公开(公告)号：US4080513A

公开(公告)日：1978-03-21

申请号：US628086

申请日：1975-11-03

申请人： Edward A. Cuneo ,  Makoto Kato ,  Michael S. Wilson ,  Aaron L. Pinkerton

发明人： Edward A. Cuneo ,  Makoto Kato ,  Michael S. Wilson ,  Aaron L. Pinkerton

IPC分类号： H05K1/03 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  H05K1/00

CPC分类号： H05K3/107 ,  H05K3/381 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2203/0565 ,  H05K3/002 ,  H05K3/108 ,  H05K3/181 ,  H05K3/184

摘要： The present invention is directed to a method of preparing a substrate to improve the adherence of a metallic coating to the substrate and the product thereof. More particularly, a method of manufactiring a molded circuit board and unique circuit board produced thereby, is disclosed. A molding compound, such as an epoxy resin is blended with a plating additive, such as calcium carbonate that is relatively inert to the molding compound. The blended mix can then be molded into a desired shape which, for a printed circuit board, can be a relatively flat plate configuration with a recessed groove and hole formation pattern. The high relief areas of the circuit board can be masked with a protective material. The plating additive can then be chemically etched from the grooved recessed area and holes, for example, by a hydrochloric acid bath. Appropriate catalyst and accelerators can be applied to the recessed groove pattern before the protective mask material is removed. In one embodiment, an electroless plating nickel material can be deposited to permit it to penetrate the interstices or cavity pattern, left in the recessed groove and hole pattern by the etching of the plating additive. Copper can then be applied to the nickel pattern in the recessed grooves, for example, by dipping the substrate in an electroless plating copper solution. The substrate is heated to cure the epoxy resin for mechanically locking the metallic coating in the interstices, or cavities, left by the etching of the plating additive.

摘要翻译： 本发明涉及一种制备基材以改善金属涂层对基材及其产品的粘附性的方法。 更具体地，公开了一种制造模制电路板的方法和由此制造的独特的电路板。 将诸如环氧树脂的模塑料与对模塑料相对惰性的电镀添加剂如碳酸钙混合。 然后将混合的混合物模制成所需的形状，对于印刷电路板，其可以是具有凹槽和孔形成图案的相对平坦的板构造。 电路板的高浮雕区域可以用保护材料掩蔽。 然后可以从凹槽凹槽区域和孔中化学蚀刻电镀添加剂，例如通过盐酸浴。 在保护掩模材料被去除之前，可以将合适的催化剂和促进剂施加到凹槽图案。 在一个实施例中，可以沉积化学镀镍材料，以允许其通过蚀刻电镀添加剂来渗透留在凹槽中的间隙或空腔图案。 然后可以通过将衬底浸入无电镀铜溶液中来将铜施加到凹槽中的镍图案上。 加热衬底以固化环氧树脂，用于通过蚀刻电镀添加剂将金属涂层机械地锁定在间隙或空腔中。