公开(公告)号：US08157001B2

公开(公告)日：2012-04-17

申请号：US11731484

申请日：2007-03-30

Applicant: James Hom ,  Girish Upadhya ,  Douglas E. Werner ,  Mark Munch ,  Paul Tsao ,  Bruce Conway ,  Peng Zhou ,  Richard Brewer

Inventor： James Hom ,  Girish Upadhya ,  Douglas E. Werner ,  Mark Munch ,  Paul Tsao ,  Bruce Conway ,  Peng Zhou ,  Richard Brewer

IPC: G05D23/00 ,  F28F7/00

CPC classification number: H05K7/20281 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. A pump is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a programmable controller connect the an air-mover, pump and temperature sensing device.

Abstract translation: 集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。 耦合到第一层是附接有多个空气翅片的第二层。 泵连接到流体路径，形成用于使流体循环通过第一层的封闭路径。 在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。 在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。 另外，流体路径可以包括微通道板结构。 该系统可以包括一个可编程控制器，连接一个空气推动器，泵和温度检测装置。

公开(公告)号：US20090046423A1

公开(公告)日：2009-02-19

申请号：US12221961

申请日：2008-08-07

Applicant: James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Douglas E. Werner ,  Norman Chow ,  Adrian Correa ,  Brandon Leong ,  Sudhakar Gopalakrishnan ,  Richard Grant Brewer ,  Mark McMaster ,  Girish Upadhya

Inventor： James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Douglas E. Werner ,  Norman Chow ,  Adrian Correa ,  Brandon Leong ,  Sudhakar Gopalakrishnan ,  Richard Grant Brewer ,  Mark McMaster ,  Girish Upadhya

IPC: H05K7/20

CPC classification number: H05K7/20736

Abstract: The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer.

Abstract translation: 电子外壳的后面板包括一个或多个热交换器。 后面板可以是冷却门，其被配置为提供对位于电子外壳内的电缆和设备的访问。 可以通过在诸如标准门的铰链上使门打开来提供这种接近。 在具有多个热交换器的情况下，门可以被构造成段，每个热交换器一个段，并且每个段包括铰链，以便独立于其它段打开。 在一些实施例中，每个部分像标准门一样旋转打开。 在其他实施例中，每个段被配置成围绕水平轴向上或向下旋转。 在其他实施例中，每个部分被配置为与电子外壳断开连接，并且移出方向，在这种情况下，每个热交换器使用可以弯曲的方式或快速断开的柔性管连接。 在其他实施例中，整个后门或后门的每个部分可被构造成像抽屉一样滑动和关闭。

公开(公告)号：US20070227708A1

公开(公告)日：2007-10-04

申请号：US11731484

申请日：2007-03-30

Applicant: James Hom ,  Girish Upadhya ,  Douglas E. Werner ,  Mark Munch ,  Paul Tsao ,  Bruce Conway ,  Peng Zhou ,  Richard Brewer

Inventor： James Hom ,  Girish Upadhya ,  Douglas E. Werner ,  Mark Munch ,  Paul Tsao ,  Bruce Conway ,  Peng Zhou ,  Richard Brewer

IPC: H05K7/20

CPC classification number: H05K7/20281 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated cooling system for cooling systems such as laptops or subsystems such as a graphics card is disclosed. An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. The invention includes a pump that is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a includes a programmable controller connect the an air-mover, pump and temperature sensing device. A reservoir can be connected to the fluid path.

Abstract translation: 公开了一种用于诸如笔记本电脑或诸如图形卡的子系统之类的冷却系统的集成冷却系统。 集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。 耦合到第一层是附接有多个空气翅片的第二层。 本发明包括连接到流体路径的泵，其形成用于使流体循环通过第一层的封闭路径。 在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。 在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。 另外，流体路径可以包括微通道板结构。 该系统可以包括一个可编程控制器，连接一个空气推动器，泵和温度检测装置。 储存器可以连接到流体路径。

公开(公告)号：US09297571B1

公开(公告)日：2016-03-29

申请号：US13540015

申请日：2012-07-02

Applicant: Adrian Correa ,  Tien-Chieh (Eric) Lin ,  James Hom ,  Gregory Shiomoto ,  Norman Chow ,  Brandon Leong ,  Richard Grant Brewer ,  Douglas E. Werner ,  Mark McMaster

