Abstract:
A supported or self-supporting electrochemical transistor device comprises active element having a transistor channel made of organic material that has an ability of altering its conductivity through change of redox state. A solidified electrolyte is interposed between the active element and a gate electrode to prevent electron flow which is controllable by a voltage applied to the gate electrode(s). An electrochemical transistor device comprises source and drain contacts (1, 2), gate electrode(s) (4), electrochemically active element (3) and solidified electrolyte (5). The active element is in direct contact with and arranged between the source and drain contacts. It comprises a transistor channel made of organic material having the ability of altering its conductivity through change of redox state. The electrolyte is in electrical contact with and interposed between the active element and the gate electrode so that flow of electrons is prevented between the active element and the gate electrode. The flow of electrons between source contact and drain contact is controllable by a voltage applied to the gate electrode(s). An Independent claim is also included for a process of producing the above supported electrochemical transistor device.
Abstract:
A buried gate region, a buried gate contact region and a gate contact region are provided on an SiC substrate. Thereby, a depletion layer expands in the channel region, and a high withstand voltage is attained in the normally off state. By applying a voltage of the built-in voltage or less to a gate, the depletion layer in the channel region becomes narrower and an ON-state resistance becomes low. Furthermore, when a voltage of the built-in voltage or more is applied to the gate, holes are injected from the gate so as to cause the conductivity modulation, and the ON-state resistance becomes further low.
Abstract:
A transistor operated by changing the electrostatic potential of an island disposed between two tunnel junctions. The transistor has an island of material which has a band gap (e.g. semiconductor material). Source and drain contacts are provided. The transistor has a first tunnel junction barrier disposed between island and source, and a second tunnel junction barrier disposed between island and drain. The island is Ohmically isolated from other parts of the transistor as well as a substrate. A gate electrode is capacitively coupled to the island so that a voltage applied to the gate can change the potential of the island. The transistor has n- and p-type embodiments. In operation, applying a gate voltage lowers (e.g., for positive gate bias) or raises (e.g., for negative gate bias) the conduction band and valence band of the island. When the conduction band or valence band aligns with the Fermi energy of the source and drain, tunneling current can pass between the source, island and drain.
Abstract:
The invention relates to a semiconductor structure for controlling a current (I), comprising a first n-conductive semiconductor region (2), a current path that runs within the first semiconductor region (2) and a channel region (22). The channel region (22) forms part of the first semiconductor region (2) and comprises a base doping. The current (I) in the channel region (22) can be influenced by means of at least one depletion zone (23, 24). The channel region (22) contains an n-conductive channel region (225) for conducting the current, said latter region having a higher level of doping than the base doping. The conductive channel region (225) is produced by ionic implantation in an epitaxial layer (262) that surrounds the channel region (22).
Abstract:
PROBLEM TO BE SOLVED: To provide a process for manufacturing a fin-type FET transistor structure, in which a fin is reduced in thickness in the transistor body region. SOLUTION: In a fin-type FET integrated circuit, a fin is reduced in thickness in the body region and increased in thickness in the S/D region outside a body to improve the electrical conductivity. The thickness is increased by epitaxial deposition; while the lower part of a gate is covered with a gate cover layer, and the gate is prevented from increasing in thickness at the fin level. Thus, the gate can be shortened relative to the S/D. COPYRIGHT: (C)2005,JPO&NCIPI