公开(公告)号：US5425754A

公开(公告)日：1995-06-20

申请号：US207740

申请日：1994-03-08

申请人： Werner Braun ,  Asim Maner ,  Jerry Rzeznik

发明人： Werner Braun ,  Asim Maner ,  Jerry Rzeznik

IPC分类号： A61N5/06

CPC分类号： A61N5/06

摘要： In an infrared radiation lamp, the optical path has provided therein a cuvette which is filled with a liquid containing water and a fungicidal agent. The cuvette consists of two opposite transparent panes and a casing receiving said panes. The liquid inside the cuvette is a buffer solution with a pH of 7, preferably based on phosphate.

摘要翻译： 在红外线辐射灯中，光路中设置有充满含有水和杀真菌剂的液体的比色皿。 试管由两个相对的透明窗玻璃和一个容纳所述窗格的外壳组成。 比色皿内的液体是pH为7的缓冲溶液，优选基于磷酸盐。

公开(公告)号：US5055163A

公开(公告)日：1991-10-08

申请号：US452456

申请日：1989-12-18

申请人： Wilhelm Bier ,  Asim Maner ,  Klaus Schubert

发明人： Wilhelm Bier ,  Asim Maner ,  Klaus Schubert

IPC分类号： C25D1/04 ,  C25D1/00 ,  C25D1/08 ,  C25D1/10

CPC分类号： C25D1/10

摘要： The invention relates to a process for producing a two-dimensionally extending metallic microstructure body having a multitude of minute openings the dimensions and distribution of which may be predetermined. A tool having microstructures on the surface thereof, which microstructures taper outwardly, is pressed into the electrically insulating layer of a molding material comprising an electrically insulating layer and an electrically conducting layer, so that the microstructures project at least through the insulating layer, to form an impression in the molding material. The tool is withdrawn from the molding material to form an impression in the molding material comprised of openings which taper in the direction of the electrically conducting layer. The impression of the molding material is electroplated with a metal to fill the openings with metal to form a two-dimensionally extending metallic microstructure having adjacent metal fillings and minute openings, by filling the openings in the impression to a height at which the distance between adjacent fillings corresponds at the surface of the fillings to the predetermined dimensions of the two-dimensionally extending metallic microstructure. The molding material is removed from the two-dimensionally extending metallic microstructure.

摘要翻译： 本发明涉及一种用于生产二维延伸的金属微结构体的方法，该微结构体具有多个微小开口，其尺寸和分布可以被预先确定。 在其表面上具有微结构的工具，其微结构向外渐缩，被压入包含电绝缘层和导电层的成型材料的电绝缘层中，使得微结构至少突出通过绝缘层形成 造型材料的印象。 该工具从成型材料中取出，以在由导电层的方向上逐渐变细的开口的模制材料中形成印模。 模塑材料的印模用金属电镀以用金属填充开口，以形成具有相邻金属填充物和微小开口的二维延伸的金属微结构，通过将印模中的开口填充到相邻的 填充物在填充物的表面处对应于二维延伸的金属微结构体的预定尺寸。 从二维延伸的金属微结构中去除模制材料。

公开(公告)号：US5240587A

公开(公告)日：1993-08-31

申请号：US908479

申请日：1992-07-06

申请人： Asim Maner

发明人： Asim Maner

IPC分类号： B01D39/00 ,  B01D39/10 ,  B01D39/20 ,  B01D67/00 ,  B01D71/02

CPC分类号： B01D67/0069 ,  B01D39/10 ,  B01D67/0058 ,  B01D71/02 ,  B01D2325/04 ,  B01D2325/26

摘要： The present invention relates to a method of producing a filter material and to a filter material produced by the described method. The method comprises the steps of providing a substrate and forming an electrically conductive structure on the substrate. Electrical insulating, fiber-like flock rods are then anchored to the substrate. A metal layer is then formed over the substrate and around the flock rods by electrodepositing. The substrate is separated from the electrodeposited metal layer and the flock rods are removed from the electrodeposited metal layer to produce a metal filter with microapertures traversing the thickness of the filter.

