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公开(公告)号：US08310067B2
公开(公告)日：2012-11-13
申请号：US13030950
申请日：2011-02-18
CPC分类号： H01L23/3735 , H01L23/24 , H01L23/3128 , H01L23/36 , H01L23/3677 , H01L23/4334 , H01L23/49833 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/0401 , H01L2224/05624 , H01L2224/32188 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/48465 , H01L2224/48624 , H01L2224/49109 , H01L2224/49171 , H01L2224/73265 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/1433 , H01L2924/15173 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H05K1/0204 , H05K1/182 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A package is provided. The package includes a substrate having first and second surfaces, a stiffener coupled to the first surface of the substrate, and a thermal connector coupled to the second surface of the substrate that is configured to be coupled to a printed circuit board.
摘要翻译： 提供一个包装。 封装包括具有第一和第二表面的基板，耦合到基板的第一表面的加强件以及耦合到基板的第二表面的热连接器，该热连接器被配置为联接到印刷电路板。
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公开(公告)号：US08021927B2
公开(公告)日：2011-09-20
申请号：US12842627
申请日：2010-07-23
IPC分类号： H01L21/58
CPC分类号： H01L23/3128 , H01L23/13 , H01L23/36 , H01L23/3677 , H01L23/49816 , H01L23/49833 , H01L23/50 , H01L23/552 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/91 , H01L2224/16227 , H01L2224/16235 , H01L2224/16245 , H01L2224/2919 , H01L2224/32188 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/4824 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/49109 , H01L2224/49171 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73265 , H01L2224/8385 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01021 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19043 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/16225 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of forming a ball grid array (BGA) package is provided. The method includes coupling an integrated circuit (IC) die to a heat spreader in an opening of a substrate, the opening of the substrate extending through the substrate, such that a portion of the heat spreader is accessible through the opening and coupling a first surface of a second substrate to the IC die via a bump interconnect. The second surface of the second substrate has an array of contact pads capable of coupling to a board.
摘要翻译： 提供了一种形成球栅阵列（BGA）封装的方法。 该方法包括将集成电路（IC）管芯耦合到衬底的开口中的散热器，衬底的开口延伸穿过衬底，使得散热器的一部分可通过开口接近并且将第一表面 的第二衬底通过凸块互连件连接到IC管芯。 第二衬底的第二表面具有能够耦合到板的接触焊盘的阵列。
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公开(公告)号：US20100285637A1
公开(公告)日：2010-11-11
申请号：US12842627
申请日：2010-07-23
CPC分类号： H01L23/3128 , H01L23/13 , H01L23/36 , H01L23/3677 , H01L23/49816 , H01L23/49833 , H01L23/50 , H01L23/552 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/91 , H01L2224/16227 , H01L2224/16235 , H01L2224/16245 , H01L2224/2919 , H01L2224/32188 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/4824 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/49109 , H01L2224/49171 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73265 , H01L2224/8385 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01021 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19043 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/16225 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of forming a ball grid array (BGA) package is provided. The method includes coupling an integrated circuit (IC) die to a heat spreader in an opening of a substrate, the opening of the substrate extending through the substrate, such that a portion of the heat spreader is accessible through the opening and coupling a first surface of a second substrate to the IC die via a bump interconnect. The second surface of the second substrate has an array of contact pads capable of coupling to a board.
摘要翻译： 提供了一种形成球栅阵列（BGA）封装的方法。 该方法包括将集成电路（IC）管芯耦合到衬底的开口中的散热器，衬底的开口延伸穿过衬底，使得散热器的一部分可通过开口接近并且将第一表面 的第二衬底通过凸块互连件连接到IC管芯。 第二衬底的第二表面具有能够耦合到板的接触焊盘的阵列。
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4.发明授权Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages 失效用于改进引线框集成电路（IC）封装中的热性能和电磁干扰（EMI）屏蔽的方法和装置公开(公告)号：US07781266B2
公开(公告)日：2010-08-24
申请号：US12535548
申请日：2009-08-04
CPC分类号： H01L23/4334 , H01L23/3128 , H01L23/3677 , H01L23/49541 , H01L23/49568 , H01L23/552 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49109 , H01L2224/4911 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/16152 , H01L2924/181 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45099
摘要： A method of assembling an IC device package is provided. A leadframe is formed. At least one IC die is attached to a die attach pad portion of the leadframe. Wire bonds are coupled between the IC die and the leadframe. A cap is attached to the leadframe. A second surface of the cap includes a cavity formed therein. The cap and leadframe form an enclosure structure that substantially encloses the at least one IC die. An encapsulating material is applied to encapsulate at least the IC die. A perimeter support ring portion of the leadframe is trimmed.
