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公开(公告)号：TW201742216A
公开(公告)日：2017-12-01
申请号：TW106106481
申请日：2017-02-24
发明人： 曽我恭子 , SOGA, KYOKO , 淺井聡 , ASAI, SATOSHI
IPC分类号： H01L23/488 , H01L23/522 , G03F7/26
CPC分类号： H01L25/0657 , C08G59/621 , C08G59/623 , C08G77/18 , C08G77/52 , C08L63/00 , C08L83/14 , G03F7/038 , G03F7/0382 , G03F7/0757 , H01L21/563 , H01L21/78 , H01L23/296 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L25/50 , H01L2224/0345 , H01L2224/0346 , H01L2224/0401 , H01L2224/05147 , H01L2224/05647 , H01L2224/05655 , H01L2224/11002 , H01L2224/11334 , H01L2224/1146 , H01L2224/1147 , H01L2224/11901 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13116 , H01L2224/13147 , H01L2224/13155 , H01L2224/1329 , H01L2224/13291 , H01L2224/133 , H01L2224/13393 , H01L2224/16148 , H01L2224/271 , H01L2224/2741 , H01L2224/27416 , H01L2224/27422 , H01L2224/27436 , H01L2224/27618 , H01L2224/27848 , H01L2224/29011 , H01L2224/2919 , H01L2224/73104 , H01L2224/73204 , H01L2224/8114 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/81204 , H01L2224/81815 , H01L2224/81986 , H01L2224/83048 , H01L2224/83075 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83203 , H01L2224/83204 , H01L2224/83862 , H01L2224/83986 , H01L2224/9211 , H01L2224/92125 , H01L2224/92143 , H01L2224/94 , H01L2225/06513 , H01L2225/06565 , H01L2225/06568 , H01L2924/00015 , H01L2924/3511 , H01L2924/381 , H01L2924/3841 , H01L2224/48 , H01L2224/83102 , H01L2924/00012 , H01L2924/00014 , H01L2924/0665 , H01L2924/01006 , H01L2924/0105 , H01L2924/01047 , H01L2924/01051 , H01L2224/11 , H01L2224/81 , H01L2224/83 , H01L2224/81201 , C08L83/04
摘要： 本發明提供基板彼此或基板與元件之接著良好，且該等之電性連接亦良好之半導體裝置之製造方法。 該半導體裝置之製造方法具有下述步驟：準備設有焊墊或設有焊墊進而設有栓柱之第1基板與設有栓柱之第2基板或元件之步驟；於第1基板之焊墊或栓柱及第2基板或元件之栓柱之至少一者上形成焊料球之步驟；以感光性絕緣層覆蓋第1基板之焊墊形成面及第2基板或元件之栓柱形成面之至少一者的步驟；於由感光性絕緣層覆蓋後之基板或元件中之焊墊或栓柱上，以微影術形成開口之步驟；通過開口使第2基板或元件之栓柱透過焊料球壓接接合於第1基板之焊墊或栓柱之步驟；藉由烘烤使第1基板之焊墊或栓柱與第2基板或元件之栓柱電性連接之步驟；及藉由烘烤使感光性絕緣層硬化之步驟。
简体摘要： 本发明提供基板彼此或基板与组件之接着良好，且该等之电性连接亦良好之半导体设备之制造方法。 该半导体设备之制造方法具有下述步骤：准备设有焊垫或设有焊垫进而设有栓柱之第1基板与设有栓柱之第2基板或组件之步骤；于第1基板之焊垫或栓柱及第2基板或组件之栓柱之至少一者上形成焊料球之步骤；以感光性绝缘层覆盖第1基板之焊垫形成面及第2基板或组件之栓柱形成面之至少一者的步骤；于由感光性绝缘层覆盖后之基板或组件中之焊垫或栓柱上，以微影术形成开口之步骤；通过开口使第2基板或组件之栓柱透过焊料球压接接合于第1基板之焊垫或栓柱之步骤；借由烘烤使第1基板之焊垫或栓柱与第2基板或组件之栓柱电性连接之步骤；及借由烘烤使感光性绝缘层硬化之步骤。
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公开(公告)号：TWI595062B
公开(公告)日：2017-08-11
申请号：TW101138290
申请日：2012-10-17
发明人： 本田一尊 , HONDA, KAZUTAKA , 永井朗 , NAGAI, AKIRA , 佐藤慎 , SATOU, MAKOTO
IPC分类号： C09J163/00 , C09J11/06 , C08K5/11 , H01L21/56
