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公开(公告)号：US20110318885A1
公开(公告)日：2011-12-29
申请号：US13224933
申请日：2011-09-02
CPC分类号： H01L24/48 , H01L23/16 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/49816 , H01L23/49822 , H01L24/32 , H01L24/49 , H01L2224/05599 , H01L2224/32188 , H01L2224/32225 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/484 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01031 , H01L2924/01078 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： In one embodiment, a method for assembling a ball grid array (BGA) package is provided. The method includes providing a stiffener that has opposing first and second surfaces, wherein the first surface is capable of mounting an integrated circuit (IC) die in a central area and forming a pattern in at least a portion of the first surface to enhance the adhesiveness of an encapsulant material to the first surface.
摘要翻译： 在一个实施例中，提供了一种用于组装球栅阵列（BGA）封装的方法。 该方法包括提供具有相对的第一和第二表面的加强件，其中第一表面能够将集成电路（IC）模具安装在中心区域中并且在第一表面的至少一部分中形成图案以增强粘合性 的密封剂材料。
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公开(公告)号：US20100052151A1
公开(公告)日：2010-03-04
申请号：US12619385
申请日：2009-11-16
IPC分类号： H01L23/498 , H01L21/56 , H01L21/60
CPC分类号： H01L24/48 , H01L23/16 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/49816 , H01L23/49822 , H01L24/32 , H01L24/49 , H01L2224/05599 , H01L2224/32188 , H01L2224/32225 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/484 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01031 , H01L2924/01078 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： Electrically and thermally enhanced die-up ball grid array (BGA) packages are described. A BGA package includes a stiffener, substrate, a silicon die, and solder balls. The die is mounted to the top of the stiffener. The stiffener is mounted to the top of the substrate. A plurality of solder balls are attached to the bottom surface of the substrate. A top surface of the stiffener may be patterned. A second stiffener may be attached to the first stiffener. The substrate may include one, two, four, or other number of metal layers. Conductive vias through a dielectric layer of the substrate may couple the stiffener to solder balls. An opening may be formed through the substrate, exposing a portion of the stiffener. The stiffener may have a down-set portion. A heat slug may be attached to the exposed portion of the stiffener. A locking mechanism may be used to enhance attachment of the heat slug to the stiffener. The heat slug may be directly attached to the die through an opening in the stiffener.
摘要翻译： 描述了电热和热增强型压焊球栅阵列（BGA）封装。 BGA封装包括加强件，衬底，硅管芯和焊球。 模具安装在加强筋的顶部。 加强件安装到基板的顶部。 多个焊球附着在基板的底面上。 加强件的顶表面可以被图案化。 第二加强件可以附接到第一加强件。 衬底可以包括一个，两个，四个或其它数量的金属层。 通过基底的电介质层的导电孔可将加强件耦合到焊球。 可以通过基板形成开口，暴露加强件的一部分。 加强件可以具有下降部分。 散热片可以附着在加强件的暴露部分上。 可以使用锁定机构来增强热块与加强件的连接。 热芯可以通过加强件中的开口直接附接到模具。
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公开(公告)号：US06882042B2
公开(公告)日：2005-04-19
申请号：US09997272
申请日：2001-11-30
IPC分类号： H01L23/16 , H01L23/31 , H01L23/367 , H01L23/433 , H01L23/498 , H01L23/10 , H01L23/34
CPC分类号： H01L24/48 , H01L23/16 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/49816 , H01L23/49822 , H01L24/32 , H01L24/49 , H01L2224/05599 , H01L2224/32188 , H01L2224/32225 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/484 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01031 , H01L2924/01078 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： Electrically and thermally enhanced die-up ball grid array (BGA) packages are described. A BGA package includes a stiffener, substrate, a silicon die, and solder balls. The die is mounted to the top of the stiffener. The stiffener is mounted to the top of the substrate. A plurality of solder balls are attached to the bottom surface of the substrate. A top surface of the stiffener may be patterned. A second stiffener may be attached to the first stiffener. The substrate may include one, two, four, or other number of metal layers. Conductive vias through a dielectric layer of the substrate may couple the stiffener to solder balls. An opening may be formed through the substrate, exposing a portion of the stiffener. The stiffener may have a down-set portion. A heat slug may be attached to the exposed portion of the stiffener. A locking mechanism may be used to enhance attachment of the heat slug to the stiffener. The heat slug may be directly attached to the die through an opening in the stiffener.
