公开(公告)号：US08157001B2

公开(公告)日：2012-04-17

申请号：US11731484

申请日：2007-03-30

申请人： James Hom ,  Girish Upadhya ,  Douglas E. Werner ,  Mark Munch ,  Paul Tsao ,  Bruce Conway ,  Peng Zhou ,  Richard Brewer

发明人： James Hom ,  Girish Upadhya ,  Douglas E. Werner ,  Mark Munch ,  Paul Tsao ,  Bruce Conway ,  Peng Zhou ,  Richard Brewer

IPC分类号： G05D23/00 ,  F28F7/00

CPC分类号： H05K7/20281 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. A pump is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a programmable controller connect the an air-mover, pump and temperature sensing device.

摘要翻译： 集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。 耦合到第一层是附接有多个空气翅片的第二层。 泵连接到流体路径，形成用于使流体循环通过第一层的封闭路径。 在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。 在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。 另外，流体路径可以包括微通道板结构。 该系统可以包括一个可编程控制器，连接一个空气推动器，泵和温度检测装置。

公开(公告)号：US20070227708A1

公开(公告)日：2007-10-04

申请号：US11731484

申请日：2007-03-30

申请人： James Hom ,  Girish Upadhya ,  Douglas E. Werner ,  Mark Munch ,  Paul Tsao ,  Bruce Conway ,  Peng Zhou ,  Richard Brewer

发明人： James Hom ,  Girish Upadhya ,  Douglas E. Werner ,  Mark Munch ,  Paul Tsao ,  Bruce Conway ,  Peng Zhou ,  Richard Brewer

IPC分类号： H05K7/20

CPC分类号： H05K7/20281 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated cooling system for cooling systems such as laptops or subsystems such as a graphics card is disclosed. An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. The invention includes a pump that is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a includes a programmable controller connect the an air-mover, pump and temperature sensing device. A reservoir can be connected to the fluid path.

摘要翻译： 公开了一种用于诸如笔记本电脑或诸如图形卡的子系统之类的冷却系统的集成冷却系统。 集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。 耦合到第一层是附接有多个空气翅片的第二层。 本发明包括连接到流体路径的泵，其形成用于使流体循环通过第一层的封闭路径。 在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。 在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。 另外，流体路径可以包括微通道板结构。 该系统可以包括一个可编程控制器，连接一个空气推动器，泵和温度检测装置。 储存器可以连接到流体路径。

公开(公告)号：US07599184B2

公开(公告)日：2009-10-06

申请号：US11707350

申请日：2007-02-16

申请人： Girish Upadhya ,  Mark Munch ,  Norman Chow ,  Paul Tsao ,  Douglas E. Werner ,  Mark McMaster ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

发明人： Girish Upadhya ,  Mark Munch ,  Norman Chow ,  Paul Tsao ,  Douglas E. Werner ,  Mark McMaster ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

IPC分类号： H05K7/20

CPC分类号： H05K7/20781 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20772 ,  H01L2924/00

摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.

摘要翻译： 液体冷却溶液，用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。 每个电子服务器包括一个或多个发热装置。 集成到每个电子服务器上是一种基于液体的冷却系统。 每个基于液体的冷却系统包括服务器泵和通过流体管线连接在一起的一个或多个微通道冷板（MCP）。 用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP，服务器泵和排料板形成第一个闭环。 排料板通过热界面材料连接到底盘冷板。 在多电子服务器配置中，用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板，流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。

公开(公告)号：US20070227709A1

公开(公告)日：2007-10-04

申请号：US11731541

申请日：2007-03-29

申请人： Girish Upadhya ,  Douglas E. Werner ,  Mark Munch

发明人： Girish Upadhya ,  Douglas E. Werner ,  Mark Munch

IPC分类号： H05K7/20

CPC分类号： G06F1/20 ,  F28D1/0408 ,  F28D2021/0028 ,  F28F3/022 ,  F28F2270/00 ,  G06F2200/201 ,  H05K7/20154

摘要： A micro scale cooling system comprises a first heat exchanger thermally coupled to a first heat source. The cooling system also has a second heat exchanger thermally coupled to a second heat source and a connection between the first heat exchanger and the second heat exchanger. A fluid flows through the first and second cooling plates. The cooling system has a first pump for driving the fluid. The cooling system further includes a first radiator and tubing that interconnects the first heat exchanger, the second heat exchanger, the first pump, and the first radiator. The tubing of some embodiments is designed to minimize fluid loss. Some embodiments optionally include a first fan to reject heat from the first radiator, and/or a volume compensator for counteracting fluid loss over time. In some embodiments, at least one heat exchanger has at least one micro scale structure. Some embodiments include a method of cooling the heat sources for a multi device configuration by using such a cooling system.

