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公开(公告)号：US08039949B2
公开(公告)日：2011-10-18
申请号：US12619385
申请日：2009-11-16
IPC分类号： H01L23/48
CPC分类号： H01L24/48 , H01L23/16 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/49816 , H01L23/49822 , H01L24/32 , H01L24/49 , H01L2224/05599 , H01L2224/32188 , H01L2224/32225 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/484 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01031 , H01L2924/01078 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： Electrically and thermally enhanced die-up ball grid array (BGA) packages are described. A BGA package includes a stiffener, substrate, a silicon die, and solder balls. The die is mounted to the top of the stiffener. The stiffener is mounted to the top of the substrate. A plurality of solder balls are attached to the bottom surface of the substrate. A top surface of the stiffener may be patterned. A second stiffener may be attached to the first stiffener. The substrate may include one, two, four, or other number of metal layers. Conductive vias through a dielectric layer of the substrate may couple the stiffener to solder balls. An opening may be formed through the substrate, exposing a portion of the stiffener. The stiffener may have a down-set portion. A heat slug may be attached to the exposed portion of the stiffener. A locking mechanism may be used to enhance attachment of the heat slug to the stiffener. The heat slug may be directly attached to the die through an opening in the stiffener.
摘要翻译： 描述了电热和热增强型压焊球栅阵列（BGA）封装。 BGA封装包括加强件，衬底，硅管芯和焊球。 模具安装在加强筋的顶部。 加强件安装到基板的顶部。 多个焊球附着在基板的底面上。 加强件的顶表面可以被图案化。 第二加强件可以附接到第一加强件。 衬底可以包括一个，两个，四个或其它数量的金属层。 通过基底的电介质层的导电孔可将加强件耦合到焊球。 可以通过基板形成开口，暴露加强件的一部分。 加强件可以具有下降部分。 散热片可以附着在加强件的暴露部分上。 可以使用锁定机构来增强热块与加强件的连接。 热芯可以通过加强件中的开口直接附接到模具。
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2.发明授权Low profile ball grid array (BGA) package with exposed die and method of making same 有权具有裸露裸片的低轮廓球栅阵列（BGA）封装及其制造方法公开(公告)号：US08169067B2
公开(公告)日：2012-05-01
申请号：US11583719
申请日：2006-10-20
申请人： Edward Law , Sam Ziqun Zhao , Rezaur Rahman Khan
发明人： Edward Law , Sam Ziqun Zhao , Rezaur Rahman Khan
CPC分类号： H01L23/3128 , H01L23/13 , H01L23/49816 , H01L24/48 , H01L24/73 , H01L24/91 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/48465 , H01L2224/73257 , H01L2224/73265 , H01L2224/85005 , H01L2224/9222 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/18165 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/85 , H01L2224/11 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Methods and apparatuses for improved thermal, electrical and/or mechanical performance in integrated circuit (IC) packages are described. An IC circuit package comprises a substrate having a central opening. An IC die, resides within the opening in the substrate. Wirebonds couples a plurality of bond pads on a top surface of the IC die to a plurality of bond fingers on a top surface the substrate. An encapsulating material encapsulates at least the IC die and the wirebonds such that at least a bottom surface of the IC die is left exposed. The encapsulating material suspends the die such that at least a portion of the die is held within the opening in the substrate.
摘要翻译： 描述了用于改善集成电路（IC）封装中的热，电和/或机械性能的方法和装置。 IC电路封装包括具有中心开口的基板。 IC芯片位于基板的开口内。 导线将IC芯片的顶表面上的多个接合焊盘耦合到衬底的顶表面上的多个接合指状物。 封装材料至少封装IC芯片和引线键，使得IC芯片的至少底面露出。 封装材料悬挂模具，使得模具的至少一部分保持在基板的开口内。
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3.发明申请Low profile ball grid array (BGA) package with exposed die and method of making same 有权具有裸露裸片的低轮廓球栅阵列（BGA）封装及其制造方法公开(公告)号：US20080096312A1
公开(公告)日：2008-04-24
申请号：US11583719
申请日：2006-10-20
申请人： Edward Law , Sam Ziqun Zhao , Rezaur Rahman Khan
发明人： Edward Law , Sam Ziqun Zhao , Rezaur Rahman Khan
IPC分类号： H01L21/00
CPC分类号： H01L23/3128 , H01L23/13 , H01L23/49816 , H01L24/48 , H01L24/73 , H01L24/91 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/48465 , H01L2224/73257 , H01L2224/73265 , H01L2224/85005 , H01L2224/9222 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/18165 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/85 , H01L2224/11 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Methods and apparatuses for improved thermal, electrical and/or mechanical performance in integrated circuit (IC) packages are described. An IC circuit package comprises a substrate having a central opening. An IC die, resides within the opening in the substrate. Wirebonds couples a plurality of bond pads on a top surface of the IC die to a plurality of bond fingers on a top surface the substrate. An encapsulating material encapsulates at least the IC die and the wirebonds such that at least a bottom surface of the IC die is left exposed. The encapsulating material suspends the die such that at least a portion of the die is held within the opening in the substrate.