Inventor： Adrian Correa ,  Tien-Chieh (Eric) Lin ,  James Hom ,  Gregory Shiomoto ,  Norman Chow ,  Brandon Leong ,  Richard Grant Brewer ,  Douglas E. Werner ,  Mark McMaster

IPC: F25D19/02 ,  F25D19/00

CPC classification number: F25D19/00 ,  E05D11/0081 ,  E05Y2800/10 ,  E05Y2900/208 ,  H05K7/20781

Abstract: A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes multiple heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes one or more swivel joints, each configured to provide one or more fluid paths between the cooling door and the frame. The cooling door assembly includes separate and independent fluid paths, where fluid is separately provided to each independent fluid path. Different groups of heat exchangers are coupled to each independent fluid path. In the event of failure of one of the independent fluid paths, the other independent fluid path(s) remain operational.

Abstract translation: 冷却门组件包括框架和联接到框架的冷却门。 冷却门包括多个热交换器。 框架被配置成以这样的方式安装到服务器机架或其他电子机柜的背面，使得冷却门打开以允许访问服务器机架内的电子服务器，同时保持与外部冷却系统的流体连接。 框架联接到外部冷却系统，并且冷却门包括一个或多个旋转接头，每个旋转接头构造成在冷却门和框架之间提供一个或多个流体路径。 冷却门组件包括独立和独立的流体路径，其中流体分别设置到每个独立的流体路径。 不同组的热交换器耦合到每个独立的流体路径。 在独立流体路径中的一个失效的情况下，另一个独立的流体路径保持运行。

公开(公告)号：US07746634B2

公开(公告)日：2010-06-29

申请号：US12221961

申请日：2008-08-07

Applicant: James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Douglas E. Werner ,  Norman Chow ,  Adrian Correa ,  Brandon Leong ,  Sudhakar Gopalakrishnan ,  Richard Grant Brewer ,  Mark McMaster ,  Girish Upadhya

Inventor： James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Douglas E. Werner ,  Norman Chow ,  Adrian Correa ,  Brandon Leong ,  Sudhakar Gopalakrishnan ,  Richard Grant Brewer ,  Mark McMaster ,  Girish Upadhya

IPC: H05K7/20

CPC classification number: H05K7/20736

Abstract: The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer.

Abstract translation: 电子外壳的后面板包括一个或多个热交换器。 后面板可以是冷却门，其被配置为提供对位于电子外壳内的电缆和设备的访问。 可以通过在诸如标准门的铰链上使门打开来提供这种接近。 在具有多个热交换器的情况下，门可以被构造成段，每个热交换器一个段，并且每个段包括铰链，以便独立于其它段打开。 在一些实施例中，每个部分像标准门一样旋转打开。 在其他实施例中，每个段被配置成围绕水平轴向上或向下旋转。 在其他实施例中，每个部分被配置为与电子外壳断开连接，并且移出方向，在这种情况下，每个热交换器使用可以弯曲的方式或快速断开的柔性管连接。 在其他实施例中，整个后门或后门的每个部分可被构造成像抽屉一样滑动和关闭。

公开(公告)号：US07715194B2

公开(公告)日：2010-05-11

申请号：US11784298

申请日：2007-04-06

Applicant: Richard Grant Brewer ,  Norman Chow ,  James Hom

Inventor： Richard Grant Brewer ,  Norman Chow ,  James Hom

IPC: H05K7/20

CPC classification number: G06F1/20 ,  F28D15/0266 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20772 ,  H01L2924/00

Abstract: A cooling system is used to cool heat generating devices within a personal computer. The cooling system has a first fluid loop and an expandable array of one or more second fluid loops. For each of the second fluid loops, heat generating devices transfer heat to fluid flowing through corresponding heat exchanging devices in the loop. Heat is transferred from the fluid in each second fluid loop to a thermal bus of the first fluid loop via a thermal interface. The second fluid loop can be a pumped fluid loop or can include a heat pipe. Within the first fluid loop, a fluid is continuously pumped from the thermal bus to a fluid-to-air heat exchanging system and back to the thermal bus. Heat transferred to the thermal bus from the first fluid loop is transferred to the fluid in the second fluid loop passing through the thermal bus. The heated fluid is pumped through the fluid-to-air heat exchanging system where the heat is transferred from the fluid to the ambient. The thermal bus provides a modular, scalable cooling system which allows for the expansion of cooling capacity without breaking the fluid lines.