摘要翻译： 提供一种组装IC器件封装的方法。 形成引线框架。 至少一个IC管芯连接到引线框的管芯附接焊盘部分。 引线键连接在IC管芯和引线框架之间。 盖子连接到引线框。 盖的第二表面包括形成在其中的空腔。 盖和引线框形成基本上封闭至少一个IC管芯的外壳结构。 应用封装材料至少封装IC芯片。 引导框架的周边支撑环部分被修整。
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5.发明申请Methods and Apparatus for Improved Thermal Performance and Electromagnetic Interference (EMI) Shielding in Leadframe Integrated Circuit (IC) Packages 失效用于改进引线框集成电路（IC）封装中的热性能和电磁干扰（EMI）屏蔽的方法和装置公开(公告)号：US20100035383A1
公开(公告)日：2010-02-11
申请号：US12535548
申请日：2009-08-04
IPC分类号： H01L21/60
CPC分类号： H01L23/4334 , H01L23/3128 , H01L23/3677 , H01L23/49541 , H01L23/49568 , H01L23/552 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49109 , H01L2224/4911 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/16152 , H01L2924/181 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45099
摘要： A method of assembling an IC device package is provided. A leadframe is formed. At least one IC die is attached to a die attach pad portion of the leadframe. Wire bonds are coupled between the IC die and the leadframe. A cap is attached to the leadframe. A second surface of the cap includes a cavity formed therein. The cap and leadframe form an enclosure structure that substantially encloses the at least one IC die. An encapsulating material is applied to encapsulate at least the IC die. A perimeter support ring portion of the leadframe is trimmed.
摘要翻译： 提供了一种组装IC器件封装的方法。 形成引线框架。 至少一个IC管芯连接到引线框的管芯附接焊盘部分。 引线键连接在IC管芯和引线框架之间。 盖子连接到引线框。 盖的第二表面包括形成在其中的空腔。 盖和引线框形成基本上封闭至少一个IC管芯的外壳结构。 应用封装材料至少封装IC芯片。 引导框架的周边支撑环部分被修整。
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6.发明授权Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same 有权用于裸片阵列封装中的热和电磁干扰（EMI）屏蔽增强的多功能设备及其制造方法公开(公告)号：US07482686B2
公开(公告)日：2009-01-27
申请号：US10870929
申请日：2004-06-21
IPC分类号： H01L23/10
CPC分类号： H01L24/49 , H01L23/24 , H01L23/3128 , H01L23/4334 , H01L23/552 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/48465 , H01L2224/4911 , H01L2224/73265 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/16151 , H01L2924/16152 , H01L2924/181 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A die-up array integrated circuit (IC) device package and method of making the same is presented. A frame body has opposing first and second surfaces and a central opening that is open at the first and second surfaces. The second frame body surface is mounted to a first stiffener surface. An IC die is mounted to the first stiffener surface within the central opening through the frame body. A planar lid has opposing first and second surfaces. The second lid surface is coupled to the first frame body surface. A first substrate surface is coupled to a second stiffener surface. An array of electrically conductive terminals is coupled to a second substrate surface. The stiffener, frame body, and lid form an enclosure structure substantially enclosing the IC die. The die enclosure spreads heat from the IC die, and shields EMI emanating from and radiating toward the IC die.
摘要翻译： 提出了一种芯片阵列集成电路（IC）器件封装及其制造方法。 框体具有相对的第一和第二表面以及在第一表面和第二表面处开口的中心开口。 第二框架体表面安装到第一加强件表面。 IC芯片通过框架体安装在中心开口内的第一加强件表面上。 平面盖具有相对的第一和第二表面。 第二盖表面联接到第一框架体表面。 第一基板表面联接到第二加强件表面。 导电端子阵列耦合到第二衬底表面。 加强件，框架体和盖子形成基本封闭IC芯片的外壳结构。 模具外壳散热来自IC芯片的热量，并屏蔽从IC芯片发出的辐射和向IC芯片辐射。
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7.发明授权Ball grid array package substrates with a modified central opening and method for making the same 有权具有改进的中心开口的球栅阵列封装衬底及其制造方法公开(公告)号：US07405145B2
公开(公告)日：2008-07-29
申请号：US11047755
申请日：2005-02-02
IPC分类号： H01L23/48
CPC分类号： H01L23/50 , H01L23/13 , H01L23/49816 , H01L23/49833 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05554 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/49171 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/014 , H01L2924/10162 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/15165 , H01L2924/15173 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/15787 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/48247
摘要： An electrically and mechanically enhanced die-down tape substrate ball grid array (BGA) package substrate is described. An IC package includes a substrate that has a first surface. The first surface has a central opening. A stiffener/heat spreader has a first surface. The first surface of the stiffener has a central ground ring. The first surface of the stiffener is coupled to a second surface of the substrate. The central opening has an edge. The edge includes at least one of the following: (a) a protruding edge portion that extends across at least a portion of the central ground ring, (b) a recessed edge portion that exposes a portion of the central ground ring, or (c) a hole proximate to the edge, wherein the hole exposes a portion of the central ground ring.
