POSITIVE PHOTOSENSITIVE RESIN COMPOSITION

    公开(公告)号:JP2002040651A

    公开(公告)日:2002-02-06

    申请号:JP2000224104

    申请日:2000-07-25

    发明人: TAKAGI YOSHIHIRO

    摘要: PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is developable with an alkaline aqueous solution, having high sensitivity and capable of easily forming a patterned thin film of superior various characteristics such as flatness, high resolution, developability, heat and chemical resistances, adhesion to a substrate, transparency and insulation performance, to provide a photosensitive resin composition, capable of easily forming a patterned thin film of superior low dielectric property and in these various characteristics, and to provide a pattern-forming method using the composition. SOLUTION: The positive photosensitive resin composition contains a fluorine- containing copolymer obtained by copolymerizing tetrafluoroethylene, a carboxyl- containing monomer and a monomer copolymerizable with these, a 1,2- naphthoquinonediazido-containing compound and a crosslinker. In the pattern- forming method, the positive photosensitive resin composition is applied and subjected successively to first exposure, development, second exposure and heating, with the quantity of light in the second exposure being 2-15 times that in the first exposure.