公开(公告)号：US07781885B2

公开(公告)日：2010-08-24

申请号：US12114623

申请日：2008-05-02

申请人： Tai-Wei Lin ,  Chi-Chui Yun ,  Jia-Bin Huang ,  Zeu-Chia Tan ,  Wan-chen Lai

发明人： Tai-Wei Lin ,  Chi-Chui Yun ,  Jia-Bin Huang ,  Zeu-Chia Tan ,  Wan-chen Lai

IPC分类号： H01L23/10 ,  H01L21/00

CPC分类号： H01S5/02469 ,  H01L33/648 ,  H01L2224/48091 ,  H01S5/02208 ,  H01S5/02236 ,  H01S5/02288 ,  H01L2924/00014

摘要： An optoelectronic semiconductor package for packaging a heat source capable of emitting light includes a base, a seal member, and a plurality of heat-dissipation elements. The base carries and touches the heat source and has a plurality of openings formed thereon, and the seal member is used to seal the heat source on the base. Each of the heat-dissipation elements is inserted in one of the corresponding openings, and the heat-dissipation element placed in the corresponding opening is deformed to result in a tight coupling between the heat-dissipation element and the base.

摘要翻译： 用于封装能够发光的热源的光电子半导体封装件包括基座，密封件和多个散热元件。 基座承载并接触热源并且在其上形成有多个开口，并且密封构件用于密封基座上的热源。 每个散热元件插入到相应的开口之一中，放置在相应的开口中的散热元件变形，导致散热元件与底座之间的紧密耦合。

公开(公告)号：US20090052483A1

公开(公告)日：2009-02-26

申请号：US12114623

申请日：2008-05-02

申请人： Tai-Wei LIN ,  Chi-Chui Yun ,  Jia-Bin Huang ,  Zeu-Chia Tan ,  Wan-chen Lai

发明人： Tai-Wei LIN ,  Chi-Chui Yun ,  Jia-Bin Huang ,  Zeu-Chia Tan ,  Wan-chen Lai

IPC分类号： H01S5/024 ,  H01L33/00

CPC分类号： H01S5/02469 ,  H01L33/648 ,  H01L2224/48091 ,  H01S5/02208 ,  H01S5/02236 ,  H01S5/02288 ,  H01L2924/00014

摘要： An optoelectronic semiconductor package for packaging a heat source capable of emitting light includes a base, a seal member, and a plurality of heat-dissipation elements. The base carries and touches the heat source and has a plurality of openings formed thereon, and the seal member is used to seal the heat source on the base. Each of the heat-dissipation elements is inserted in one of the corresponding openings, and the heat-dissipation element placed in the corresponding opening is deformed to result in a tight coupling between the heat-dissipation element and the base.

摘要翻译： 用于封装能够发光的热源的光电子半导体封装件包括基座，密封件和多个散热元件。 基座承载并接触热源并且在其上形成有多个开口，并且密封构件用于密封基座上的热源。 每个散热元件插入到相应的开口之一中，放置在相应的开口中的散热元件变形，导致散热元件与底座之间的紧密耦合。

公开(公告)号：US20100091501A1

公开(公告)日：2010-04-15

申请号：US12588189

申请日：2009-10-07

申请人： Zeu-Chia Tan ,  Chi-Chui Yun ,  Wan-Chen Lai

发明人： Zeu-Chia Tan ,  Chi-Chui Yun ,  Wan-Chen Lai

IPC分类号： F21V29/00 ,  H01J61/52

CPC分类号： H01L33/486 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10416 ,  H01L2924/00

摘要： A light emitting diode (LED) apparatus includes a heat dissipating component, a flexible circuit board, a slug, a light emitting diode die, and a package material. The flexible circuit board has a hollow-out portion disposed on the heat dissipating component. The slug is thermal conductively connected to the heat dissipating component through the hollow-out portion of the flexible circuit board. The light emitting diode die is disposed on the slug, and electrically connected to the flexible circuit board. The package material covers the light emitting diode die and the slug, and the bottom thereof is connected to the flexible circuit board. The light emitting diode apparatus is applied to an optical engine having a chassis and a top cover. The flexible circuit board of the light emitting diode apparatus is assembled on the chassis, and the heat dissipating component thereof is assembled on the top cover.

摘要翻译： 发光二极管（LED）装置包括散热部件，柔性电路板，芯棒，发光二极管管芯和封装材料。 柔性电路板具有设置在散热部件上的中空部分。 芯块通过柔性电路板的中空部分与散热部件导热连接。 发光二极管裸片设置在芯片上，并电连接到柔性电路板。 封装材料覆盖发光二极管裸片和芯块，其底部连接到柔性电路板。 发光二极管装置应用于具有底架和顶盖的光学引擎。 发光二极管装置的柔性电路板组装在底盘上，其散热部件组装在顶盖上。