摘要翻译： 描述了用于改善集成电路（IC）封装中的热，电和/或机械性能的方法和装置。 IC电路封装包括具有中心开口的基板。 IC芯片位于基板的开口内。 导线将IC芯片的顶表面上的多个接合焊盘耦合到衬底的顶表面上的多个接合指状物。 封装材料至少封装IC芯片和引线键，使得IC芯片的至少底面露出。 封装材料悬挂模具，使得模具的至少一部分保持在基板的开口内。
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公开(公告)号：US20070273023A1
公开(公告)日：2007-11-29
申请号：US11583718
申请日：2006-10-20
申请人： Sam Ziqun Zhao , Edward Law , Rezaur Rahman Khan
发明人： Sam Ziqun Zhao , Edward Law , Rezaur Rahman Khan
IPC分类号： H01L23/34
CPC分类号： H01L23/13 , H01L23/3128 , H01L23/4334 , H01L24/33 , H01L24/48 , H01L24/73 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/85001 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/18165 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An apparatus and method for a wire-bond die-up area array package is described. The package includes an integrated circuit (IC) die, a substrate, and a thermally conducting body. A bottom surface of the IC die is exposed through an opening in a central region of the substrate. The die is mounted to the thermally conducting body. A bottom surface of the thermally conducting body is configured to be connected to a circuit board, such as a PWB, when the package is mounted to the circuit board. The bottom surface of the thermally conducting body may be connected directly to the circuit board, or may be coupled to the circuit board via solder balls or other mechanism. One or more wirebonds are used to electrically connect the die to a top surface of the substrate. A mold compound encapsulates the die, the wirebonds, and at least a portion of the top surface of the substrate, and fills a gap between peripheral edges of the IC die and inner walls of the substrate central window opening. A matrix of solder balls is attached to a bottom surface of the substrate.
摘要翻译： 描述了一种用于引线键合区域阵列封装的装置和方法。 封装包括集成电路（IC）管芯，衬底和导热体。 IC芯片的底表面通过衬底的中心区域中的开口露出。 模具安装到导热体上。 当封装安装到电路板时，导热体的底表面被配置为连接到电路板，例如PWB。 导热体的底表面可以直接连接到电路板，或者可以通过焊球或其它机构与电路板耦合。 一个或多个引线用于将管芯电连接到衬底的顶表面。 模具化合物封装模具，引线键和衬底的顶表面的至少一部分，并且填充IC模具的周边边缘和衬底中心窗口的内壁之间的间隙。 焊球的基体附着在基板的底面上。
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公开(公告)号：US20110318885A1
公开(公告)日：2011-12-29
申请号：US13224933
申请日：2011-09-02
CPC分类号： H01L24/48 , H01L23/16 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/49816 , H01L23/49822 , H01L24/32 , H01L24/49 , H01L2224/05599 , H01L2224/32188 , H01L2224/32225 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/484 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01031 , H01L2924/01078 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： In one embodiment, a method for assembling a ball grid array (BGA) package is provided. The method includes providing a stiffener that has opposing first and second surfaces, wherein the first surface is capable of mounting an integrated circuit (IC) die in a central area and forming a pattern in at least a portion of the first surface to enhance the adhesiveness of an encapsulant material to the first surface.