摘要翻译： 本发明涉及一种生产过滤材料的方法以及通过所述方法生产的过滤材料。 该方法包括以下步骤：在衬底上提供衬底并形成导电结构。 然后将电绝缘，纤维状的植绒棒锚定到基底。 然后通过电沉积在基材上和金属片周围形成金属层。 将基底与电沉积的金属层分离，并且从电沉积的金属层移除羊群以产生穿过过滤器厚度的微孔的金属过滤器。

公开(公告)号：US5213849A

公开(公告)日：1993-05-25

申请号：US794545

申请日：1991-11-19

申请人： Asim Maner

发明人： Asim Maner

IPC分类号： C25D5/02 ,  C25D1/08 ,  C25D7/00 ,  G03F7/12

CPC分类号： C25D1/08 ,  G03F7/12

摘要： A method of producing a flat, reinforced article with micro-openings is described wherein at least one reinforcing layer is applied to a basic layer. To be able to carry out such a method in an easy and inexpensive way, the following steps should be taken: Coating a prefabricated basic layer at both sides with a radiosensitive resist in such a way that the resist fills the micro-openings, irradiating the basic layer provided with the resist from one side in such a way that the radiation passes through the resist in the micro-openings, removing the resist from the basic-layer regions to be provided with the reinforcing layer, applying the reinforcing layer and subsequently removing the remaining resist.

摘要翻译： 描述了一种制造具有微孔的扁平增强制品的方法，其中至少一个加强层施加到基层。 为了能够以简单且廉价的方式进行这种方法，应采取以下步骤：在两面用无辐射抗蚀剂涂覆预制的基层，使得抗蚀剂填充微孔，照射 基底层从一侧设置有抗辐射体，使得辐射通过微孔中的抗蚀剂，从基层区域移除抗蚀剂以提供加强层，施加增强层，随后除去 剩下的抗拒。

公开(公告)号：US5045439A

公开(公告)日：1991-09-03

申请号：US452018

申请日：1989-12-18

申请人： Asim Maner ,  Jurgen Mohr

发明人： Asim Maner ,  Jurgen Mohr

IPC分类号： B81C1/00 ,  C25D1/00 ,  C25D1/10 ,  C25D5/02 ,  G03F7/00 ,  G03F7/12 ,  G03F7/20

CPC分类号： B82Y15/00 ,  G03F7/12 ,  G03F7/2022

摘要： A process for the lithographic manufacture of electroformable microstructure having a triangular or trapezoidal cross-section from a resist material.A composite body is provided which is comprised of a layer of resist material on an electrically conductive substrate. The resist layer is irradiated to form irradiated band regions in the resist layer by conducting a first irradiation in which the substrate having the resist layer thereon is positioned at an angle of +.alpha. relative to a plane orthogonal to the incident radiation to form a first set of band-shaped regions, and a second irradiation in which the substrate is positioned at an angle of -.alpha. relative to a plane orthogonal to the incident radiation to form a second set of band-shaped regions which overlap the first set at the interface between the resist layer and the substrate. The irradiated regions of the resist layer are developed to produce microstructures.

摘要翻译： 用于光刻制造可抗蚀材料具有三角形或梯形横截面的可电铸微结构的方法。 提供了一种复合体，其由导电基底上的抗蚀剂材料层构成。 照射抗蚀剂层，通过进行第一次照射，在其上具有抗蚀剂层的基板相对于与入射的辐射正交的平面相对于+α的角度进行第一次照射，从而形成照射的带状区域，形成第一组 以及第二照射，其中所述基板相对于与所述入射辐射正交的平面成α角，以形成第二组带状区域，所述第二组带状区域与所述第一组在所述第一组之间的界面处重叠 抗蚀剂层和基材。 抗蚀剂层的照射区域被显影以产生微结构。

公开(公告)号：US4661212A

公开(公告)日：1987-04-28

申请号：US903304

申请日：1986-09-03

申请人： Wolfgang Ehrfeld ,  Peter Hagmann ,  Asim Maner ,  Dietrich Munchmeyer ,  Erwin Becker

发明人： Wolfgang Ehrfeld ,  Peter Hagmann ,  Asim Maner ,  Dietrich Munchmeyer ,  Erwin Becker

IPC分类号： C25D1/08 ,  B01D59/18 ,  B81C1/00 ,  C25D1/10

CPC分类号： B81C99/008 ,  C25D1/10 ,  B81C2201/0128 ,  B81C2201/032 ,  B81C2201/034

摘要： In order to produce a plurality of plate shaped metal bodies containing a microstructure from a single molding tool constituting a master for the bodies, a negative mold is formed by filling the recesses in the microstructure of the tool with electrically insulating material and fastening to the insulating material an electrically conductive material which contacts the end faces of the microstructure of the tool.