Abstract translation: 冷却系统用于冷却个人计算机内的发热装置。 冷却系统具有第一流体回路和一个或多个第二流体回路的可扩展阵列。 对于每个第二流体回路，发热装置将热量传递到流过环路中相应的热交换装置的流体。 热量通过热界面从每个第二流体回路中的流体转移到第一流体回路的热总线。 第二流体回路可以是泵送的流体回路，或者可以包括热管。 在第一流体回路内，流体从热量总线连续泵送到流体对空气热交换系统并返回到热量总线。 从第一流体回路传递到热母线的热量被传递到通过热母线的​​第二流体回路中的流体。 加热的流体被泵送通过流体对空气热交换系统，其中热量从流体传递到环境。 热量总线提供了一个模块化，可扩展的冷却系统，可以在不破坏流体管路的情况下扩展冷却能力。

公开(公告)号：US20070235167A1

公开(公告)日：2007-10-11

申请号：US11784298

申请日：2007-04-06

Applicant: Richard Grant Brewer ,  Norman Chow ,  James Hom

Inventor： Richard Grant Brewer ,  Norman Chow ,  James Hom

IPC: F28D15/00 ,  H01L23/467

CPC classification number: G06F1/20 ,  F28D15/0266 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20772 ,  H01L2924/00

Abstract: A cooling system is used to cool heat generating devices within a personal computer. The cooling system has a first fluid loop and an expandable array of one or more second fluid loops. For each of the second fluid loops, heat generating devices transfer heat to fluid flowing through corresponding heat exchanging devices in the loop. Heat is transferred from the fluid in each second fluid loop to a thermal bus of the first fluid loop via a thermal interface. The second fluid loop can be a pumped fluid loop or can include a heat pipe. Within the first fluid loop, a fluid is continuously pumped from the thermal bus to a fluid-to-air heat exchanging system and back to the thermal bus. Heat transferred to the thermal bus from the first fluid loop is transferred to the fluid in the second fluid loop passing through the thermal bus. The heated fluid is pumped through the fluid-to-air heat exchanging system where the heat is transferred from the fluid to the ambient. The thermal bus provides a modular, scalable cooling system which allows for the expansion of cooling capacity without breaking the fluid lines.

Abstract translation: 冷却系统用于冷却个人计算机内的发热装置。 冷却系统具有第一流体回路和一个或多个第二流体回路的可扩展阵列。 对于每个第二流体回路，发热装置将热量传递到流过环路中相应的热交换装置的流体。 热量通过热界面从每个第二流体回路中的流体转移到第一流体回路的热总线。 第二流体回路可以是泵送的流体回路，或者可以包括热管。 在第一流体回路内，流体从热量总线连续泵送到流体对空气热交换系统并返回到热量总线。 从第一流体回路传递到热母线的热量被传递到通过热母线的​​第二流体回路中的流体。 加热的流体被泵送通过流体对空气热交换系统，其中热量从流体传递到环境。 热量总线提供了一个模块化，可扩展的冷却系统，可以在不破坏流体管路的情况下扩展冷却能力。

公开(公告)号：US20070175621A1

公开(公告)日：2007-08-02

申请号：US11345556

申请日：2006-01-31

Applicant: Madhav Datta ,  Peng Zhou ,  James Hom ,  Mark Munch ,  Mark McMaster

Inventor： Madhav Datta ,  Peng Zhou ,  James Hom ,  Mark Munch ,  Mark McMaster

IPC: H05K7/20

CPC classification number: H01L23/3736 ,  H01L23/3735 ,  H01L23/473 ,  H01L2224/73253

Abstract: A heat exchanging system uses a metallic TIM for efficient heat transfer between a heat source and a heat exchanger. The heat source is preferably an integrated circuit coupled to a circuit board. The metallic TIM preferably comprises indium. The metallic TIM is comprised of either a separate metallic TIM foil or as a deposited layer of metal material. The metallic TIM foil is mechanically joined to a first surface of the heat exchanger and to a first surface of the integrated circuit by applying sufficient pressure during clamping. Disassembly is accomplished by un-clamping the heat exchanger, the metallic TIM foil, and the integrated circuit from each other. Once disassembled, the heat exchanger and the metallic TIM foil are available to be used again. If the metallic TIM is deposited onto the heat exchanger, disassembly yields a heat exchanging sub-assembly that is also reusable.

