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公开(公告)号：TWI455774B
公开(公告)日：2014-10-11
申请号：TW100131825
申请日：2011-09-02
Applicant: 賀利氏材料科技公司 , HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
Inventor： 沙法 麥克 , 史密特 渥夫岡 , SCHMITT, WOLFGANG
CPC classification number: B22F1/0062 , B22F1/007 , B22F1/0074 , B22F1/02 , B22F7/064 , B22F7/08 , C09D4/00 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/05571 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05664 , H01L2224/05669 , H01L2224/27003 , H01L2224/271 , H01L2224/27436 , H01L2224/27442 , H01L2224/27505 , H01L2224/29294 , H01L2224/29295 , H01L2224/29324 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29369 , H01L2224/29387 , H01L2224/2939 , H01L2224/29424 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29464 , H01L2224/29469 , H01L2224/2949 , H01L2224/32225 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/83203 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83464 , H01L2224/83469 , H01L2224/8384 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/01042 , H01L2924/01044 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/01046 , H01L2924/00 , H01L2924/01028 , H01L2224/05552
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2.发明专利用於接觸電子組件之接觸裝置及方法 CONTACTING MEANS AND METHOD FOR CONTACTING ELECTRICAL COMPONENTS 失效用于接触电子组件之接触设备及方法 CONTACTING MEANS AND METHOD FOR CONTACTING ELECTRICAL COMPONENTS
公开(公告)号：TW201215469A
公开(公告)日：2012-04-16
申请号：TW100131825
申请日：2011-09-02
Applicant: 賀利氏材料科技公司
CPC classification number: B22F1/0062 , B22F1/007 , B22F1/0074 , B22F1/02 , B22F7/064 , B22F7/08 , C09D4/00 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/05571 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05664 , H01L2224/05669 , H01L2224/27003 , H01L2224/271 , H01L2224/27436 , H01L2224/27442 , H01L2224/27505 , H01L2224/29294 , H01L2224/29295 , H01L2224/29324 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29369 , H01L2224/29387 , H01L2224/2939 , H01L2224/29424 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29464 , H01L2224/29469 , H01L2224/2949 , H01L2224/32225 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/83203 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83464 , H01L2224/83469 , H01L2224/8384 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/01042 , H01L2924/01044 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/01046 , H01L2924/00 , H01L2924/01028 , H01L2224/05552
Abstract: 本發明提供連接至少兩個組件之方法，其中使用燒結預製件。該預製件包含有一表面具有至少一個含有硬化糊狀物之結構元件之載體，其中該硬化糊狀物含有(a)金屬粒子，該等金屬粒子具有含有至少一種有機化合物之塗層，及(b)至少一種燒結助劑，該燒結助劑選自由下列組成之群：(b1)有機過氧化物，(b2)無機過氧化物，(b3)無機酸，(b4)有機酸之鹽，其中該等有機酸具有1個至4個碳原子，(b5)有機酸之酯，其中該等有機酸具有1個至4個碳原子，及(b6)羰基錯合物，且該載體之具有該硬化糊狀物之該表面不與該糊狀物之該等成份反應。
Abstract in simplified Chinese: 本发明提供连接至少两个组件之方法，其中使用烧结预制件。该预制件包含有一表面具有至少一个含有硬化煳状物之结构组件之载体，其中该硬化煳状物含有(a)金属粒子，该等金属粒子具有含有至少一种有机化合物之涂层，及(b)至少一种烧结助剂，该烧结助剂选自由下列组成之群：(b1)有机过氧化物，(b2)无机过氧化物，(b3)无机酸，(b4)有机酸之盐，其中该等有机酸具有1个至4个碳原子，(b5)有机酸之酯，其中该等有机酸具有1个至4个碳原子，及(b6)羰基错合物，且该载体之具有该硬化煳状物之该表面不与该煳状物之该等成份反应。
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公开(公告)号：TWI496634B
公开(公告)日：2015-08-21
申请号：TW100131801
申请日：2011-09-02
Applicant: 賀利氏材料科技公司 , HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
Inventor： 沙法 麥克 , 史密特 渥夫岡 , SCHMITT, WOLFGANG
CPC classification number: B23K35/025 , B22F1/0055 , B22F1/0062 , B22F1/0074 , B22F7/04 , B22F2001/0066 , B23K35/3006 , B23K35/3616 , B23K35/3618 , B23K35/365 , H01L24/29 , H01L24/83 , H01L2224/29339 , H01L2224/8384 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/07811 , H01L2924/10253 , H01L2924/12041 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/3512 , H01L2924/00
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4.发明专利脂肪族烴及石蠟於經燒結銀糊狀物中作為溶劑之用途 USE OF ALIPHATIC HYDROCARBONS AND PARAFFINS AS SOLVENTS IN SINTERED SILVER PASTES 失效脂肪族烃及石蜡于经烧结银煳状物中作为溶剂之用途 USE OF ALIPHATIC HYDROCARBONS AND PARAFFINS AS SOLVENTS IN SINTERED SILVER PASTES
公开(公告)号：TW201215468A
公开(公告)日：2012-04-16
申请号：TW100131801
申请日：2011-09-02
Applicant: 賀利氏材料科技公司
CPC classification number: B23K35/025 , B22F1/0055 , B22F1/0062 , B22F1/0074 , B22F7/04 , B22F2001/0066 , B23K35/3006 , B23K35/3616 , B23K35/3618 , B23K35/365 , H01L24/29 , H01L24/83 , H01L2224/29339 , H01L2224/8384 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/07811 , H01L2924/10253 , H01L2924/12041 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/3512 , H01L2924/00
Abstract: 本發明提供將電子組件固定至基板之方法，其中(i)提供電子組件及基板，(ii)產生夾心式配置，該配置具有該電子組件、該基板及配置於其間之層，該層包括含有以下物質之糊狀物：(a)金屬粒子，該等金屬粒子具有包含至少一種選自由脂肪酸、脂肪酸鹽及脂肪酸酯組成之群之化合物的塗層，及(b)至少一種脂肪族烴化合物，且(iii)對該夾心式配置進行燒結。
Abstract in simplified Chinese: 本发明提供将电子组件固定至基板之方法，其中(i)提供电子组件及基板，(ii)产生夹心式配置，该配置具有该电子组件、该基板及配置于其间之层，该层包括含有以下物质之煳状物：(a)金属粒子，该等金属粒子具有包含至少一种选自由脂肪酸、脂肪酸盐及脂肪酸酯组成之群之化合物的涂层，及(b)至少一种脂肪族烃化合物，且(iii)对该夹心式配置进行烧结。
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