公开(公告)号：US20130042472A1

公开(公告)日：2013-02-21

申请号：US13617694

申请日：2012-09-14

Applicant: Doo-Hwan LEE ,  Byoung-Youl MIN ,  Myung-Sam KANG ,  Moon-II KIM ,  Hyung-Tae KIM

Inventor： Doo-Hwan LEE ,  Byoung-Youl MIN ,  Myung-Sam KANG ,  Moon-II KIM ,  Hyung-Tae KIM

IPC: H05K3/30

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/10515 ,  Y10T29/4913 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

Abstract: A method of manufacturing a printed circuit board having embedded electronic components, the method including: mounting a first electronic component on one side of a core sheet and mounting a second electric component on the other side of the core sheet such that the second electronic component overlaps the first electronic component; stacking a first insulation layer on one side of the core sheet such that the first insulation layer covers the first electronic component and stacking a second insulation layer on the other side of the core sheet such that the second insulation layer covers the second electronic component; and forming a circuit pattern on a surface of the first insulation layer or the second insulation layer.

Abstract translation: 一种制造具有嵌入式电子部件的印刷电路板的方法，所述方法包括：将第一电子部件安装在芯片的一侧，并将第二电气部件安装在芯板的另一侧，使得第二电子部件重叠 第一个电子元件; 在芯片的一侧堆叠第一绝缘层，使得第一绝缘层覆盖第一电子部件，并且在芯片的另一侧堆叠第二绝缘层，使得第二绝缘层覆盖第二电子部件; 以及在所述第一绝缘层或所述第二绝缘层的表面上形成电路图案。

公开(公告)号：US20130004596A1

公开(公告)日：2013-01-03

申请号：US13579743

申请日：2011-02-21

Applicant: Bong Hyun Chung ,  Moon II Kim ,  So Yeon Yi ,  Uii Jin Lee ,  Kyoungsook Park ,  Pan Kee Bae

Inventor： Bong Hyun Chung ,  Moon II Kim ,  So Yeon Yi ,  Uii Jin Lee ,  Kyoungsook Park ,  Pan Kee Bae

IPC: A61K36/39 ,  A61P9/10 ,  A61P13/12 ,  A61P27/02 ,  A61P35/00 ,  A61P3/10 ,  A61P9/00

CPC classification number: A61K36/39 ,  A23L33/105 ,  A23V2002/00 ,  A23V2200/328 ,  A23V2250/21

Abstract: The present invention relates to a pharmaceutical composition for treating diabetes and its complications, containing a Quamoclit angulata extract, and more particularly to a Quamoclit angulata extract, a pharmaceutical composition for preventing or treating diabetes and its complications, a pharmaceutical composition for preventing or delaying aging, and a pharmaceutical composition for preventing or treating cancer, which contain the Quamoclit angulata extract. The compositions of the invention exhibit excellent effects on blood glucose lowering, promotion of insulin secretion, reduction of proteinuria, and reduction of lenticular opacity. Thus, the pharmaceutical compositions have excellent effects on the prevention or treatment of diabetes and its complications.

Abstract translation: 本发明涉及用于治疗糖尿病及其并发症的药物组合物，其含有Quamoclit angulata提取物，更具体地涉及Quamoclit angulata提取物，用于预防或治疗糖尿病及其并发症的药物组合物，用于预防或延缓衰老的药物组合物 ，以及含有Quamoclit angulata提取物的用于预防或治疗癌症的药物组合物。 本发明的组合物显示出对血糖降低，促进胰岛素分泌，减少蛋白尿以及减少透镜不透明度的优异效果。 因此，药物组合物对预防或治疗糖尿病及其并发症具有优异的效果。

公开(公告)号：US07108788B2

公开(公告)日：2006-09-19

申请号：US10487387

申请日：2002-08-29

Applicant: Ho Nam Chang ,  Do-Yun Kim ,  Moon-II Kim ,  Chul-Hee Ryu ,  Woo-Gi Lee

Inventor： Ho Nam Chang ,  Do-Yun Kim ,  Moon-II Kim ,  Chul-Hee Ryu ,  Woo-Gi Lee

IPC: C02F3/28 ,  B09B3/00

CPC classification number: B09B3/00 ,  C05F9/00 ,  Y02A40/214 ,  Y02W30/47 ,  Y10S210/92 ,  C05F9/02 ,  C05F9/04

Abstract: Disclosed is an on-site treatment method of food waste generated from multi-unit dwellings and institutional food service facilities, by transporting wastewater-containing food waste to a separation chamber by use of domestic wastewater or an additional transporter; separating the transported food waste to wastewater and food waste; and treating the separated wastewater in a sewage disposal plant, and the separated food waste using disposal equipment. Such food waste can be treated even using disposal equipment of small capacities, due to separation of wastewater and food waste, compared to disposal equipment of large capacities required for treating wastewater and food waste together. Also, the quality of the separated wastewater is better than the conventional quality of wastewater, and thus loads of the sewage disposal plant can be efficiently decreased.

Abstract translation: 公开了通过使用生活污水或附加运输工具将含废水的食物废物运送到分离室的多单位住房和机构性食品服务设施产生的食品废物的现场处理方法; 将运送的食物废物分解成废水和食物废物; 并处理污水处理厂中分离的废水，以及使用处置设备分离的食物废物。 与处理废水和食物废物所需的大容量的处理设备相比，这种食物废物可以处理甚至使用小容量的处理设备，因为废水和食物废物的分离。 此外，分离废水的质量优于常规废水质量，因此可以有效降低污水处理厂的负荷。

公开(公告)号：US20110141711A1

公开(公告)日：2011-06-16

申请号：US12967585

申请日：2010-12-14

Applicant: Seung-Hyun SOHN ,  Yul-Kyo Chung ,  Dae-Jung Byun ,  Moon-II Kim

Inventor： Seung-Hyun SOHN ,  Yul-Kyo Chung ,  Dae-Jung Byun ,  Moon-II Kim

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H01L23/5389 ,  H01L23/5383 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2924/01029 ,  H05K1/185 ,  H05K2201/09063 ,  H05K2203/1469 ,  H05K2203/166 ,  Y10T29/4913

Abstract: An electronic component embedded printed circuit board and a method of manufacture the same are disclosed. The electronic component embedded printed circuit board in accordance with an embodiment of the present invention can include a dielectric core substrate, which has a cavity formed therein, an electronic component, which is housed in the cavity and has an electrode formed on one surface thereof, an insulation layer, which is formed on both surface of the dielectric core substrate, a via, which is formed in the insulation layer such that the via is electrically connected to the electrode, and a first circuit pattern, which is formed on the insulation layer such that the first circuit pattern is electrically connected to the via.

Abstract translation: 公开了电子部件嵌入式印刷电路板及其制造方法。 根据本发明的实施例的电子部件嵌入式印刷电路板可以包括其中形成有腔的电介质芯基板，容纳在空腔中并具有形成在其一个表面上的电极的电子部件， 形成在介质芯基板的两个表面上的绝缘层，形成在绝缘层中的通孔，使得通孔电连接到电极;以及第一电路图案，其形成在绝缘层上 使得第一电路图案电连接到通孔。