatment method which can realize stabilization of plating liquid.
SOLUTION: The substrate treatment apparatus includes a plating treating vessel 10 for applying an electroless plating to the surface of a substrate, a plating liquid supplying vessel 12 for supplying plating liquid to the plating treating vessel 10, a plating liquid circulating line 22 for circulating the plating liquid in the plating liquid supplying vessel 12, a plating liquid branching and circulating line 30 for selectively branching the plating liquid from the plating liquid circulating line 22 and joining it together with the plating liquid circulating line based on the detection values of a pH detector 34 arranged in the plating liquid supplying vessel 12. The plating liquid branching and circulating line 30 is provided with an auxiliary reaction unit 32 having therein an auxiliary reactant causing the same electroless plating reaction as that of the surface of the substrate.
COPYRIGHT: (C)2009,JPO&INPIT

摘要翻译： 要解决的问题：提供一种能够实现电镀液稳定化的基板处理装置和基板处理方法。 解决方案：基板处理装置包括用于向基板表面施加化学镀的电镀处理容器10，向电镀处理容器10供给电镀液的电镀液供给容器12，电镀液循环管线22 用于使电镀液供给容器12中的电镀液循环，电镀液分支循环管线30，用于选择性地从电镀液循环管线22分支镀液，并将其与电镀液循环管线连接， 布置在电镀液供给容器12中的pH检测器34.电镀液分支循环管线30设有辅助反应单元32，辅助反应单元32中具有辅助反应物，引起与基板表面相同的化学镀反应。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2008110471A

公开(公告)日：2008-05-15

申请号：JP2007225805

申请日：2007-08-31

申请人： Ebara Corp ,  株式会社荏原製作所

发明人： KATSUOKA SEIJI ,  SEKIMOTO MASAHIKO ,  KUNISAWA JUNJI ,  MIYAZAKI MITSURU ,  WATANABE TERUYUKI ,  KOBAYASHI KENICHI ,  KUMEGAWA MASAYUKI ,  YOKOYAMA TOSHIO

IPC分类号： B24B7/24 ,  B24B37/00 ,  B24B37/015 ,  B24B37/04 ,  B24B37/12 ,  B24B37/30 ,  B24B41/06 ,  B24B53/017 ,  B24B53/02 ,  B24B55/02

CPC分类号： B24B37/04 ,  B24B55/02 ,  Y10S451/914

摘要： PROBLEM TO BE SOLVED: To provide a substrate polishing device, a substrate polishing method, and a substrate receiving method for polishing a substrate such as a large-size glass substrate with high degree of flatness and washing and drying it. SOLUTION: This substrate polishing device is provided with a substrate holding mechanism part 4 provided with a head 40 for holding the substrate G to be polished and a polishing mechanism part 3 provided with a turn table 60 to which a polishing pad 61 is attached to polish the substrate G by relative movement of the substrate G and the polishing pad 61 by pressing the substrate G sucked and held by the head 40 against the polishing pad on the turn table 60. This substrate polishing device is also provided with a pusher mechanism part 2 for delivering the substrate G before polishing to the head 40 and receiving the substrate G after polishing, a washing/drying part for washing and drying the substrate G after polishing, and a dresser unit 8 for putting the polishing pad 61 in a condition suitable for polishing. COPYRIGHT: (C)2008,JPO&INPIT

摘要翻译： 要解决的问题：提供一种用于抛光具有高度平整度的大尺寸玻璃基板的基板的抛光和干燥的基板研磨装置，基板研磨方法和基板接收方法。 解决方案：该基板研磨装置设置有基板保持机构部分4，该基板保持机构部分4设置有用于保持待抛光的基板G的头部40以及抛光机构部分3，抛光机构部分3设置有抛光垫61，抛光垫61 通过将由头部40吸收和保持的基板G压靠在转台60上的抛光垫上，通过基板G和抛光垫61的相对运动来附着以抛光基板G.该基板抛光装置还设置有推动器 用于在抛光之前将基板G输送到头部40并在抛光之后接收基板G的机构部分2，用于在抛光之后洗涤和干燥基板G的洗涤/干燥部分，以及用于将抛光垫61放置在其中的修整器单元8 条件适合抛光。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007284797A

公开(公告)日：2007-11-01

申请号：JP2007136465

申请日：2007-05-23

申请人： Ebara Corp ,  株式会社荏原製作所

发明人： KATSUOKA SEIJI ,  SEKIMOTO MASAHIKO ,  YOKOYAMA TOSHIO ,  WATANABE TERUYUKI ,  OGAWA TAKAHIRO ,  KOBAYASHI KENICHI ,  MIYAZAKI MITSURU ,  MOTOJIMA YASUYUKI ,  OWATARI AKIRA ,  DAI NAOKI