摘要翻译： 为了从构成主体的主体的单个模具中生产包含微结构的多个板状金属体，通过用电绝缘材料填充工具的微观结构中的凹部并将其紧固到绝缘体上而形成负模具 材料是与工具的微结构的端面接触的导电材料。

公开(公告)号：US4981558A

公开(公告)日：1991-01-01

申请号：US452030

申请日：1989-12-18

申请人： Asim Maner

发明人： Asim Maner

IPC分类号： C25D1/02 ,  C25D1/10

CPC分类号： C25D1/10

摘要： A process for reproducing a structured, plate-shaped body, comprising the steps of: (a) providing a composite body containing an electrically insulating molding compound layer and an electrically conducting molding compound layer, (b) pressing a first microstructured body, having an outer face, into the electrically insulating molding compound layer while applying ultrasound so that the outer face of the first microstructured body projects into the electrically conducting layer, (c) removing the first microstructured body from the composite body while applying ultrasound to form an impression in the composite body, (d) electroplating a metal into the impression in the composite body to fill the impression with metal and form a second microstructured body, and (e) removing the composite body from the second microstructured body.

摘要翻译： 一种用于再现结构化的板状体的方法，包括以下步骤：（a）提供包含电绝缘模塑料层和导电模塑料层的复合体，（b）压制第一微结构体，具有 外表面，同时施加超声波，使得第一微结构体的外表面突出到导电层中，（c）从复合体中移除第一微结构体同时施加超声波以形成印象 复合体，（d）将金属电镀到复合体中的印模中以用金属填充印模并形成第二微结构体，以及（e）从第二微结构体去除复合体。

公开(公告)号：US4698285A

公开(公告)日：1987-10-06

申请号：US898081

申请日：1986-08-20

申请人： Wolfgang Ehrfeld ,  Asim Maner ,  Dietrich Munchmeyer

发明人： Wolfgang Ehrfeld ,  Asim Maner ,  Dietrich Munchmeyer

IPC分类号： G03F1/22 ,  H01L21/027 ,  G03F9/00

CPC分类号： G03F1/22 ,  Y10S430/143 ,  Y10S430/168

摘要： A method for producing a mask for deep-etch x-ray lithography in which the mask pattern of a thin-film mask having thin absorber structures is transferred by recopying with soft X-ray radiation to an X-ray resist layer whose layer thickness corresponds to the thickness of the absorber structures of the mask to be subsequently produced. Transfer errors during recopying are avoided by producing the thin-film mask directly on one side of a carrier membrane; applying a positive X-ray resist layer on the other side of the carrier membrane; irradiating the positive X-ray resist layer with approximately parallel X-ray radiation through the thin-film mask to produce irradiated portions in the positive X-ray resist layer; removing the irradiated portions of the positive X-ray resist layer to expose portions of the carrier membrane; electrolytically depositing elements having a high atomic number, e.g., heavy metals, onto the exposed portions of the carrier membrane, removing the remaining resist material and etching away the thin-film mask.

摘要翻译： 一种用于深蚀刻x射线光刻的掩模的制造方法，其中具有薄吸收体结构的薄膜掩模的掩模图案通过用软X射线辐射重新转印到层厚对应的X射线抗蚀剂层 相对于随后产生的掩模的吸收体结构的厚度。 通过在载体膜的一侧直接制造薄膜掩模来避免再生过程中的转移误差; 在载体膜的另一侧上施加正的X射线抗蚀剂层; 通过所述薄膜掩模以大致平行的X射线照射所述正X射线抗蚀剂层，以在所述正X射线抗蚀剂层中产生照射部分; 去除正X射线抗蚀剂层的照射部分以暴露载体膜的部分; 电解沉积具有高原子序数的元素（例如重金属）到载体膜的暴露部分上，去除剩余的抗蚀剂材料并蚀刻掉薄膜掩模。