CPC分类号： C09J11/06 , B23K35/3613 , B23K35/3618 , B23K35/362 , C08K5/092 , C09J163/00 , H01L21/563 , H01L23/295 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L25/0657 , H01L2224/03825 , H01L2224/0401 , H01L2224/051 , H01L2224/05111 , H01L2224/05116 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05575 , H01L2224/0558 , H01L2224/056 , H01L2224/05611 , H01L2224/05616 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/11825 , H01L2224/13025 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13575 , H01L2224/1358 , H01L2224/136 , H01L2224/13611 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/16145 , H01L2224/16148 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/17181 , H01L2224/271 , H01L2224/27416 , H01L2224/27436 , H01L2224/27848 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/29387 , H01L2224/2939 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/73104 , H01L2224/81011 , H01L2224/81121 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/8121 , H01L2224/81815 , H01L2224/81895 , H01L2224/81907 , H01L2224/831 , H01L2224/83191 , H01L2224/83203 , H01L2224/83855 , H01L2224/83862 , H01L2224/9205 , H01L2224/92122 , H01L2224/92125 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H05K3/305 , H05K3/3436 , H05K2201/0367 , H05K2201/10977 , Y02P70/613 , H01L2924/00012 , H01L2924/014 , H01L2924/00014 , H01L2224/8385 , H01L2924/00 , C08L63/00 , H01L2224/27 , H01L2924/01047 , H01L2924/01082 , H01L2924/01083 , H01L2924/01029 , H01L2224/11 , H01L2924/0001
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公开(公告)号：TWI570798B
公开(公告)日：2017-02-11
申请号：TW101131334
申请日：2012-08-29
申请人： 迪思科股份有限公司 , DISCO CORPORATION
发明人： 北原信康 , KITAHARA, NOBUYASU
IPC分类号： H01L21/304
CPC分类号： B23K26/18 , B23K26/36 , B23K26/40 , B23K2203/172 , H01L21/3065 , H01L21/67092 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/29 , H01L2221/68377 , H01L2224/27436 , H01L2224/2919 , H01L2224/83191 , H01L2224/94 , H01L2924/12042 , H01L2224/27 , H01L2924/0665 , H01L2924/00
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公开(公告)号：TWI553745B
公开(公告)日：2016-10-11
申请号：TW101131072
申请日：2012-08-27
发明人： 倍森 葛羅葛瑞 , BASIN, GRIGORIY , 艾波勒 約翰 愛德華 , EPLER, JOHN EDWARD , 馬丁 保羅 史考特 , MARTIN, PAUL SCOTT
IPC分类号： H01L21/50
CPC分类号： H01L33/48 , H01L21/6836 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L33/005 , H01L33/0079 , H01L33/0095 , H01L33/22 , H01L33/50 , H01L33/501 , H01L33/505 , H01L33/507 , H01L2224/0345 , H01L2224/0346 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05644 , H01L2224/05647 , H01L2224/27436 , H01L2224/29191 , H01L2224/32225 , H01L2224/83005 , H01L2224/8309 , H01L2224/83097 , H01L2224/83191 , H01L2224/83209 , H01L2224/94 , H01L2924/12041 , H01L2924/12042 , H01L2924/15788 , H01L2933/0091 , H01L2924/00014 , H01L2224/27 , H01L2224/83 , H01L2924/01074 , H01L2924/00
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公开(公告)号：TW201618267A
公开(公告)日：2016-05-16
申请号：TW104133175
申请日：2015-10-08
申请人： 艾馬克科技公司 , AMKOR TECHNOLOGY, INC.