摘要翻译： 微型冷却系统包括热耦合到第一热源的第一热交换器。 冷却系统还具有热耦合到第二热源的第二热交换器和第一热交换器与第二热交换器之间的连接。 流体流过第一和第二冷却板。 冷却系统具有用于驱动流体的第一泵。 冷却系统还包括第一散热器和连接第一热交换器，第二热交换器，第一泵和第一辐射器的管道。 一些实施例的管道被设计成使流体损失最小化。 一些实施例可选地包括第一风扇以排除来自第一散热器的热量，和/或用于抵消随着时间的流体损失的体积补偿器。 在一些实施例中，至少一个热交换器具有至少一个微尺度结构。 一些实施例包括通过使用这种冷却系统来冷却多器件配置的热源的方法。

公开(公告)号：US06988534B2

公开(公告)日：2006-01-24

申请号：US10439635

申请日：2003-05-16

申请人： Thomas W. Kenny ,  Mark Munch ,  Peng Zhou ,  James Gill Shook ,  Girish Upadhya ,  Kenneth Goodson ,  David Corbin

发明人： Thomas W. Kenny ,  Mark Munch ,  Peng Zhou ,  James Gill Shook ,  Girish Upadhya ,  Kenneth Goodson ,  David Corbin

IPC分类号： F28F7/00

CPC分类号： G06Q20/20 ,  F04B17/00 ,  F04B19/006 ,  F28D15/0266 ,  F28D21/0015 ,  F28F3/12 ,  F28F13/06 ,  F28F2210/10 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.

摘要翻译： 一种热交换器装置和制造方法，包括：用于冷却热源并被配置为使流体通过其中的界面层，所述界面层具有适当的导热性和用于向界面层提供流体的歧管层，其中所述歧管层为 被配置为优选地通过冷却界面热点区域来实现热源中的温度均匀性。 多个流体端口被配置到诸如入口和出口的热交换器，由此流体端口被垂直和水平地配置。 歧管层将流体循环到界面层中的预定界面热点区域，其中界面热点区域与热点相关联。 热交换器优选地包括位于界面和歧管层之间的中间层，并且将流体最佳地通向界面热点区域。

公开(公告)号：US07000684B2

公开(公告)日：2006-02-21

申请号：US10680584

申请日：2003-10-06

申请人： Thomas W. Kenny ,  Mark Munch ,  Peng Zhou ,  James Gill Shook ,  Girish Upadhya ,  Kenneth Goodson ,  Dave Corbin ,  Mark McMaster ,  James Lovette

发明人： Thomas W. Kenny ,  Mark Munch ,  Peng Zhou ,  James Gill Shook ,  Girish Upadhya ,  Kenneth Goodson ,  Dave Corbin ,  Mark McMaster ,  James Lovette

IPC分类号： F28F7/00

CPC分类号： F04B17/00 ,  F04B19/006 ,  F28D15/00 ,  F28D15/0266 ,  F28D21/0015 ,  F28D2021/0029 ,  F28F3/02 ,  F28F3/086 ,  F28F3/12 ,  F28F13/06 ,  F28F13/185 ,  F28F2210/10 ,  F28F2245/04 ,  F28F2260/02 ,  G06Q20/20 ,  H01L23/473 ,  H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.

摘要翻译： 热交换器及其制造方法包括用于冷却热源的界面层。 界面层耦合到热源并被配置成使流体从中流过。 热交换器还包括耦合到界面层的歧管层。 歧管层包括至少一个第一端口，其耦合到第一组个体化的孔，其将流体通过第一组。 歧管层包括耦合到第二组个体化孔的至少一个第二端口，其将流体通过第二组。 第一组孔和第二组孔布置成在第一和第二端口之间提供最小化的流体路径距离，以充分冷却热源。 优选地，第一组中的每个孔定位成与第二组的相邻孔最接近的最佳距离。

公开(公告)号：US20070201204A1

公开(公告)日：2007-08-30

申请号：US11707350

申请日：2007-02-16

申请人： Girish Upadhya ,  Mark Munch ,  Norman Chow ,  Paul Tsao ,  Douglas Werner ,  Mark McMaster ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

发明人： Girish Upadhya ,  Mark Munch ,  Norman Chow ,  Paul Tsao ,  Douglas Werner ,  Mark McMaster ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

IPC分类号： H05K7/20

CPC分类号： H05K7/20781 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20772 ,  H01L2924/00

摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.

