摘要:
An epoxy-silicone mixed resin composition comprising (A) an organopolysiloxane having at least one vinyl or allyl group and at least one hydroxyl group, (B) an organic resin having at least one epoxy group, (C) an organohydrogenpolysiloxane, (D) a platinum group metal-based catalyst, (E) an aluminum compound, and (F) 0.1-15% by weight of an organic mold release agent is molded and cured in a metal mold into a transparent product which can be smoothly removed from the mold. The cured product has a satisfactory bond strength to metal frames and maintains heat resistance. LED devices can be fabricated by continuous mechanical molding.
摘要:
Silicone resin compositions comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds and having a viscosity of 100-1,000,000 mPa·s at 25° C., (B) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms (SiH groups) in the form of HR62SiO-, and (C) a platinum group metal base catalyst cure into colorless transparent parts which are useful lenses.
摘要:
Silicone resin compositions comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds and having a viscosity of 100-1,000,000 mPa·s at 25° C., (B) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms (SiH groups) in the form of HR62SiO—, and (C) a platinum group metal base catalyst cure into colorless transparent parts which are useful lenses.
摘要:
This invention discloses a curable silicone resin composition used for sealing a light-emitting diode device, comprising at least a silicone resin having a refractive index of 1.50˜1.55 after curing and a silicon oxide filler having an average particle diameter of 1˜10 μm dispersed uniformly in the said silicone resin at the concentration of 1˜30 mass % and a light-emitting diode device using the same.
摘要:
Silicone resin compositions comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds, (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (C) a platinum group metal base catalyst, and (D) a mold release agent cure into colorless, transparent, heat resistant parts which can be smoothly released from the mold and used as lenses in LED devices.
摘要:
In the preparation of a semiconductor device comprising a semiconductor member, the semiconductor member is subjected to plasma treatment and then primer treatment, prior to the encapsulation thereof with an encapsulant. The semiconductor device, typically LED package, is highly reliable in that a firm bond is established between the semiconductor member and the encapsulant resin.
摘要:
Silicone resin compositions comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds and having a viscosity of 100-1,000,000 mPa·s at 25° C., (B) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms (SiH groups) in the form of HR62SiO—, and (C) a platinum group metal base catalyst cure into colorless transparent parts which are useful lenses.
摘要:
Disclosed are a curable silicone composition for an LED and an LED light-emitting device that uses such a composition as a sealing material.A curable silicone composition for sealing an LED is disclosed that comprises a phosphor and an inorganic ion exchanger, wherein the quantity of the inorganic ion exchanger is within a range from 0.1 to 50% by mass. This composition is ideal for sealing an LED element in an LED light-emitting device. Corrosion of metal electrodes and the like does not occur even in the presence of red phosphors that contain sulfur.
摘要:
Silicone resin compositions comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds, (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (C) a platinum group metal base catalyst, and (D) a mold release agent cure into colorless, transparent, heat resistant parts which can be smoothly released from the mold and used as lenses in LED devices.
摘要:
A visible light-shielding silicone rubber composition is provided comprising (A) an organopolysiloxane, (B) an organohydrogenpolysiloxane, (C) a platinum catalyst, and (D) an azo dye. The azo dye has a light transmittance≦10% in a wavelength range of up to 650 nm and ≧80% in a wavelength range of at least 750 nm when a solution of the azo dye in ethanol is measured by a spectrophotometer. The composition cures into a film which shields visible light, but transmits IR light and is suited for encapsulation of LED.