发明人： 朴東久 , PARK, DONG JOO , 朴傑森 , PARK, JAE SUNG , 金錦雄 , KIM, JIN SEONG , 元秋亨 , YOON, JU HOON
IPC分类号： H01L23/538
CPC分类号： H01L24/32 , H01L23/3128 , H01L23/49838 , H01L23/5385 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/105 , H01L25/50 , H01L2224/131 , H01L2224/16145 , H01L2224/16146 , H01L2224/16227 , H01L2224/27436 , H01L2224/29006 , H01L2224/29294 , H01L2224/29344 , H01L2224/29386 , H01L2224/2939 , H01L2224/29393 , H01L2224/294 , H01L2224/32058 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/81447 , H01L2224/81815 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83385 , H01L2224/83851 , H01L2224/92 , H01L2224/92125 , H01L2224/92225 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/107 , H01L2225/1094 , H01L2924/15311 , H01L2924/15313 , H01L2924/15331 , H01L2924/18161 , H01L2924/3511 , H01L2924/014 , H01L2924/00014 , H01L2924/01006 , H01L2224/16 , H01L21/56 , H01L21/304 , H01L2224/27 , H01L2224/83 , H01L2924/00
摘要： 一種堆疊的半導體封裝以及一種製造其之方法。例如且非限制性的，此揭露內容的各種特點係提供一種半導體封裝，其中一上方的中介體及/或封裝係利用一包括導電的微粒的黏著構件以電性及機械地耦接至一下方的封裝。
简体摘要： 一种堆栈的半导体封装以及一种制造其之方法。例如且非限制性的，此揭露内容的各种特点系提供一种半导体封装，其中一上方的中介体及/或封装系利用一包括导电的微粒的黏着构件以电性及机械地耦接至一下方的封装。
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公开(公告)号：TWI532807B
公开(公告)日：2016-05-11
申请号：TW103143571
申请日：2014-12-12
申请人： LG化學股份有限公司 , LG CHEM, LTD.
发明人： 金榮國 , KIM, YOUNG KOOK , 金思拉 , KIM, SE RA , 金熹正 , KIM, HEE JUNG , 曺正鎬 , JO, JUNG HO , 李光珠 , LEE, KWANG JOO , 金丁鶴 , KIM, JUNG HAK , 南承希 , NAM, SEUNG HEE
IPC分类号： C09J183/04 , C09J11/06 , C09J133/10 , C09J4/02 , C09J7/02 , B32B27/00 , B32B7/06 , B32B37/12 , B32B38/00 , H01L21/683 , H01L21/301
CPC分类号： C09J11/08 , C09J5/00 , C09J7/20 , C09J133/00 , C09J2201/128 , C09J2201/606 , C09J2203/326 , C09J2205/302 , C09J2205/31 , C09J2433/00 , C09J2463/00 , C09J2475/00 , C09J2483/00 , H01L21/26 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/92 , H01L24/94 , H01L2221/68336 , H01L2221/68377 , H01L2221/68381 , H01L2224/27003 , H01L2224/271 , H01L2224/27436 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/83203 , H01L2224/83204 , H01L2224/83862 , H01L2224/92 , H01L2224/92247 , H01L2224/94 , H01L2924/00014 , H01L2924/3512 , H01L2924/0665 , H01L2224/27 , H01L2924/00012 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
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公开(公告)号：TW201611198A
公开(公告)日：2016-03-16
申请号：TW104111292
申请日：2015-04-08
申请人： 阿爾發金屬公司 , ALPHA METALS, INC.