摘要翻译： 描述了电和机械增强的模压带基板球栅阵列（BGA）封装衬底。 IC封装包括具有第一表面的基板。 第一个表面有一个中心的开口。 加强件/散热器具有第一表面。 加强件的第一表面具有中心接地环。 加强件的第一表面耦合到基板的第二表面。 中央开口有一个优势。 所述边缘包括以下至少一个：（a）延伸穿过所述中心接地环的至少一部分的突出边缘部分，（b）暴露所述中心接地环的一部分的凹入边缘部分，或（c ）靠近所述边缘的孔，其中所述孔暴露所述中心接地环的一部分。
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8.发明授权Flip chip package including a non-planar heat spreader and method of making the same 有权倒装芯片封装包括非平面散热器及其制作方法公开(公告)号：US07271479B2
公开(公告)日：2007-09-18
申请号：US10979155
申请日：2004-11-03
CPC分类号： H01L23/552 , H01L21/563 , H01L23/04 , H01L23/055 , H01L23/3128 , H01L23/36 , H01L23/3675 , H01L23/3677 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/91 , H01L24/97 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/15747 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/81 , H01L2224/83 , H01L2224/45099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A flip chip package generally includes a substrate, a flip chip die, and a heat spreader. The flip chip die is coupled to the substrate. The heat spreader is coupled to the flip chip die. The heat spreader can include one or more walls. Generally, the one or more walls at least partially laterally surround the flip chip die and/or the substrate. The walls can completely laterally surround the flip chip die to define a cavity in the heat spreader. The flip chip package can further include an encapsulate. For example, the encapsulate can be injected between the one or more walls of the heat spreader and the flip chip die and/or other components of the flip chip package. The encapsulate and/or the one or more walls of the heat spreader can protect one or more components of the flip chip package against moisture, corrosives, heat, or radiation, to provide some examples.
摘要翻译： 倒装芯片封装通常包括衬底，倒装芯片模具和散热器。 倒装晶片管芯耦合到衬底。 散热器耦合到倒装芯片模具。 散热器可以包括一个或多个墙壁。 通常，一个或多个壁至少部分横向围绕倒装芯片和/或基板。 墙壁可以完全横向围绕倒装芯片模具以在散热器中限定空腔。 倒装芯片封装还可包括封装。 例如，封装可以注入散热器的一个或多个壁和倒装芯片芯片和/或倒装芯片封装的其它部件之间。 散热器的封装和/或一个或多个壁可以保护倒装芯片封装的一个或多个部件免受潮湿，腐蚀，热或辐射的影响，以提供一些示例。
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公开(公告)号：US07078806B2
公开(公告)日：2006-07-18
申请号：US10899144
申请日：2004-07-27
IPC分类号： H01L23/48
CPC分类号： H01L24/83 , H01L21/4857 , H01L21/4871 , H01L21/561 , H01L21/6835 , H01L23/16 , H01L23/3128 , H01L23/3677 , H01L23/49816 , H01L23/49833 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/0401 , H01L2224/05624 , H01L2224/29101 , H01L2224/2919 , H01L2224/29339 , H01L2224/32188 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/48465 , H01L2224/48624 , H01L2224/48644 , H01L2224/49109 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/8385 , H01L2224/85444 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/3511 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/3512 , H01L2224/92247 , H01L2924/00012
摘要： A system and method of assembling a ball grid array (BGA) package with IC die support is described. A stiffener is attached to a substrate that includes a centrally located opening with an integrated circuit (IC) die support structure removably held therein. An IC die is mounted to a central region of the stiffener. Further assembly process steps may be performed on the BGA package with IC die support. The IC die support structure is removed from the centrally located opening. In aspects of the invention, the IC die support structure is removably held in the opening by an adhesive tape or by one or more substrate tabs.
摘要翻译： 描述了组装具有IC芯片支撑的球栅阵列（BGA）封装的系统和方法。 加强件附接到包括位于中心的开口的基板，该开口具有可移除地保持在其中的集成电路（IC）模具支撑结构。 IC模具安装到加强件的中心区域。 可以在具有IC芯片支持的BGA封装上执行进一步的组装工艺步骤。 IC芯片支撑结构从位于中心的开口移除。 在本发明的方面，IC模具支撑结构通过胶带或一个或多个衬底突片可移除地保持在开口中。
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公开(公告)号：US07005737B2
公开(公告)日：2006-02-28
申请号：US10201891
申请日：2002-07-25
CPC分类号： H01L23/34 , H01L23/3677 , H01L23/3735 , H01L23/4334 , H01L23/49816 , H01L23/49838 , H01L23/50 , H01L23/5384 , H01L23/562 , H01L24/14 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/2929 , H01L2224/29339 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45144 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/48465 , H01L2224/49109 , H01L2224/49171 , H01L2224/73215 , H01L2224/73265 , H01L2924/01013 , H01L2924/01029 , H01L2924/01039 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/0665
摘要： An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second surface is provided. The stiffener has a first surface and a second surface. The second stiffener surface is attached to the first substrate surface. An IC die has a first surface and a second surface. The first IC die surface is mounted to the first stiffener surface. A plurality of solder balls is attached to the second substrate surface. In one aspect, a heat spreader is mounted to the second IC die surface. In another aspect, the stiffener is coupled to ground to act as a ground plane. In another aspect, the substrate has a window opening that exposes a portion of the second stiffener surface. The exposed portion of the second stiffener surface is configured to be coupled to a printed circuit board (PCB). In another aspect, a metal ring is attached to the first stiffener surface. In another aspect, wire bond openings in the stiffener are bridged by one or more studs.
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