摘要:
The present invention relates to a method for preparing a composite material comprising a matrix resin of a thermal plastic resin and a liquid crystal resin which has a liquid crystal transition temperature higher than the minimum temperature of capable of molding said thermal plastic resin and which is formed into a fiber structure as a reinforcing material.The method is characterized in that the composite composition is subjected to a melt extrusion process at an apparent shear rate of 3.times.10.sup.2 to 10.sup.5 sec.sup.-1 and above the liquid crystal transition temperature. The resulting material in a filament or thin film has fibers of the liquid crystal resin having an aspect of more than 3 in the matrix resin, so that it is provided with an improved tensile strength by further being subjected to a drawing process at a drawing ratio of 11 to 120. As the composite materials have too small diameter or thickness to be molded in a desired product, they are preferably further subjected to a gathering process, a folding process or a laminating process in which a plurality of strand or film materials are welded to each other at the surface thereof and formed into a strand or sheet form capable of molding.
摘要:
The present invention is to provide a method and an apparatus for molding a resin composite sheet having an improved composite property. Therefore, the method and apparatus according to the present invention comprises a step or means of extruding film sheets through plurality of dies from a thermoplastic composite composition comprising a thermoplastic matrix resin, a liquid crystal resin which has a liquid crystal transition temperature higher than a minimum temperature of the matrix resin and an ability to be melt-extruded into a fiber in the matrix resin; a step or means of laminating the liquid crystal resin composite films into an integral or one body sheet by superposing and pressing them to each other at a melt-bonding temperature higher than the minimum moldable temperature of the matrix resin and lower than the liquid crystal transition temperature while discharging the air therebetween by means of the pressing pressure.