发明人： 戈夏爾夏密克 , GHOSHAL, SHAMIK , 恰奇尼馬雅庫瑪 , CHAKI, NIRMALYA KUMAR , 羅伊寶拉米希谷帕塔 , ROY, POULAMI SENGUPTA , 沙卡蘇利 , SARKAR, SIULI , 魯斯托基安紐布哈弗 , RUSTOGI, ANUBHAV
CPC分类号： H01L24/29 , B22F1/0003 , B22F1/0014 , B22F1/0074 , B22F1/025 , B22F7/04 , B22F2007/047 , B22F2301/255 , B22F2302/45 , B23K1/0016 , B23K35/025 , B23K35/3006 , B23K35/3601 , B23K35/3613 , B23K35/3618 , B23K35/365 , B23K2201/40 , B23K2203/56 , H01B1/22 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/50 , H01L51/5246 , H01L2224/0401 , H01L2224/04026 , H01L2224/05155 , H01L2224/05644 , H01L2224/11003 , H01L2224/1132 , H01L2224/11334 , H01L2224/131 , H01L2224/13339 , H01L2224/13347 , H01L2224/13355 , H01L2224/13387 , H01L2224/1339 , H01L2224/13439 , H01L2224/1349 , H01L2224/13499 , H01L2224/16227 , H01L2224/27003 , H01L2224/271 , H01L2224/27332 , H01L2224/27436 , H01L2224/27505 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29387 , H01L2224/2939 , H01L2224/29439 , H01L2224/2949 , H01L2224/29499 , H01L2224/32145 , H01L2224/32146 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/81075 , H01L2224/81192 , H01L2224/81203 , H01L2224/8121 , H01L2224/8184 , H01L2224/81948 , H01L2224/83075 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/8321 , H01L2224/83439 , H01L2224/83447 , H01L2224/8384 , H01L2224/83948 , H01L2224/92247 , H01L2224/94 , H01L2924/00014 , H01L2924/0665 , H01L2924/12041 , H01L2924/12044 , H01L2924/1461 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/206 , H01L2924/2064 , H05K3/321 , H01L2924/00012 , H01L2224/83 , H01L2924/0105 , H01L2924/01046 , H01L2924/01047 , H01L2924/01029 , H01L2924/01028 , H01L2924/0103 , H01L2924/0493 , H01L2924/01004 , H01L2224/27 , H01L2924/01074 , H01L2224/81 , H01L2224/11436 , H01L2224/11 , H01L2224/45099 , H01L2924/00
摘要： 一種燒結粉末，包含：平均最長尺寸從100nm至50μm的第一類型金屬顆粒。
简体摘要： 一种烧结粉末，包含：平均最长尺寸从100nm至50μm的第一类型金属颗粒。
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公开(公告)号：TW201533198A
公开(公告)日：2015-09-01
申请号：TW104101197
申请日：2015-01-14
申请人： 東麗股份有限公司 , TORAY INDUSTRIES, INC.
发明人： 小田拓郎 , ODA, TAKURO , 金森大典 , KANAMORI, DAISUKE , 野中敏央 , NONAKA, TOSHIHISA
IPC分类号： C09J179/08 , C09J163/00 , C09J11/04 , C09J7/02 , H01L21/60 , H01L23/48 , H01L23/52
CPC分类号： C09J9/02 , C08G73/106 , C08G2170/00 , C09D163/00 , C09J7/20 , C09J163/00 , C09J179/08 , C09J2203/326 , C09J2205/102 , C09J2463/00 , C09J2479/00 , C09J2479/08 , H01L21/6836 , H01L23/293 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/68377 , H01L2224/1134 , H01L2224/1146 , H01L2224/131 , H01L2224/13147 , H01L2224/16145 , H01L2224/16227 , H01L2224/27003 , H01L2224/271 , H01L2224/2731 , H01L2224/2732 , H01L2224/2741 , H01L2224/27416 , H01L2224/27436 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/29387 , H01L2224/29388 , H01L2224/2939 , H01L2224/29499 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/81203 , H01L2224/81204 , H01L2224/81801 , H01L2224/81907 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83204 , H01L2224/83862 , H01L2224/83907 , H01L2224/83948 , H01L2224/9211 , H01L2224/94 , H01L2225/06513 , H05K3/321 , H01L2924/00014 , H01L2924/014 , H01L2924/0665 , H01L2924/05442 , H01L2924/00012 , H01L2224/27 , H01L2224/81 , H01L2224/83 , H01L2924/00 , C08L1/00 , H01L2924/07025 , H01L2924/05432 , H01L2924/05341 , H01L2924/05042 , H01L2924/0503 , H01L2924/01005 , H01L2924/05032 , H01L2924/0498 , H01L2924/01026 , H01L2924/053 , H01L2924/049 , H01L2924/0544 , H01L2924/01006
摘要： 本發明提供一種在形成有裂紋的狀態下的強度優異的接著組成物，所述接著組成物的特徵在於：含有(A)聚醯亞胺、(B)多官能環氧化合物、(C)環氧硬化劑及(D)無機粒子，並且非揮發性有機成分中的所述(A)聚醯亞胺的比例為3.0重量%以上、30重量%以下，非揮發性有機成分中的所述(C)環氧硬化劑的比例為0.5重量%以上、10重量%以下，且將非揮發性有機成分的總克數設為T，將非揮發性有機成分中的環氧基的莫耳數設為M，則T/M為400以上、8000以下。
简体摘要： 本发明提供一种在形成有裂纹的状态下的强度优异的接着组成物，所述接着组成物的特征在于：含有(A)聚酰亚胺、(B)多官能环氧化合物、(C)环氧硬化剂及(D)无机粒子，并且非挥发性有机成分中的所述(A)聚酰亚胺的比例为3.0重量%以上、30重量%以下，非挥发性有机成分中的所述(C)环氧硬化剂的比例为0.5重量%以上、10重量%以下，且将非挥发性有机成分的总克数设为T，将非挥发性有机成分中的环氧基的莫耳数设为M，则T/M为400以上、8000以下。
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公开(公告)号：TWI493632B
公开(公告)日：2015-07-21
申请号：TW101111657
申请日：2008-09-12
申请人： 星科金朋有限公司 , STATS CHIPPAC LTD.
发明人： 杜拜泰 , DO, BYUNG TAI , 沈一權 , SHIM, IL KWON , 帝瑪挪 安東尼奧B 二世 , DIMAANO, ANTONIO B. JR. , 關協和 , KUAN, HEAP HOE
CPC分类号： H01L23/4951 , H01L21/568 , H01L21/6835 , H01L23/3107 , H01L23/49513 , H01L23/49548 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/27436 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83191 , H01L2224/83856 , H01L2224/85 , H01L2224/92247 , H01L2924/00014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
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公开(公告)号：TWI484297B
公开(公告)日：2015-05-11
申请号：TW100123506
申请日：2011-07-04
申请人： 東麗股份有限公司 , TORAY INDUSTRIES, INC.
发明人： 松村和行 , MATSUMURA, KAZUYUKI , 田原香菜子 , TAHARA, KANAKO , 仁王宏之 , NIWA, HIROYUKI , 稻垣力 , INAGAKI, CHIKARA
IPC分类号： G03F7/037 , C09J179/08 , C09J7/00 , C09J11/06 , H01L21/52
CPC分类号： G03F7/031 , C08G59/68 , C08G73/1039 , C08G73/1042 , C08G73/1046 , C08G73/1053 , C08G73/106 , C08L79/08 , C08L2312/06 , C09J163/00 , H01L21/563 , H01L23/293 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2224/0401 , H01L2224/05644 , H01L2224/13144 , H01L2224/16225 , H01L2224/16227 , H01L2224/274 , H01L2224/27436 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/29388 , H01L2224/73104 , H01L2224/73204 , H01L2224/75 , H01L2224/81204 , H01L2224/83204 , H01L2224/838 , H01L2225/06513 , H01L2225/06568 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01056 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/1461 , H01L2924/15787 , H01L2924/15788 , C08L63/00 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/05341 , H01L2924/05432 , H01L2924/05442 , H01L2924/05032 , H01L2924/0503 , H01L2924/05042 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
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