Preparation of isocyanurate-containing organosilicon compounds
    4.
    发明授权
    Preparation of isocyanurate-containing organosilicon compounds 失效
    制备含异氰脲酸酯的有机硅化合物

    公开(公告)号:US5239073A

    公开(公告)日:1993-08-24

    申请号:US789370

    申请日:1991-11-08

    CPC classification number: C08G77/54 C07F7/0854 C08G59/3254

    Abstract: The invention relates to isocyanurate-containing, organosilicon compounds of the general formula ##STR1## in which Q=--(CH.sub.2).sub.3 SiR.sub.2 O(SiR.sub.2 O).sub.n SiR.sub.2 R', n is an integer from 0 to 25 and x is an integer from 0 to 10, and the following holds for the residues R and R', which can be the same or different:R=alkyl, cycloalkyl, aryl, arylalkyl or alkylaryl, andR'=an epoxy-functional residue with 4 to 10 C-atoms or a (meth)acrylate-functional residue with at least 6 C-atoms.

    Abstract translation: 本发明涉及通式为“IMAGE”的含异氰脲酸酯的有机硅化合物,其中Q = - (CH2)3SiR2O(SiR2O)nSiR2R',n为0至25的整数,x为0至10的整数, 残基R和R'可以相同或不同:R =烷基,环烷基,芳基,芳烷基或烷基芳基,R'=具有4至10个碳原子的环氧官能残基或 具有至少6个C原子的(甲基)丙烯酸酯官能残基。

    Cooling device for arrangement between two gradient coil windings of a gradient coil
    5.
    发明授权
    Cooling device for arrangement between two gradient coil windings of a gradient coil 有权
    用于在梯度线圈的两个梯度线圈绕组之间布置的冷却装置

    公开(公告)号:US07884606B2

    公开(公告)日:2011-02-08

    申请号:US12037213

    申请日:2008-02-26

    Abstract: In a cooling device for arrangement between two gradient coil windings of a gradient coil for dissipation of the heat (arising upon feeding current to the gradient coil windings) by means of a coolant flowing through one or more coolant channels in the cooling device, two films made of thermoplastic material are connected with one another, and are preformed in a thermal reshaping procedure to form coolant channel sections that are complementary to one another to form an inherently stable coolant channel after the connection.

    Abstract translation: 在冷却装置中,用于通过流过冷却装置中的一个或多个冷却剂通道的冷却剂排出用于散热(产生于梯度线圈绕组的馈电电流)的梯度线圈的两个梯度线圈绕组之间布置两个膜 由热塑性材料制成,并且在热成形过程中预成形,以形成彼此互补的冷却剂通道部分,以在连接之后形成固有稳定的冷却剂通道。

    COOLING DEVICE FOR ARRANGEMENT BETWEEN TWO GRADIENT COIL WINDINGS OF A GRADIENT COIL
    7.
    发明申请
    COOLING DEVICE FOR ARRANGEMENT BETWEEN TWO GRADIENT COIL WINDINGS OF A GRADIENT COIL 有权
    冷却装置,用于梯级线圈的两个梯形线圈绕组之间的安装

    公开(公告)号:US20080204179A1

    公开(公告)日:2008-08-28

    申请号:US12037213

    申请日:2008-02-26

    Abstract: In a cooling device for arrangement between two gradient coil windings of a gradient coil for dissipation of the heat (arising upon feeding current to the gradient coil windings) by means of a coolant flowing through one or more coolant channels in the cooling device, two films made of thermoplastic material are connected with one another, and are preformed in a thermal reshaping procedure to form coolant channel sections that are complementary to one another to form an inherently stable coolant channel after the connection.

    Abstract translation: 在冷却装置中,用于通过流过冷却装置中的一个或多个冷却剂通道的冷却剂排出用于散热(产生于梯度线圈绕组的馈电电流)的梯度线圈的两个梯度线圈绕组之间布置两个膜 由热塑性材料制成,并且在热成形过程中预成形,以形成彼此互补的冷却剂通道部分,以在连接之后形成固有稳定的冷却剂通道。

    Gradient coil and method to manufacture a gradient coil
    9.
    发明授权
    Gradient coil and method to manufacture a gradient coil 有权
    梯度线圈和制造梯度线圈的方法

    公开(公告)号:US07888938B2

    公开(公告)日:2011-02-15

    申请号:US12354299

    申请日:2009-01-15

    CPC classification number: G01R33/3858 Y10T29/49071

    Abstract: In a gradient coil and a method to manufacture a gradient coil for a magnetic resonance apparatus, the gradient coil has at least one saddle coil, the saddle coil having a spatially shaped, electrically conductive plate with a line-shaped recess penetrating the plate. Conductor structures that create a gradient magnetic field in an examination region when a current signal flows therethrough are formed by the recess and by the shaping of the plate. The recess is filled with an electrically insulating material before implementation of the spatial shaping.

    Abstract translation: 在梯度线圈和制造磁共振装置的梯度线圈的方法中,梯度线圈具有至少一个鞍形线圈,鞍形线圈具有空间形状的导电板,其具有贯穿该板的线状凹部。 通过凹部和板的成形,形成当电流信号流过时在检查区域产生梯度磁场的导体结构。 在实施空间成形之前,凹部填充有电绝缘材料。

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