摘要翻译： 在一个实施例中，提供了一种用于组装球栅阵列（BGA）封装的方法。 该方法包括提供具有相对的第一和第二表面的加强件，其中第一表面能够将集成电路（IC）模具安装在中心区域中并且在第一表面的至少一部分中形成图案以增强粘合性 的密封剂材料。
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公开(公告)号：US06882042B2
公开(公告)日：2005-04-19
申请号：US09997272
申请日：2001-11-30
IPC分类号： H01L23/16 , H01L23/31 , H01L23/367 , H01L23/433 , H01L23/498 , H01L23/10 , H01L23/34
CPC分类号： H01L24/48 , H01L23/16 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/49816 , H01L23/49822 , H01L24/32 , H01L24/49 , H01L2224/05599 , H01L2224/32188 , H01L2224/32225 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/484 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01031 , H01L2924/01078 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： Electrically and thermally enhanced die-up ball grid array (BGA) packages are described. A BGA package includes a stiffener, substrate, a silicon die, and solder balls. The die is mounted to the top of the stiffener. The stiffener is mounted to the top of the substrate. A plurality of solder balls are attached to the bottom surface of the substrate. A top surface of the stiffener may be patterned. A second stiffener may be attached to the first stiffener. The substrate may include one, two, four, or other number of metal layers. Conductive vias through a dielectric layer of the substrate may couple the stiffener to solder balls. An opening may be formed through the substrate, exposing a portion of the stiffener. The stiffener may have a down-set portion. A heat slug may be attached to the exposed portion of the stiffener. A locking mechanism may be used to enhance attachment of the heat slug to the stiffener. The heat slug may be directly attached to the die through an opening in the stiffener.
摘要翻译： 描述了电热和热增强型压焊球栅阵列（BGA）封装。 BGA封装包括加强件，衬底，硅管芯和焊球。 模具安装在加强筋的顶部。 加强件安装到基板的顶部。 多个焊球附着在基板的底面上。 加强件的顶表面可以被图案化。 第二加强件可以附接到第一加强件。 衬底可以包括一个，两个，四个或其它数量的金属层。 通过基底的电介质层的导电孔可将加强件耦合到焊球。 可以通过基板形成开口，暴露加强件的一部分。 加强件可以具有下降部分。 散热片可以附着在加强件的暴露部分上。 可以使用锁定机构来增强热块与加强件的连接。 热芯可以通过加强件中的开口直接附接到模具。
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公开(公告)号：US08686558B2
公开(公告)日：2014-04-01
申请号：US13224933
申请日：2011-09-02
CPC分类号： H01L24/48 , H01L23/16 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/49816 , H01L23/49822 , H01L24/32 , H01L24/49 , H01L2224/05599 , H01L2224/32188 , H01L2224/32225 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/484 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01031 , H01L2924/01078 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： In one embodiment, a method for assembling a ball grid array (BGA) package is provided. The method includes providing a stiffener that has opposing first and second surfaces, wherein the first surface is capable of mounting an integrated circuit (IC) die in a central area and forming a pattern in at least a portion of the first surface to enhance the adhesiveness of an encapsulant material to the first surface.
摘要翻译： 在一个实施例中，提供了一种用于组装球栅阵列（BGA）封装的方法。 该方法包括提供具有相对的第一和第二表面的加强件，其中第一表面能够将集成电路（IC）模具安装在中心区域中并且在第一表面的至少一部分中形成图案以增强粘合性 的密封剂材料。
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8.发明授权Ball grid array package with patterned stiffener surface and method of assembling the same 有权具有图案加强筋表面的球栅阵列封装及其组装方法公开(公告)号：US07629681B2
公开(公告)日：2009-12-08
申请号：US10963620
申请日：2004-10-14
IPC分类号： H01L23/12 , H01L23/053
CPC分类号： H01L24/48 , H01L23/16 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/49816 , H01L23/49822 , H01L24/32 , H01L24/49 , H01L2224/05599 , H01L2224/32188 , H01L2224/32225 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/484 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01031 , H01L2924/01078 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： Electrically and thermally enhanced die-up ball grid array (BGA) packages are described. A BGA package includes a stiffener, substrate, a silicon die, and solder balls. The die is mounted to the top of the stiffener. The stiffener is mounted to the top of the substrate. A plurality of solder balls are attached to the bottom surface of the substrate. A top surface of the stiffener may be patterned. A second stiffener may be attached to the first stiffener. The substrate may include one, two, four, or other number of metal layers. Conductive vias through a dielectric layer of the substrate may couple the stiffener to solder balls. An opening may be formed through the substrate, exposing a portion of the stiffener. The stiffener may have a down-set portion. A heat slug may be attached to the exposed portion of the stiffener. A locking mechanism may be used to enhance attachment of the heat slug to the stiffener. The heat slug may be directly attached to the die through an opening in the stiffener.