摘要翻译： 液体冷却溶液，用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。 每个电子服务器包括一个或多个发热装置。 集成到每个电子服务器上是一种基于液体的冷却系统。 每个基于液体的冷却系统包括服务器泵和通过流体管线耦合在一起的一个或多个微通道冷板（MCP）。 用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP，服务器泵和排料板形成第一个闭环。 排料板通过热界面材料连接到底盘冷板。 在多电子服务器配置中，用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板，流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。

公开(公告)号：US07104312B2

公开(公告)日：2006-09-12

申请号：US10698304

申请日：2003-10-30

申请人： Kenneth Goodson ,  Thomas Kenny ,  Peng Zhou ,  Girish Upadhya ,  Mark Munch ,  Mark McMaster ,  James Horn

发明人： Kenneth Goodson ,  Thomas Kenny ,  Peng Zhou ,  Girish Upadhya ,  Mark Munch ,  Mark McMaster ,  James Horn

IPC分类号： F28F7/00

CPC分类号： F28F3/048 ,  F04B19/006 ,  F28D15/00 ,  F28F3/12 ,  F28F2260/02 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane. The method comprises channeling a first temperature fluid to the heat exchanging surface, wherein the first temperature fluid undergoes thermal exchange with the heat source along the heat exchanging surface. The method comprises channeling a second temperature fluid from the heat exchange surface, wherein fluid is channeled to minimize temperature differences along the heat source. The temperature differences are minimized by optimizing and controlling the fluidic and thermal resistances in the heat exchanger. The resistances to the fluid are influenced by size, volume and surface area of heat transferring features, multiple pumps, fixed and variable valves and flow impedance elements in the fluid path, pressure and flow rate control of the fluid, and other factors.

摘要翻译： 一种控制与热交换器的热交换表面接触的热源的温度的方法，其中所述热交换表面沿着平面基本上对齐。 该方法包括将第一温度流体引导到热交换表面，其中第一温度流体沿着热交换表面与热源进行热交换。 该方法包括从热交换表面引导第二温度流体，其中流体被引导以最小化沿着热源的温度差。 通过优化和控制热交换器中的流体和热电阻来最小化温差。 对流体的阻力受传热特征，多个泵，固定和可变阀以及流体路径中的流量阻抗元件，流体的压力和流量控制等因素的尺寸，体积和表面积的影响。

公开(公告)号：US06986382B2

公开(公告)日：2006-01-17

申请号：US10439912

申请日：2003-05-16

申请人： Girish Upadhya ,  Thomas W. Kenny ,  Peng Zhou ,  Mark Munch ,  James Gill Shook ,  Kenneth Goodson ,  David Corbin

发明人： Girish Upadhya ,  Thomas W. Kenny ,  Peng Zhou ,  Mark Munch ,  James Gill Shook ,  Kenneth Goodson ,  David Corbin

IPC分类号： F28F7/00

CPC分类号： F28D15/0266 ,  F04B19/006 ,  F28F3/12 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange region, wherein fluid in the heat exchange region flows toward a second set of fingers and exits the heat exchanger at a second temperature, wherein each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop in the heat exchanger and arranged in parallel. The microchannel heat exchanger includes an interface layer having the heat exchange region. Preferably, a manifold layer includes the first set of fingers and the second set of fingers configured within to cool hot spots in the heat source. Alternatively, the interface layer includes the first set and second set of fingers configured along the heat exchange region.

摘要翻译： 耦合到热源并被构造用于冷却热源的微通道热交换器，其包括用于将第一温度下的流体提供给热交换区域的第一组指状物，其中热交换区域中的流体朝向第二组手指流动， 在第二温度下离开热交换器，其中每个指状物与相邻手指分开适当的尺寸，以最小化热交换器中的压力降并平行布置。 微通道热交换器包括具有热交换区域的界面层。 优选地，歧管层包括第一组指状物，并且第二组指状物构造成用于冷却热源中的热点。 或者，界面层包括沿着热交换区域配置的第一组和第二组手指。

公开(公告)号：US20050211427A1

公开(公告)日：2005-09-29

申请号：US10882142

申请日：2004-06-29

申请人： Thomas Kenny ,  Mark Munch ,  Peng Zhou ,  James Shook ,  Girish Upadhya ,  Kenneth Goodson ,  Dave Corbin

发明人： Thomas Kenny ,  Mark Munch ,  Peng Zhou ,  James Shook ,  Girish Upadhya ,  Kenneth Goodson ,  Dave Corbin

IPC分类号： G05D23/00

CPC分类号： F28F3/048 ,  F28D15/0266 ,  F28F3/12 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.

摘要翻译： 一种热交换器装置和制造方法，包括：用于冷却热源并被配置为使流体通过其中的界面层，所述界面层具有适当的导热性和用于向界面层提供流体的歧管层，其中所述歧管层为 被配置为优选地通过冷却界面热点区域来实现热源中的温度均匀性。 多个流体端口被配置到诸如入口和出口的热交换器，由此流体端口被垂直和水平地配置。 歧管层将流体循环到界面层中的预定界面热点区域，其中界面热点区域与热点相关联。 热交换器优选地包括位于界面和歧管层之间的中间层，并且将流体最佳地通向界面热点区域。