Abstract translation: 热交换系统使用金属TIM来在热源和热交换器之间进行有效的热传递。 热源优选为耦合到电路板的集成电路。 金属TIM优选包含铟。 金属TIM由单独的金属TIM箔或金属材料的沉积层组成。 金属TIM箔通过在夹紧期间施加足够的压力机械地连接到热交换器的第一表面和集成电路的第一表面。 通过将热交换器，金属TIM箔和集成电路彼此不夹紧来实现拆卸。 一旦分解，热交换器和金属TIM箔可以再次使用。 如果金属TIM沉积在热交换器上，则拆卸产生也是可重复使用的热交换子组件。

公开(公告)号：US20070156645A1

公开(公告)日：2007-07-05

申请号：US11558366

申请日：2006-11-09

Applicant: Keyvan Mohajer ,  Majid Emami ,  Michal Grabowski ,  James Hom

Inventor： Keyvan Mohajer ,  Majid Emami ,  Michal Grabowski ,  James Hom

IPC: G06F17/30

CPC classification number: G06F17/30758 ,  G06F17/30743 ,  G06F17/30749 ,  Y10S707/913 ,  Y10S707/916 ,  Y10S707/99931 ,  Y10S707/99933 ,  Y10S707/99935 ,  Y10S707/99943 ,  Y10S707/99948

Abstract: A method for non-text-based identification of a selected item of stored music. The first broad portion of the method focuses on building a music identification database. That process requires capturing a tag of the selected musical item, and processing the tag to develop reference key to the same. Then the tag is stored, together with the reference key and an association to the stored music. The database is built by collecting a multiplicity of tags. The second broad portion of the method is retrieving a desired item of stored music from the database. That process calls for capturing a query tag from a user, and processing the query tag to develop a query key to the same. The query tag is compared to reference keys stored in the database to identify the desired item of stored music.

Abstract translation: 一种用于存储音乐的所选项目的非基于文本的识别的方法。 该方法的第一大部分重点是建立一个音乐识别数据库。 该过程需要捕获所选择的音乐作品的标签，并处理标签以将参考键打开。 然后，标签与参考键一起存储，并与存储的音乐相关联。 数据库是通过收集多个标签来构建的。 方法的第二大部分是从数据库中检索所需的存储音乐项目。 该过程需要从用户捕获查询标签，并处理查询标签以将查询密钥设置为相同。 将查询标签与存储在数据库中的参考键进行比较，以识别所需的存储音乐项。

公开(公告)号：US07806168B2

公开(公告)日：2010-10-05

申请号：US10698180

申请日：2003-10-30

Applicant: Girish Upadhya ,  Richard Herms ,  Peng Zhou ,  Kenneth Goodson ,  James Hom

Inventor： Girish Upadhya ,  Richard Herms ,  Peng Zhou ,  Kenneth Goodson ,  James Hom

IPC: F28F7/00

CPC classification number: F28F3/02 ,  F04B17/00 ,  F04B19/006 ,  F28D15/0266 ,  F28F3/12 ,  F28F2210/10 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A device, method, and system for a fluid cooled micro-scaled heat exchanger is disclosed. The fluid cooled micro-scaled heat exchanger utilizes a micro-scaled region and a spreader region with a highly thermally conductive material and sized to yield high heat dissipation and transfer area per unit volume from a heat source. The micro-scaled region preferably comprises microchannels.

Abstract translation: 公开了一种用于流体冷却的微型热交换器的装置，方法和系统。 流体冷却的微型热交换器利用具有高导热性材料的微尺度区域和扩散器区域，并且其尺寸适于从热源产生高的每单位体积的散热和转移面积。 微尺度区域优选地包括微通道。