Abstract:
According to an aspect of one embodiment, it is provided that semiconductor memory device determining a data read time required to read data from a memory cell by an operation to read a replica cell to which a replica bit line having a load equivalent to a bit line to be connected to the memory cell and a replica word line are connected, the semiconductor memory device comprising: a write control signal generating unit that includes logic gates coupled in multi stages for receiving an input of a replica word line activating signal generated in response to a driving signal for driving the replica word line, the write control signal generating unit generating a write control signal to determine a data write time required to write data in the memory cell based on the replica word line activating signal.
Abstract:
There is intended to provide a semiconductor integrated circuit device capable of lowering the power consumption during data-write operation, enhancing operation speed, and reducing noises for stable operation. In the semiconductor integrated circuit, an active signal ACT to be inputted to a sense amplifier signal circuit SC1 is latched by a command latch circuit and outputted to a terminal N11. The terminal N11 outputs a control signal EDC1 via a timing adjusting circuit. The control signal EDC1 works to output a sense amplifier activating signal LE via a timing adjusting circuit and output buffer circuit and at the same time, the control signal EDC1 is outputted to a column switch signal circuit CS1. From the Column switch signal circuit CS1, a pulse signal is outputted via input of a control signal ACL, a pulse output circuit, and a terminal N13. In a logical circuit, AND processing is conducted between the pulse signal and an inversion signal of the control signal EDC1. Through a decode circuit, a resultant signal is outputted as switch signal CL, or CLM.
Abstract:
The present invention provides a synchronous semiconductor device suitable for improving the efficiency of application of electrical stresses to the device, an inspection system and an inspection method thereof in order to efficiently carrying out a burn-in stress test. A command latch circuit having an access command input will output a low-level pulse in synchronism with an external clock. The pulse will pass through a NAND gate of test mode sequence circuit and a common NAND gate to output a low-level internal precharge signal, which will reset a word line activating signal from the control circuit. Simultaneously, an internal precharge signal passing through the NAND gate will be delayed by an internal timer a predetermined period of time to output through the NAND gate a low-level internal active signal, which will set a word line activating signal from the control circuit.
Abstract:
The present invention provides a synchronous semiconductor device suitable for improving the efficiency of application of electrical stresses to the device, an inspection system and an inspection method thereof in order to efficiently carrying out a burn-in stress test. A command latch circuit having an access command input will output a low-level pulse in synchronism with an external clock. The pulse will pass through a NAND gate of test mode sequence circuit and a common NAND gate to output a low-level internal precharge signal, which will reset a word line activating signal from the control circuit. Simultaneously, an internal precharge signal passing through the NAND gate will be delayed by an internal timer a predetermined period of time to output through the NAND gate a low-level internal active signal, which will set a word line activating signal from the control circuit.
Abstract:
A semiconductor memory device, comprising a fuse circuit which indicates a defective portion in a row direction, and also indicates the defective portion in a column direction, and a control circuit which switches data buses to avoid the defective portion indicated in the column direction by the fuse circuit when the defective portion indicated in the row direction by the fuse circuit corresponds to a row address that is input to the semiconductor memory device.
Abstract:
A wafer-scale semiconductor integrated circuit device includes a wafer, a plurality of chips formed on the wafer, each of the chips having an internal logic circuit, interconnection lines mutually connecting the chips, and clamping circuits which are coupled to chips from among the chips which are located at a periphery of an arrangement of the chips and which prevent the interconnection lines related to the chips located at the periphery from being in a floating state.
Abstract:
A wafer-scale integrated circuit includes a plurality of functional blocks, a plurality of respectively corresponding connection terminals being provided in each of the functional blocks. Respectively corresponding pluralities of layered wirings and bonding wires interconnect predetermined, respective ones of said corresponding connection terminals in parallel for supplying power source and other voltages in common to the plurality of functional blocks. The parallel interconnections by the layered wirings and bonding wires, due to different, respective failure modes, affording increased reliability.
Abstract:
A semiconductor memory device includes two memory cell arrays, a sense amplifier shared by the two memory cell arrays; and a control circuit configured to control data readout from the two memory cell arrays. Each memory cell array includes word lines, two or more bit lines, a dummy word line, memory cells provided at intersections of the bit lines and the word lines, and dummy cells provided at intersections of selected bit lines and the dummy word line. When the control circuit reads data from one memory cell array, the control circuit activates the dummy word line included in the other memory cell array and generates, with the dummy cell included in the other memory cell array, a reference level of the sense amplifier.
Abstract:
The present invention provides a synchronous semiconductor device suitable for improving the efficiency of application of electrical stresses to the device, an inspection system and an inspection method thereof in order to efficiently carrying out a burn-in stress test. A command latch circuit having an access command input will output a low-level pulse in synchronism with an external clock. The pulse will pass through a NAND gate of test mode sequence circuit and a common NAND gate to output a low-level internal precharge signal, which will reset a word line activating signal from the control circuit. Simultaneously, an internal precharge signal passing through the NAND gate will be delayed by an internal timer a predetermined period of time to output through the NAND gate a low-level internal active signal, which will set a word line activating signal from the control circuit.
Abstract:
The present invention provides a synchronous semiconductor device suitable for improving the efficiency of application of electrical stresses to the device, an inspection system and an inspection method thereof in order to efficiently carry out a burn-in stress test. A command latch circuit having an access command input will output a low-level pulse in synchronism with an external clock. The pulse will pass through a NAND gate of test mode sequence circuit and a common NAND gate to output a low-level internal precharge signal, which will resent a word line activating signal from the control circuit. Simultaneously, an internal precharge signal passing through the NAND gate will be delayed by an internal timer a predetermined period of time to output through the NAND gate a low-level internal active signal, which will set a word line activating signal from the control circuit.