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公开(公告)号:US20070249770A1
公开(公告)日:2007-10-25
申请号:US11629884
申请日:2005-06-21
申请人: Hiroji Fukui , Yasuyuki Ieda , Tetsunari Iwade
发明人: Hiroji Fukui , Yasuyuki Ieda , Tetsunari Iwade
IPC分类号: C04B35/632 , C08F220/10 , C08F290/06 , C08K3/00 , C08L55/00
CPC分类号: C04B35/63424 , B22F1/0059 , C03C8/16 , C04B35/111 , C04B35/6264 , C04B35/62655 , C04B35/6346 , C04B35/63488 , C04B35/638 , C08F220/14 , C08F220/26 , C08F290/06 , C08F290/061 , C08F290/062 , C08F293/00 , C08F293/005 , C08L53/00 , H01J2217/49264 , C08L2666/02
摘要: A binder resin composition which shows no “stringing” when used in printing and can disappear without leaving any residue upon burning at a relatively low temperature; a glass paste; and a ceramic paste. The binder resin composition contains as a matrix resin a copolymer (A) comprising a segment derived from an alkyl(meth)acrylate monomer and a polyalkylene oxide segment composed of repeating units represented by the following chemical formula (1). —(OR)n— (1) R is C3 or higher alkylene and n is an integer.
摘要翻译: 当在印刷中使用时不显示“拉丝”的粘合剂树脂组合物,并且可以在相对低的温度下燃烧时不留下任何残留物而消失; 玻璃糊 和陶瓷膏。 粘合剂树脂组合物含有由(甲基)丙烯酸烷基酯单体衍生的链段和由以下化学式(1)表示的重复单元构成的聚环氧烷链段的共聚物(A)作为基质树脂。 - (OR)n - (1)R是C 3或更高亚烷基,n是整数。
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公开(公告)号:US20120126282A1
公开(公告)日:2012-05-24
申请号:US13387725
申请日:2011-03-18
申请人: Mitsuru Tanikawa , Takashi Watanabe , Shintaro Moriguchi , Osamu Inui , Yoshitaka Kunihiro , Ryosuke Yamazaki , Ayuko Oki , Yasuyuki Ieda , Chizuru Kimu , Yusuke Kobayashi
发明人: Mitsuru Tanikawa , Takashi Watanabe , Shintaro Moriguchi , Osamu Inui , Yoshitaka Kunihiro , Ryosuke Yamazaki , Ayuko Oki , Yasuyuki Ieda , Chizuru Kimu , Yusuke Kobayashi
CPC分类号: H01L23/296 , C08G77/12 , C08G77/20 , C08G77/52 , C08G77/80 , C08L83/04 , C08L83/14 , H01L33/56 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要: The present invention provides a sealant for an optical semiconductor device which has high gas barrier property against corrosive gas, and is less likely to crack or is less likely to peel off even when used in harsh environments.The sealant for an optical semiconductor device includes: a first silicone resin component including at least one of a first silicone resin A represented by formula (1A) shown below and a first silicone resin B represented by formula (1B) shown below, the first silicone resin A not containing a hydrogen atom bound to a silicon atom, but containing an aryl group and an alkenyl group, the first silicone resin B not containing a hydrogen atom bound to a silicon atom, but containing an aryl group and an alkenyl group; a second silicone resin component including at least one of a second silicone resin A represented by formula (51A) shown below and a second silicone resin B represented by formula (51B) shown below, the second silicone resin A containing an aryl group and a hydrogen atom directly bound to a silicon atom, the second silicone resin B containing an aryl group and a hydrogen atom directly bound to a silicon atom; and a catalyst for hydrosilylation reaction.
摘要翻译: 本发明提供一种用于光学半导体器件的密封剂,其对腐蚀性气体具有高阻气性,并且即使在恶劣环境中使用也不太可能破裂或不太可能剥落。 用于光学半导体器件的密封剂包括:第一有机硅树脂组分,其包含以下所示的由式(1A)表示的第一有机硅树脂A和由下式(1B)表示的第一有机硅树脂B,第一硅氧烷 不含有与硅原子但含有芳基和烯基的氢原子的第一有机硅树脂B不含有与硅原子结合但含有芳基和烯基的氢原子; 第二有机硅树脂组分,其包含如下所示的由式(51A)表示的第二有机硅树脂A和由下式(51B)表示的第二有机硅树脂B中的至少一种,第二有机硅树脂A含有芳基和氢 直接与硅原子结合的原子,第二有机硅树脂B含有与硅原子直接结合的芳基和氢原子; 和氢化硅烷化反应的催化剂。
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公开(公告)号:US07767753B2
公开(公告)日:2010-08-03
申请号:US11629884
申请日:2005-06-21
申请人: Hiroji Fukui , Yasuyuki Ieda , Tetsunari Iwade
发明人: Hiroji Fukui , Yasuyuki Ieda , Tetsunari Iwade
IPC分类号: C08L29/04 , C08L33/06 , C08F220/18 , C03C1/00
CPC分类号: C04B35/63424 , B22F1/0059 , C03C8/16 , C04B35/111 , C04B35/6264 , C04B35/62655 , C04B35/6346 , C04B35/63488 , C04B35/638 , C08F220/14 , C08F220/26 , C08F290/06 , C08F290/061 , C08F290/062 , C08F293/00 , C08F293/005 , C08L53/00 , H01J2217/49264 , C08L2666/02
摘要: A binder resin composition which shows no “stringing” when used in printing and can disappear without leaving any residue upon burning at a relatively low temperature; a glass paste; and a ceramic paste. The binder composition contains as a matrix resin, a copolymer (A) comprising a segment derived from an alkyl(meth)acrylate monomer and a polyalkylene oxide segment composed of repeating units represented by the following chemical formula (1), —(OR)n- wherein R is C3 or higher alkylene and n is an integer.
摘要翻译: 当在印刷中使用时不显示“拉丝”的粘合剂树脂组合物,并且可以在相对低的温度下燃烧时不留下任何残留物而消失; 玻璃糊 和陶瓷膏。 粘合剂组合物含有作为基质树脂的共聚物(A),其包含衍生自(甲基)丙烯酸烷基酯单体的链段和由以下化学式(1)表示的重复单元构成的聚环氧烷链段, - (OR)n - 其中R为C3或更高级的亚烷基且n为整数。
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