专利检索 ap:("恰巴克有限公司" OR "CHIPPAC, INC.") AND inv:"鄭泰福" 第 1 页

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发明专利
多晶片引線架封裝有权
简体标题：多芯片引线架封装

公开(公告)号：TWI404184B

公开(公告)日：2013-08-01

申请号：TW094136371

申请日：2005-10-18

申请人： 恰巴克有限公司 , CHIPPAC, INC.

发明人： 河宗佑 , HA, JONGWOO , 鄭泰福 , JUNG, TAEBOK

IPC分类号： H01L23/495 , H01L21/60

CPC分类号： H01L24/32 , H01L23/3107 , H01L23/49503 , H01L23/4951 , H01L23/49548 , H01L23/49575 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0652 , H01L25/0657 , H01L25/105 , H01L2224/32145 , H01L2224/32188 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/4826 , H01L2224/49 , H01L2224/73265 , H01L2225/06562 , H01L2225/06568 , H01L2225/1029 , H01L2225/1058 , H01L2924/00014 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01052 , H01L2924/01073 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599