IPC分类号： C23C18/18 ,  C23C18/16 ,  C23C18/31 ,  C25D7/12 ,  C25D17/00 ,  H01L21/00 ,  H01L21/304 ,  H01L21/677 ,  H01L21/687

CPC分类号： H01L21/67161 ,  C23C18/1628 ,  C23C18/1893 ,  C25D7/123 ,  C25D17/001 ,  C25D17/08 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/67781 ,  H01L21/68707 ,  H01L21/68721 ,  Y10S134/902 ,  Y10T279/11

摘要： PROBLEM TO BE SOLVED: To provide a substrate processing method and an apparatus which can securely carry out a pre-treatment in order to perform a plating treatment that enables uniform plating in the necessary area of the surface of a substrate. SOLUTION: When a cleaning treatment and a catalyst-imparting treatment are performed as pre-plating treatments before the surface of a substrate W is electroless plated, the cleaning treatment is carried out in a wider area of the surface of the substrate W than that area to which a catalyst is imparted by the catalyst-imparting treatment (the catalyst impartation area S 1 2 ). The area to which the catalyst is imparted to the surface of the substrate by the catalyst-imparting treatment is, e.g., the same as that area of the surface of the substrate W in which uniform plating is to be carried out. COPYRIGHT: (C)2008,JPO&INPIT

摘要翻译： 要解决的问题：提供一种基板处理方法和可以可靠地执行预处理的装置，以便进行能够在基板的表面的必要区域中均匀镀覆的电镀处理。 解决方案：当在基板W的表面无电镀之前进行清洗处理和催化剂赋予处理作为预镀处理时，清洁处理在基板W的表面的更宽区域中进行 比通过催化剂赋予处理（催化剂赋予区域S 1 <清洁区域S 2 ）赋予催化剂的区域更多。 通过催化剂赋予处理赋予催化剂表面的区域例如与要进行均匀镀覆的基板W的表面的面积相同。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007274003A

公开(公告)日：2007-10-18

申请号：JP2007136463

申请日：2007-05-23

申请人： Ebara Corp ,  株式会社荏原製作所

发明人： KATSUOKA SEIJI ,  SEKIMOTO MASAHIKO ,  YOKOYAMA TOSHIO ,  WATANABE TERUYUKI ,  OGAWA TAKAHIRO ,  KOBAYASHI KENICHI ,  MIYAZAKI MITSURU ,  MOTOJIMA YASUYUKI ,  OWATARI AKIRA ,  DAI NAOKI

IPC分类号： H01L21/683 ,  C23C18/16 ,  C23C18/31 ,  C25D7/12 ,  C25D17/00 ,  H01L21/00 ,  H01L21/677 ,  H01L21/687

CPC分类号： H01L21/67161 ,  C23C18/1628 ,  C23C18/1893 ,  C25D7/123 ,  C25D17/001 ,  C25D17/08 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/67781 ,  H01L21/68707 ,  H01L21/68721 ,  Y10S134/902 ,  Y10T279/11

摘要： PROBLEM TO BE SOLVED: To provide a substrate holding device, a substrate treatment device, and a substrate mounting/dismounting method to/from the substrate holding device, which allow a substrate to be positively peeled off free from sealant materials, without bending a vacuum-suctioned substrate by this vacuum suction power. SOLUTION: In the substrate holding device which suctions and holds a rear surface of the substrate on an undersurface of an suction head 2089, the substrate holding device is fitted with a ring-shaped substrate suction section 2095 which is located at the external circumference of the undersurface of the suction head 2089 and annularly vacuum-suctions the rear surface of the substrate, and which prevents and seals the penetration of a processing solution from a vacuum-suctioned portion in the rear surface of the substrate to inside, and a pusher 2100 which presses the substrate suctioned on the substrate suction section 2095 in the direction of being separated from the suction head 2089. COPYRIGHT: (C)2008,JPO&INPIT

摘要翻译： 要解决的问题：为了向基板保持装置提供基板保持装置，基板处理装置和基板安装/拆卸方法，其允许基板被无密封材料积极剥离，而没有 通过该真空抽吸动力来弯曲真空吸附的基板。 解决方案：在吸引头2089的下表面上吸附并保持基板的后表面的基板保持装置中，基板保持装置装配有位于外部的环状基板吸入部2095 抽吸头2089的下表面的圆周和环形真空吸附衬底的后表面，并且防止和密封处理溶液从衬底的后表面中的真空吸附部分穿透到内部，并且 推动器2100将吸附在基板抽吸部2095上的基板沿着与吸头2089分离的方向按压。（C）2008，JPO＆INPIT