摘要翻译： 描述了电热和热增强型压焊球栅阵列（BGA）封装。 BGA封装包括加强件，衬底，硅管芯和焊球。 模具安装在加强筋的顶部。 加强件安装到基板的顶部。 多个焊球附着在基板的底面上。 加强件的顶表面可以被图案化。 第二加强件可以附接到第一加强件。 衬底可以包括一个，两个，四个或其它数量的金属层。 通过基底的电介质层的导电孔可将加强件耦合到焊球。 可以通过基板形成开口，暴露加强件的一部分。 加强件可以具有下降部分。 散热片可以附着在加强件的暴露部分上。 可以使用锁定机构来增强热块与加强件的连接。 热芯可以通过加强件中的开口直接附接到模具。
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公开(公告)号：US09548251B2
公开(公告)日：2017-01-17
申请号：US13349045
申请日：2012-01-12
申请人： Rezaur Rahman Khan , Sam Ziqun Zhao , Pieter Vorenkamp , Kevin Kunzhong Hu , Sampath K. V. Karikalan , Xiangdong Chen
发明人： Rezaur Rahman Khan , Sam Ziqun Zhao , Pieter Vorenkamp , Kevin Kunzhong Hu , Sampath K. V. Karikalan , Xiangdong Chen
IPC分类号： H01L23/48 , H01L23/13 , H01L25/065 , H01L23/498
CPC分类号： H01L23/13 , H01L23/49827 , H01L23/49833 , H01L25/0657 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/16235 , H01L2224/17181 , H01L2224/32225 , H01L2224/73253 , H01L2225/06513 , H01L2225/06517 , H01L2225/06548 , H01L2225/06572 , H01L2924/15151 , H01L2924/15153 , H01L2924/15311 , H01L2924/157
摘要： A semiconductor package may include a substrate, and a semiconductor interposer having a cavity and a plurality of through semiconductor vias. The semiconductor interposer is situated over the substrate. An intra-interposer die is disposed within the cavity of the semiconductor interposer. A thermally conductive adhesive is disposed within the cavity and contacts the intra-interposer die. Additionally, a top die is situated over the semiconductor interposer. In one implementation, the semiconductor interposer is a silicon interposer. In another implementation, the semiconductor interposer is flip-chip mounted to the substrate such that the intra-interposer die disposed within the cavity faces the substrate. In yet another implementation, the cavity in the semiconductor interposer may extend from a top surface of the semiconductor interposer to a bottom surface of the semiconductor interposer and a thermal interface material may be disposed between the intra-interposer die and the substrate.
摘要翻译： 半导体封装可以包括衬底和具有空腔和多个通孔半导体通孔的半导体插入器。 半导体插入器位于衬底上。 插入式管芯设置在半导体插入器的空腔内。 导热粘合剂设置在空腔内并与内插器模具接触。 此外，顶部管芯位于半导体插入器上方。 在一个实现中，半导体插入器是硅插入器。 在另一个实施方式中，将半导体插入器倒装芯片安装到基板上，使得设置在空腔内的内插器芯片面向基板。 在又一实施方案中，半导体插入器中的空腔可以从半导体插入器的顶表面延伸到半导体插入器的底表面，并且热界面材料可以设置在内插器管芯和衬底之间。
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公开(公告)号：US08508045B2
公开(公告)日：2013-08-13
申请号：US13174066
申请日：2011-06-30
申请人： Rezaur Rahman Khan , Sam Ziqun Zhao
发明人： Rezaur Rahman Khan , Sam Ziqun Zhao
IPC分类号： H01L23/498 , H01L21/56
CPC分类号： H01L21/565 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/5385 , H01L23/5389 , H01L23/552 , H01L24/16 , H01L24/73 , H01L25/105 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/1005 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/3011 , H01L2924/3025 , H01L2924/3511 , H01L2924/00012 , H01L2924/00
摘要： An integrated circuit (IC) package has a package member having a first surface and a second surface opposite the first surface. A first plurality of contact members is physically and electrically fixed to the second surface. An interposer substrate having a second plurality of contact members on one surface thereof which make physical and electrical contact with respective ones of the first plurality of contact members. The interposer substrate is configured to have at least one circuit member mounted to a second surface thereof opposite the one surface thereof.
摘要翻译： 集成电路（IC）封装具有封装构件，该封装构件具有与第一表面相对的第一表面和第二表面。 第一组多个接触构件物理和电气固定到第二表面。 具有在其一个表面上具有第二多个接触构件的中介层衬底，其与第一组多个接触构件中的相应接触构件物理和电接触。 插入器基板被配置为具有安装到与其一个表面相对的第二表面的至少一个电路部件。
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