公开(公告)号：US08157001B2

公开(公告)日：2012-04-17

申请号：US11731484

申请日：2007-03-30

申请人： James Hom ,  Girish Upadhya ,  Douglas E. Werner ,  Mark Munch ,  Paul Tsao ,  Bruce Conway ,  Peng Zhou ,  Richard Brewer

发明人： James Hom ,  Girish Upadhya ,  Douglas E. Werner ,  Mark Munch ,  Paul Tsao ,  Bruce Conway ,  Peng Zhou ,  Richard Brewer

IPC分类号： G05D23/00 ,  F28F7/00

CPC分类号： H05K7/20281 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. A pump is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a programmable controller connect the an air-mover, pump and temperature sensing device.

摘要翻译： 集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。 耦合到第一层是附接有多个空气翅片的第二层。 泵连接到流体路径，形成用于使流体循环通过第一层的封闭路径。 在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。 在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。 另外，流体路径可以包括微通道板结构。 该系统可以包括一个可编程控制器，连接一个空气推动器，泵和温度检测装置。

公开(公告)号：US20070227708A1

公开(公告)日：2007-10-04

申请号：US11731484

申请日：2007-03-30

申请人： James Hom ,  Girish Upadhya ,  Douglas E. Werner ,  Mark Munch ,  Paul Tsao ,  Bruce Conway ,  Peng Zhou ,  Richard Brewer

发明人： James Hom ,  Girish Upadhya ,  Douglas E. Werner ,  Mark Munch ,  Paul Tsao ,  Bruce Conway ,  Peng Zhou ,  Richard Brewer

IPC分类号： H05K7/20

CPC分类号： H05K7/20281 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated cooling system for cooling systems such as laptops or subsystems such as a graphics card is disclosed. An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. The invention includes a pump that is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a includes a programmable controller connect the an air-mover, pump and temperature sensing device. A reservoir can be connected to the fluid path.

摘要翻译： 公开了一种用于诸如笔记本电脑或诸如图形卡的子系统之类的冷却系统的集成冷却系统。 集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。 耦合到第一层是附接有多个空气翅片的第二层。 本发明包括连接到流体路径的泵，其形成用于使流体循环通过第一层的封闭路径。 在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。 在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。 另外，流体路径可以包括微通道板结构。 该系统可以包括一个可编程控制器，连接一个空气推动器，泵和温度检测装置。 储存器可以连接到流体路径。

公开(公告)号：US20070256825A1

公开(公告)日：2007-11-08

申请号：US11800303

申请日：2007-05-03

申请人： Bruce Conway ,  Richard Brewer ,  Paul Tsao ,  James Hom ,  Douglas Werner ,  Peng Zhou ,  Girish Upadhya ,  Madhav Datta ,  Ali Firouzi ,  Fredric Landry

发明人： Bruce Conway ,  Richard Brewer ,  Paul Tsao ,  James Hom ,  Douglas Werner ,  Peng Zhou ,  Girish Upadhya ,  Madhav Datta ,  Ali Firouzi ,  Fredric Landry

IPC分类号： G05D23/00 ,  H01L23/467

CPC分类号： G06F1/20 ,  G06F2200/201 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling system includes a cooling unit configured to fit within a single drive bay of a personal computer. The cooling unit includes a fluid-to-air heat exchanger, an air mover, a pump, fluid lines, and control circuitry. The cooling system also includes a cooling loop configured to be coupled to one or more heat generating devices. The cooling loop includes the pump and the fluid-to-air heat exchanger from the cooling unit, and at least one heat exchanger coupled together via flexible fluid lines. The heat exchanger is thermally coupled to the heat generating device. The cooling unit is configured to maintain noise below a specified acoustical specification. To meet this acoustical specification, the size, position, and type of the components within the cooling unit are specifically configured.

摘要翻译： 冷却系统包括被配置为装配在个人计算机的单个驱动器托架内的冷却单元。 冷却单元包括流体对空气热交换器，鼓风机，泵，流体管线和控制电路。 冷却系统还包括被配置为联接到一个或多个发热装置的冷却回路。 冷却回路包括来自冷却单元的泵和流体对空气热交换器，以及通过柔性流体管线连接在一起的至少一个热交换器。 热交换器热耦合到发热装置。 冷却单元被配置为将噪声保持在低于规定声学规范的范围内。 为了达到这种声学规格，冷却装置内的部件的尺寸，位置和类型被特别地配置。

公开(公告)号：US07599184B2

公开(公告)日：2009-10-06

申请号：US11707350

申请日：2007-02-16

申请人： Girish Upadhya ,  Mark Munch ,  Norman Chow ,  Paul Tsao ,  Douglas E. Werner ,  Mark McMaster ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

发明人： Girish Upadhya ,  Mark Munch ,  Norman Chow ,  Paul Tsao ,  Douglas E. Werner ,  Mark McMaster ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

IPC分类号： H05K7/20

CPC分类号： H05K7/20781 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20772 ,  H01L2924/00

摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.

