公开(公告)号：US20100147567A1

公开(公告)日：2010-06-17

申请号：US12226872

申请日：2007-08-28

申请人： Hirohisa Hino ,  Taro Fukui ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Takayuki Higuchi

发明人： Hirohisa Hino ,  Taro Fukui ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Takayuki Higuchi

IPC分类号： H05K1/09 ,  B23K35/34

CPC分类号： C08K13/02 ,  C08K5/09 ,  C22C12/00 ,  C22C28/00 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/10636 ,  H05K2201/10977 ,  Y02P70/611 ,  Y10T428/31511 ,  C08L63/00

摘要： The object of the invention is to provide a thermosetting resin composition which, in packaging an electronic circuit containing components incapable of withstanding elevated temperatures, employs low-melting solder particles, thereby enabling batch ref lowing and enabling packaging of components with excellent strength and toughness.The invention relates to a thermosetting resin composition which includes a metal filler component, a fluxing component and a thermosetting resin binder. The metal filler component includes at least one of bismuth (Bi) and indium (In), and tin (Sn). The fluxing component, which at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used. In the above formulas, R1 to R6 are each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond π electrons and is capable of coordinating with a metal.

摘要翻译： 本发明的目的是提供一种热固性树脂组合物，其在包含不能耐高温的组分的电子电路中使用低熔点焊料颗粒，从而能够批量降低并且能够包装具有优异的强度和韧性的组分。 本发明涉及包含金属填料组分，助熔组分和热固性树脂粘合剂的热固性树脂组合物。 金属填料组分包括铋（Bi）和铟（In）和锡（Sn）中的至少一种。 使用以下结构式（1）的化合物和下述结构式（2）的化合物中的至少一种的助熔组分。 在上式中，R 1〜R 6各自为氢或烷基，X为具有单电子对或双键的有机基团。 电子并且能够与金属配位。

公开(公告)号：US06469074B1

公开(公告)日：2002-10-22

申请号：US09577612

申请日：2000-05-25

申请人： Hirohisa Hino ,  Taro Fukui ,  Kenji Kitamura ,  Shinji Hashimoto ,  Naoki Kanagawa

发明人： Hirohisa Hino ,  Taro Fukui ,  Kenji Kitamura ,  Shinji Hashimoto ,  Naoki Kanagawa

IPC分类号： C08K336

CPC分类号： C08G73/065 ,  C08G59/4014 ,  C08G59/4284 ,  Y10T428/31511

摘要： Disclosed is a liquid epoxy resin composition for sealing a semiconductor device which comprises (A) a cyanic acid ester, (B) an epoxy resin, (C) an inorganic filler, (D) a metal chelate and/or a metal salt, and at least one of (E1) an acid anhydride, (E2) a dihydrazide compound and (F) a silicone resin gel, wherein at least one of components A and B is liquid at room temperature, component E1 is liquid at room temperature, and the weight ratio of component C to the total weight of the composition, the weight ratio of component A to component B, and the weight ratio of component E1, E2 or F to the total weight of the composition except component C each ranges a specific ratio.

摘要翻译： 公开了一种用于密封半导体器件的液体环氧树脂组合物，其包含（A）氰酸酯，（B）环氧树脂，（C）无机填料，（D）金属螯合物和/或金属盐，以及 （E1）酸酐，（E2）二酰肼化合物和（F）有机硅树脂凝胶中的至少一种，其中组分A和B中的至少一种在室温下为液体，组分E1在室温下为液体， 组分C与组合物总重量的重量比，组分A与组分B的重量比以及组分E1，E2和F与组合物除外的组合物总重量的重量比分别为特定比例 。

公开(公告)号：US06224674B1

公开(公告)日：2001-05-01

申请号：US09317616

申请日：1999-05-25

申请人： Hirohisa Hino ,  Taro Fukui ,  Kenji Kitamura

发明人： Hirohisa Hino ,  Taro Fukui ,  Kenji Kitamura

IPC分类号： B05C1706

CPC分类号： H01L21/56 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2924/01039 ,  H01L2924/00014

摘要： Seal coating mask for semiconductor element and method of use thereof with a seal coating mask with an opening located at a position where a semiconductor element is mounted on a wiring board. The coating mask has an annular protrusion formed along the whole periphery of the opening. A clearance of about 0.01 to 0.5 mm is formed between at least a part of the whole periphery of the annular protrusion and the front surface of the wiring board. The coating mask also includes a space portion formed on the back of the seal coating mask for cutting off cooling material outside of the annular protrusion. The coating mask is used to forcibly coat a material for sealing the semiconductor element in the front surface of the wiring board.

摘要翻译： 用于半导体元件的密封涂层掩模及其使用方法，其中密封涂层掩模具有位于布线板上的半导体元件安装位置的开口。 涂层掩模具有沿着开口的整个周边形成的环形突起。 在环形突起的整个周边的至少一部分和布线基板的前表面之间形成约0.01至0.5mm的间隙。 涂覆掩模还包括形成在密封涂层掩模的背面上的空间部分，用于切除环形突起外部的冷却材料。 涂布掩模用于强制地涂覆用于密封布线板的前表面中的半导体元件的材料。