摘要翻译： 描述了电热和热增强型压焊球栅阵列（BGA）封装。 BGA封装包括加强件，衬底，硅管芯和焊球。 模具安装在加强筋的顶部。 加强件安装到基板的顶部。 多个焊球附着在基板的底面上。 加强件的顶表面可以被图案化。 第二加强件可以附接到第一加强件。 衬底可以包括一个，两个，四个或其它数量的金属层。 通过基底的电介质层的导电孔可将加强件耦合到焊球。 可以通过基板形成开口，暴露加强件的一部分。 加强件可以具有下降部分。 散热片可以附着在加强件的暴露部分上。 可以使用锁定机构来增强热块与加强件的连接。 热芯可以通过加强件中的开口直接附接到模具。
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公开(公告)号：US08686558B2
公开(公告)日：2014-04-01
申请号：US13224933
申请日：2011-09-02
CPC分类号： H01L24/48 , H01L23/16 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/49816 , H01L23/49822 , H01L24/32 , H01L24/49 , H01L2224/05599 , H01L2224/32188 , H01L2224/32225 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/484 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01031 , H01L2924/01078 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： In one embodiment, a method for assembling a ball grid array (BGA) package is provided. The method includes providing a stiffener that has opposing first and second surfaces, wherein the first surface is capable of mounting an integrated circuit (IC) die in a central area and forming a pattern in at least a portion of the first surface to enhance the adhesiveness of an encapsulant material to the first surface.
摘要翻译： 在一个实施例中，提供了一种用于组装球栅阵列（BGA）封装的方法。 该方法包括提供具有相对的第一和第二表面的加强件，其中第一表面能够将集成电路（IC）模具安装在中心区域中并且在第一表面的至少一部分中形成图案以增强粘合性 的密封剂材料。
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公开(公告)号：US08039949B2
公开(公告)日：2011-10-18
申请号：US12619385
申请日：2009-11-16
IPC分类号： H01L23/48
CPC分类号： H01L24/48 , H01L23/16 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/49816 , H01L23/49822 , H01L24/32 , H01L24/49 , H01L2224/05599 , H01L2224/32188 , H01L2224/32225 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/484 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01031 , H01L2924/01078 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： Electrically and thermally enhanced die-up ball grid array (BGA) packages are described. A BGA package includes a stiffener, substrate, a silicon die, and solder balls. The die is mounted to the top of the stiffener. The stiffener is mounted to the top of the substrate. A plurality of solder balls are attached to the bottom surface of the substrate. A top surface of the stiffener may be patterned. A second stiffener may be attached to the first stiffener. The substrate may include one, two, four, or other number of metal layers. Conductive vias through a dielectric layer of the substrate may couple the stiffener to solder balls. An opening may be formed through the substrate, exposing a portion of the stiffener. The stiffener may have a down-set portion. A heat slug may be attached to the exposed portion of the stiffener. A locking mechanism may be used to enhance attachment of the heat slug to the stiffener. The heat slug may be directly attached to the die through an opening in the stiffener.