摘要翻译： 液体冷却溶液，用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。 每个电子服务器包括一个或多个发热装置。 集成到每个电子服务器上是一种基于液体的冷却系统。 每个基于液体的冷却系统包括服务器泵和通过流体管线连接在一起的一个或多个微通道冷板（MCP）。 用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP，服务器泵和排料板形成第一个闭环。 排料板通过热界面材料连接到底盘冷板。 在多电子服务器配置中，用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板，流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。

公开(公告)号：US20050269061A1

公开(公告)日：2005-12-08

申请号：US11049313

申请日：2005-02-01

申请人： Richard Brewer ,  Girish Upadhya ,  Peng Zhou ,  Mark McMaster ,  Paul Tsao

发明人： Richard Brewer ,  Girish Upadhya ,  Peng Zhou ,  Mark McMaster ,  Paul Tsao

IPC分类号： H01L23/473 ,  H05K7/20

CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat exchanger includes features for alleviating high pressure drops and controlling the expansion of fluid during freezing. The heat exchanger includes an interface layer in which heat is transferred from a heat source to a fluid. A manifold layer couples to the interface layer. The manifold layer includes a first set of substantially vertical fluid paths for directing the fluid to the interface layer. The manifold layer further includes a second set of substantially horizontal fluid paths, perpendicular to the first set of fluid paths, for removing the fluid from the interface layer. Preferably, the heat exchanger includes an upper layer for circulating the fluid to and from the manifold layer. The upper layer can include at least one of a plurality of protruding features and a porous structure. Preferably, a porous structure is disposed along the interface layer.

摘要翻译： 热交换器包括用于缓解高压降和控制冷冻期间流体膨胀的特征。 热交换器包括热量从热源传递到流体的界面层。 歧管层耦合到界面层。 歧管层包括用于将流体引导到界面层的第一组基本垂直的流体路径。 歧管层还包括垂直于第一组流体路径的第二组基本水平的流体路径，用于从界面层移除流体。 优选地，热交换器包括用于将流体循环到歧管层和从歧管层循环的上层。 上层可以包括多个突出特征和多孔结构中的至少一个。 优选地，多孔结构沿着界面层设置。

公开(公告)号：US20070227709A1

公开(公告)日：2007-10-04

申请号：US11731541

申请日：2007-03-29

申请人： Girish Upadhya ,  Douglas E. Werner ,  Mark Munch

发明人： Girish Upadhya ,  Douglas E. Werner ,  Mark Munch

IPC分类号： H05K7/20

CPC分类号： G06F1/20 ,  F28D1/0408 ,  F28D2021/0028 ,  F28F3/022 ,  F28F2270/00 ,  G06F2200/201 ,  H05K7/20154

摘要： A micro scale cooling system comprises a first heat exchanger thermally coupled to a first heat source. The cooling system also has a second heat exchanger thermally coupled to a second heat source and a connection between the first heat exchanger and the second heat exchanger. A fluid flows through the first and second cooling plates. The cooling system has a first pump for driving the fluid. The cooling system further includes a first radiator and tubing that interconnects the first heat exchanger, the second heat exchanger, the first pump, and the first radiator. The tubing of some embodiments is designed to minimize fluid loss. Some embodiments optionally include a first fan to reject heat from the first radiator, and/or a volume compensator for counteracting fluid loss over time. In some embodiments, at least one heat exchanger has at least one micro scale structure. Some embodiments include a method of cooling the heat sources for a multi device configuration by using such a cooling system.

摘要翻译： 微型冷却系统包括热耦合到第一热源的第一热交换器。 冷却系统还具有热耦合到第二热源的第二热交换器和第一热交换器与第二热交换器之间的连接。 流体流过第一和第二冷却板。 冷却系统具有用于驱动流体的第一泵。 冷却系统还包括第一散热器和连接第一热交换器，第二热交换器，第一泵和第一辐射器的管道。 一些实施例的管道被设计成使流体损失最小化。 一些实施例可选地包括第一风扇以排除来自第一散热器的热量，和/或用于抵消随着时间的流体损失的体积补偿器。 在一些实施例中，至少一个热交换器具有至少一个微尺度结构。 一些实施例包括通过使用这种冷却系统来冷却多器件配置的热源的方法。

公开(公告)号：US20090046423A1

公开(公告)日：2009-02-19

申请号：US12221961

申请日：2008-08-07

申请人： James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Douglas E. Werner ,  Norman Chow ,  Adrian Correa ,  Brandon Leong ,  Sudhakar Gopalakrishnan ,  Richard Grant Brewer ,  Mark McMaster ,  Girish Upadhya

发明人： James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Douglas E. Werner ,  Norman Chow ,  Adrian Correa ,  Brandon Leong ,  Sudhakar Gopalakrishnan ,  Richard Grant Brewer ,  Mark McMaster ,  Girish Upadhya

IPC分类号： H05K7/20

CPC分类号： H05K7/20736

摘要： The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer.

