摘要:
PROBLEM TO BE SOLVED: To provide a resistive random access memory device and an integrated circuit device, which achieve high speed and low power consumption. SOLUTION: The resistive random access memory device has: a memory chip using a resistive random access memory cell; and a heater which imparts a temperature bias for accelerating state change of the memory cell to the memory chip. COPYRIGHT: (C)2009,JPO&INPIT
摘要:
PROBLEM TO BE SOLVED: To provide a system and method to identify regions where voltage supplied by the power distribution network of an IC chip is too low (or too high). SOLUTION: Virtually uniform voltage is impressed on the power surface of the power distribution network connected to the IC chip. A plurality of current sources distributed over the chip are turned on. Voltage in a plurality of positions on the chip is sought. When the current source is turned on, a clock that works freely on a clock tree distributed over the chip becomes effective, and the operation of a function logic inside the IC is prohibited. COPYRIGHT: (C)2009,JPO&INPIT
摘要:
PROBLEM TO BE SOLVED: To provide systems and methods for detecting phase-locked loop circuit lock, in particular, a lock detector configured to detect PLL stability for user-defined period of the time, prior to asserting of a PLL-lock-detected output. SOLUTION: Stability may be indicated by a counter, inserted into a PLL circuit and arranged between a phase-frequency detector and a charge pump. Because the counter value is acted on by the phase-frequency detector, PLL lock is indicated by counter value stability. The digital counter value can be provided to a digital charge pump and a lock detector simultaneously. The lock detector includes registers and difference detectors, to determine when the difference between counter values is below user-defined tolerance. The lock detector can include a variable timer to avoid false indications of lock, which may occur when counter values are sampled with the same frequency as a fluctuation frequency of the counter value. COPYRIGHT: (C)2007,JPO&INPIT
摘要:
PROBLEM TO BE SOLVED: To provide a semiconductor storage device which effectively prevents memory cells from being erroneously set after a reset operation in a memory cell. SOLUTION: The semiconductor storage device includes a reset pulse-control circuit RSTCTL which applies a reset voltage Vreset to a selected bit line BL. The reset pulse-control circuit RSTCTL includes: a signal-output circuit SOUT which outputs a signal FLGRST on the basis of a current Ireset and a reference current Irefrst which each flow through a selected memory cell MC; and a current-holding circuit IMEM which holds a current which flows through the selected bit line or a wire electrically connected to a bit line for a predetermined time. The signal-output circuit SOUT determines the current Ireset on the basis of a current Ifwd+Ibld which is held by the current-holding circuit IMEM, and the reset pulse-control circuit RSTCTL stops the application of the reset voltage Vreset to the selected bit line BL on the basis of the signal FLGRST. COPYRIGHT: (C)2010,JPO&INPIT
摘要:
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device which increases margin reducing a random pattern, and secures withstanding voltage, even when microfabrication advances. SOLUTION: The semiconductor integrated circuit device includes: a memory cell array 11; a sense circuit 12; a first hook up region F1 equipped with at least a first transfer transistor TF1-1 in which one end of a current path is connected to the sense circuit and another end is electrically connected to one first bit wire among a plurality of bit wires and a second transfer transistor TF1-2 in which one end of the current path is connected to the sense circuit and another end is electrically connected to one second bit wire among a plurality of bit wires; and a second hook up region F2 being arranged between the memory cell array and the first hook up region, equipped with at least a third transfer transistor TF2-1, in which one end of the current path is electrically connected to the first bit wire and another end is electrically connected to the one end of the current path of the first transfer transistor. COPYRIGHT: (C)2009,JPO&INPIT
摘要:
PROBLEM TO BE SOLVED: To provide a resistance change memory device improved in data retention characteristics in storing multi-value data. SOLUTION: The resistance change memory device is constituted so that memory cells for storing rewritable resistance values in a nonvolatile state as data, and a high resistance side of the memory cell is in the stable state, and the multi-value data is stored, wherein at least three resistance values R0, R1 and R2 (R0 ΔR2 is satisfied. COPYRIGHT: (C)2009,JPO&INPIT
摘要:
PROBLEM TO BE SOLVED: To reduce the latency of data transfer between memory cells by enabling data to be transferred directly between sense amplifiers in the memory system. SOLUTION: The memory system uses a conventional DRAM memory structure having a pair of first-level sense amplifier, a second-level sense amplifier, and control logic for the sense amplifiers. Each of the sense amplifiers is configured to be selectively coupled to a data line. In a direct transfer mode, the control logic generates control signals that cause the sense amplifiers to transfer data from a first one of the first-level sense amplifiers (a source sense amplifier) top the second-level sense amplifier, and from there to a second one of the first-level sense amplifiers (a destination sense amplifier). The structure of these sense amplifiers is conventional, and the operation of the system is enabled by modified control logic. COPYRIGHT: (C)2008,JPO&INPIT
摘要:
PROBLEM TO BE SOLVED: To provide a countermeasure technique against heat that takes into account local temperature distribution at the time of actual operation.SOLUTION: A semiconductor memory comprises: a memory cell array that is provided with a plurality of blocks disposed in a matrix of n×m (where both of n and m are natural numbers equal to or more than 2) and allows respective ones of the plurality of blocks to independently perform operation of writing, reading or erasure; and a control section that performs a first cycle for performing the operation of writing, reading or erasure with respect to a first block out of the plurality of blocks and performs a second cycle for setting the inside of a range with a constant distance from the first block to a selection prohibition region, setting regions other than a selection region out of the plurality of blocks to a second block and performing the operation of writing, reading or erasure with respect to the second block until temperature relaxation time for relaxing a temperature in and around the first block increased by performing the first cycle elapses.
摘要:
PROBLEM TO BE SOLVED: To provide a resistive random access memory device which allows simultaneous multi-bit writing. SOLUTION: The resistive random access memory device includes a cell array having a plurality of parallel word lines WL (WL1, WL2, ...), a plurality of bit lines BL (BL1, BL2, ...) intersecting with the word lines, and resistive random access memory cells disposed on intersection parts of the word lines and the bit lines and allowing reversible setting of resistance; a word line driving circuit which provides a selective driving voltage to a selected word line selected from among the plurality of word lines of the cell array; and a bit line driving circuit which drives the plurality of bit lines so as to simultaneously set both a set mode where a transition from a first resistance state to a second resistance state is caused and a reset mode where a transition from the second resistance state to the first resistance state on the memory cells selected by the selected word line. COPYRIGHT: (C)2009,JPO&INPIT
摘要:
PROBLEM TO BE SOLVED: To provide a system and a method for increasing a voltage to be supplied in a predetermined region in an integrated circuit. SOLUTION: The system includes an integrated circuit chip. A power source supply network is connected to the integrated circuit chip and includes a plurality of metal wire layers and a plurality of via layers. An electric power plane is connected to the power source supply network and divided into two or more portions individually connected to distinct power source supply networks. The power source is connected to a portion of the electric power plane and configured so as to apply a first voltage to a first portion of the portion and also apply a second voltage, different from the first voltage, to a second portion of the portion. The first and second voltages are selected so as to generate a substantially uniform voltage across the integrated circuit chip. The metal wire layers are arranged alternately with the vias. The electric power supply network further includes a contact layer that connects the uppermost metal layer of the metal layers to the electric power plane. COPYRIGHT: (C)2008,JPO&INPIT