摘要翻译： 描述了电热和热增强型压焊球栅阵列（BGA）封装。 BGA封装包括加强件，衬底，硅管芯和焊球。 模具安装在加强筋的顶部。 加强件安装到基板的顶部。 多个焊球附着在基板的底面上。 加强件的顶表面可以被图案化。 第二加强件可以附接到第一加强件。 衬底可以包括一个，两个，四个或其它数量的金属层。 通过基底的电介质层的导电孔可将加强件耦合到焊球。 可以通过基板形成开口，暴露加强件的一部分。 加强件可以具有下降部分。 散热片可以附着在加强件的暴露部分上。 可以使用锁定机构来增强热块与加强件的连接。 热芯可以通过加强件中的开口直接附接到模具。
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6.发明申请Ball grid array package with patterned stiffener surface and method of assembling the same 有权具有图案加强筋表面的球栅阵列封装及其组装方法公开(公告)号：US20050077545A1
公开(公告)日：2005-04-14
申请号：US10963620
申请日：2004-10-14
申请人： Sam Zhao , Reaz-ur Khan , Edward Law , Marc Papageorge
发明人： Sam Zhao , Reaz-ur Khan , Edward Law , Marc Papageorge
IPC分类号： H01L23/16 , H01L23/31 , H01L23/367 , H01L23/433 , H01L23/498 , H01L27/10
CPC分类号： H01L24/48 , H01L23/16 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/49816 , H01L23/49822 , H01L24/32 , H01L24/49 , H01L2224/05599 , H01L2224/32188 , H01L2224/32225 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/484 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01031 , H01L2924/01078 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： Electrically and thermally enhanced die-up ball grid array (BGA) packages are described. A BGA package includes a stiffener, substrate, a silicon die, and solder balls. The die is mounted to the top of the stiffener. The stiffener is mounted to the top of the substrate. A plurality of solder balls are attached to the bottom surface of the substrate. A top surface of the stiffener may be patterned. A second stiffener may be attached to the first stiffener. The substrate may include one, two, four, or other number of metal layers. Conductive vias through a dielectric layer of the substrate may couple the stiffener to solder balls. An opening may be formed through the substrate, exposing a portion of the stiffener. The stiffener may have a down-set portion. A heat slug may be attached to the exposed portion of the stiffener. A locking mechanism may be used to enhance attachment of the heat slug to the stiffener. The heat slug may be directly attached to the die through an opening in the stiffener.
摘要翻译： 描述了电热和热增强型压焊球栅阵列（BGA）封装。 BGA封装包括加强件，衬底，硅管芯和焊球。 模具安装在加强筋的顶部。 加强件安装到基板的顶部。 多个焊球附着在基板的底面上。 加强件的顶表面可以被图案化。 第二加强件可以附接到第一加强件。 衬底可以包括一个，两个，四个或其它数量的金属层。 通过基底的电介质层的导电孔可将加强件耦合到焊球。 可以通过基板形成开口，暴露加强件的一部分。 加强件可以具有下降部分。 散热片可以附着在加强件的暴露部分上。 可以使用锁定机构来增强热块与加强件的连接。 热芯可以通过加强件中的开口直接附接到模具。
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7.发明授权Ball grid array package with patterned stiffener surface and method of assembling the same 有权具有图案加强筋表面的球栅阵列封装及其组装方法公开(公告)号：US07629681B2
公开(公告)日：2009-12-08
申请号：US10963620
申请日：2004-10-14
IPC分类号： H01L23/12 , H01L23/053
CPC分类号： H01L24/48 , H01L23/16 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/49816 , H01L23/49822 , H01L24/32 , H01L24/49 , H01L2224/05599 , H01L2224/32188 , H01L2224/32225 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/484 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01031 , H01L2924/01078 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： Electrically and thermally enhanced die-up ball grid array (BGA) packages are described. A BGA package includes a stiffener, substrate, a silicon die, and solder balls. The die is mounted to the top of the stiffener. The stiffener is mounted to the top of the substrate. A plurality of solder balls are attached to the bottom surface of the substrate. A top surface of the stiffener may be patterned. A second stiffener may be attached to the first stiffener. The substrate may include one, two, four, or other number of metal layers. Conductive vias through a dielectric layer of the substrate may couple the stiffener to solder balls. An opening may be formed through the substrate, exposing a portion of the stiffener. The stiffener may have a down-set portion. A heat slug may be attached to the exposed portion of the stiffener. A locking mechanism may be used to enhance attachment of the heat slug to the stiffener. The heat slug may be directly attached to the die through an opening in the stiffener.
摘要翻译： 描述了电热和热增强型压焊球栅阵列（BGA）封装。 BGA封装包括加强件，衬底，硅管芯和焊球。 模具安装在加强筋的顶部。 加强件安装到基板的顶部。 多个焊球附着在基板的底面上。 加强件的顶表面可以被图案化。 第二加强件可以附接到第一加强件。 衬底可以包括一个，两个，四个或其它数量的金属层。 通过基底的电介质层的导电孔可将加强件耦合到焊球。 可以通过基板形成开口，暴露加强件的一部分。 加强件可以具有下降部分。 散热片可以附着在加强件的暴露部分上。 可以使用锁定机构来增强热块与加强件的连接。 热芯可以通过加强件中的开口直接附接到模具。
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