摘要翻译： 电子外壳的后面板包括一个或多个热交换器。 后面板可以是冷却门，其被配置为提供对位于电子外壳内的电缆和设备的访问。 可以通过在诸如标准门的铰链上使门打开来提供这种接近。 在具有多个热交换器的情况下，门可以被构造成段，每个热交换器一个段，并且每个段包括铰链，以便独立于其它段打开。 在一些实施例中，每个部分像标准门一样旋转打开。 在其他实施例中，每个段被配置成围绕水平轴向上或向下旋转。 在其他实施例中，每个部分被配置为与电子外壳断开连接，并且移出方向，在这种情况下，每个热交换器使用可以弯曲的方式或快速断开的柔性管连接。 在其他实施例中，整个后门或后门的每个部分可被构造成像抽屉一样滑动和关闭。

公开(公告)号：US07746634B2

公开(公告)日：2010-06-29

申请号：US12221961

申请日：2008-08-07

申请人： James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Douglas E. Werner ,  Norman Chow ,  Adrian Correa ,  Brandon Leong ,  Sudhakar Gopalakrishnan ,  Richard Grant Brewer ,  Mark McMaster ,  Girish Upadhya

发明人： James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Douglas E. Werner ,  Norman Chow ,  Adrian Correa ,  Brandon Leong ,  Sudhakar Gopalakrishnan ,  Richard Grant Brewer ,  Mark McMaster ,  Girish Upadhya

IPC分类号： H05K7/20

CPC分类号： H05K7/20736

摘要： The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer.

摘要翻译： 电子外壳的后面板包括一个或多个热交换器。 后面板可以是冷却门，其被配置为提供对位于电子外壳内的电缆和设备的访问。 可以通过在诸如标准门的铰链上使门打开来提供这种接近。 在具有多个热交换器的情况下，门可以被构造成段，每个热交换器一个段，并且每个段包括铰链，以便独立于其它段打开。 在一些实施例中，每个部分像标准门一样旋转打开。 在其他实施例中，每个段被配置成围绕水平轴向上或向下旋转。 在其他实施例中，每个部分被配置为与电子外壳断开连接，并且移出方向，在这种情况下，每个热交换器使用可以弯曲的方式或快速断开的柔性管连接。 在其他实施例中，整个后门或后门的每个部分可被构造成像抽屉一样滑动和关闭。

公开(公告)号：US07000684B2

公开(公告)日：2006-02-21

申请号：US10680584

申请日：2003-10-06

申请人： Thomas W. Kenny ,  Mark Munch ,  Peng Zhou ,  James Gill Shook ,  Girish Upadhya ,  Kenneth Goodson ,  Dave Corbin ,  Mark McMaster ,  James Lovette

发明人： Thomas W. Kenny ,  Mark Munch ,  Peng Zhou ,  James Gill Shook ,  Girish Upadhya ,  Kenneth Goodson ,  Dave Corbin ,  Mark McMaster ,  James Lovette

IPC分类号： F28F7/00

CPC分类号： F04B17/00 ,  F04B19/006 ,  F28D15/00 ,  F28D15/0266 ,  F28D21/0015 ,  F28D2021/0029 ,  F28F3/02 ,  F28F3/086 ,  F28F3/12 ,  F28F13/06 ,  F28F13/185 ,  F28F2210/10 ,  F28F2245/04 ,  F28F2260/02 ,  G06Q20/20 ,  H01L23/473 ,  H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.

摘要翻译： 热交换器及其制造方法包括用于冷却热源的界面层。 界面层耦合到热源并被配置成使流体从中流过。 热交换器还包括耦合到界面层的歧管层。 歧管层包括至少一个第一端口，其耦合到第一组个体化的孔，其将流体通过第一组。 歧管层包括耦合到第二组个体化孔的至少一个第二端口，其将流体通过第二组。 第一组孔和第二组孔布置成在第一和第二端口之间提供最小化的流体路径距离，以充分冷却热源。 优选地，第一组中的每个孔定位成与第二组的相邻孔最接近的最佳距离。

公开(公告)号：US07539020B2

公开(公告)日：2009-05-26

申请号：US11707332

申请日：2007-02-16

申请人： Norman Chow ,  Paul Tsao ,  Douglas E. Werner ,  Mark McMaster ,  Girish Upadhya ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

发明人： Norman Chow ,  Paul Tsao ,  Douglas E. Werner ,  Mark McMaster ,  Girish Upadhya ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

IPC分类号： H05K7/16

CPC分类号： H05K7/20781 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20772 ,  H01L2924/00

摘要： A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.

摘要翻译： 安装系统提供了将来自服务器机架的热交换器与来自电子服务器的热交换器热接触的机构和形式因素。 为了确保良好的热接触，在两个热交换器，排料盘和底盘冷板之间施加压力。 用于接合和分离热交换器的安装机构构造成隔离施加到两个热交换器的力。 安装机构包括互锁机构，其防止施加的力传递到电子服务器的其余部分。 在不隔离该力的情况下，该力被施加到电子服务器和/或机架机架，可能断开电子服务器和机架之间的电连接，以及向电子服务器和机架机架提供机械应力。 安装机构还耦合到电子服务器锁定机构，使得将电子服务器锁定到机架中的动作导致热交换器进行热接触。 这是一个故障安全程序，因为不需要单独的过程来接合电子服务器冷却回路。