公开(公告)号：US20120126282A1

公开(公告)日：2012-05-24

申请号：US13387725

申请日：2011-03-18

申请人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Shintaro Moriguchi ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Ryosuke Yamazaki ,  Ayuko Oki ,  Yasuyuki Ieda ,  Chizuru Kimu ,  Yusuke Kobayashi

发明人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Shintaro Moriguchi ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Ryosuke Yamazaki ,  Ayuko Oki ,  Yasuyuki Ieda ,  Chizuru Kimu ,  Yusuke Kobayashi

IPC分类号： H01L33/52 ,  C09K11/02 ,  C08K9/06 ,  C08L83/04 ,  C08K3/36

CPC分类号： H01L23/296 ,  C08G77/12 ,  C08G77/20 ,  C08G77/52 ,  C08G77/80 ,  C08L83/04 ,  C08L83/14 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： The present invention provides a sealant for an optical semiconductor device which has high gas barrier property against corrosive gas, and is less likely to crack or is less likely to peel off even when used in harsh environments.The sealant for an optical semiconductor device includes: a first silicone resin component including at least one of a first silicone resin A represented by formula (1A) shown below and a first silicone resin B represented by formula (1B) shown below, the first silicone resin A not containing a hydrogen atom bound to a silicon atom, but containing an aryl group and an alkenyl group, the first silicone resin B not containing a hydrogen atom bound to a silicon atom, but containing an aryl group and an alkenyl group; a second silicone resin component including at least one of a second silicone resin A represented by formula (51A) shown below and a second silicone resin B represented by formula (51B) shown below, the second silicone resin A containing an aryl group and a hydrogen atom directly bound to a silicon atom, the second silicone resin B containing an aryl group and a hydrogen atom directly bound to a silicon atom; and a catalyst for hydrosilylation reaction.

摘要翻译： 本发明提供一种用于光学半导体器件的密封剂，其对腐蚀性气体具有高阻气性，并且即使在恶劣环境中使用也不太可能破裂或不太可能剥落。 用于光学半导体器件的密封剂包括：第一有机硅树脂组分，其包含以下所示的由式（1A）表示的第一有机硅树脂A和由下式（1B）表示的第一有机硅树脂B，第一硅氧烷 不含有与硅原子但含有芳基和烯基的氢原子的第一有机硅树脂B不含有与硅原子结合但含有芳基和烯基的氢原子; 第二有机硅树脂组分，其包含如下所示的由式（51A）表示的第二有机硅树脂A和由下式（51B）表示的第二有机硅树脂B中的至少一种，第二有机硅树脂A含有芳基和氢 直接与硅原子结合的原子，第二有机硅树脂B含有与硅原子直接结合的芳基和氢原子; 和氢化硅烷化反应的催化剂。

公开(公告)号：US20120146088A1

公开(公告)日：2012-06-14

申请号：US13390768

申请日：2011-06-22

申请人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Shintaro Moriguchi ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Ryosuke Yamazaki ,  Ayuko Oki

发明人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Shintaro Moriguchi ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Ryosuke Yamazaki ,  Ayuko Oki

IPC分类号： H01L33/56 ,  C08L83/07

CPC分类号： H01L33/56 ,  C08G77/12 ,  C08G77/20 ,  C08G77/80 ,  C08L83/04 ,  C09K3/1018 ,  C08L83/00

摘要： The present invention provides a sealant for an optical semiconductor device which is less likely to reduce its luminance and is also less likely to change its color even used in an energized state in harsh environments of high temperature and high humidity.The sealant for an optical semiconductor device includes: a first organopolysiloxane not containing a hydrogen atom bound to a silicon atom, but containing an alkenyl group bound to a silicon atom and an aryl group bound to a silicon atom, a second organopolysiloxane containing a hydrogen atom bound to a silicon atom and an aryl group bound to a silicon atom, and a platinum-alkenyl complex. The platinum-alkenyl complex is a reaction product obtained by reacting chloroplatinic acid hexahydrate with not less than 6 equivalent of a bi- or more-functional alkenyl compound. The ratio of the number of the alkenyl group bound to a silicon atom in the organopolysiloxane to the number of the hydrogen atom bound to a silicon atom in the organopolysiloxane in the sealant is not less than 1.0 and not more than 2.5.

摘要翻译： 本发明提供了一种用于光学半导体器件的密封剂，其不太可能降低其亮度，并且即使在高温和高湿度的恶劣环境中的通电状态下使用也不太可能改变其颜色。 用于光学半导体器件的密封剂包括：不包含与硅原子结合的氢原子但含有与硅原子键合的烯基和与硅原子结合的芳基的第一有机聚硅氧烷，含有氢原子的第二有机聚硅氧烷 结合到硅原子和与硅原子结合的芳基，以及铂 - 烯基复合物。 铂 - 烯基络合物是通过使氯铂酸六水合物与不少于6当量的双官能或更多官能的烯基化合物反应而获得的反应产物。 与有机聚硅氧烷中的硅原子结合的烯基的数量与密封剂中的有机聚硅氧烷中与硅原子结合的氢原子数的比例为1.0以上2.5以下。

公开(公告)号：US20140175505A1

公开(公告)日：2014-06-26

申请号：US14232544

申请日：2012-07-11

申请人： Ryosuke Yamazaki ,  Mitsuru Tanikawa ,  Takashi Watanabe ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Chizuru Kimu ,  Yusuke Kobayashi ,  Hidefumi Yasui ,  Minoru Suezaki ,  Yasunari Kusaka ,  Tasuku Yamada

发明人： Ryosuke Yamazaki ,  Mitsuru Tanikawa ,  Takashi Watanabe ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Chizuru Kimu ,  Yusuke Kobayashi ,  Hidefumi Yasui ,  Minoru Suezaki ,  Yasunari Kusaka ,  Tasuku Yamada

IPC分类号： H01L33/56

CPC分类号： H01L33/56 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08K5/56 ,  C08L83/04 ,  C08L83/00

摘要： The present invention provides an encapsulant for optical semiconductor devices, which is capable of suppressing surface tackiness of a cured product and is also capable of enhancing the heat resistance and thermal cycle characteristics of the cured product. An encapsulant for optical semiconductor devices according to the present invention which includes: a first organopolysiloxane which is represented by formula (1A) or formula (1B) and has an alkenyl group and a methyl group bonded to a silicon atom; a second organopolysiloxane which is represented by formula (51A) or formula (51B) and has a hydrogen atom bonded to a silicon atom and a methyl group bonded to a silicon atom; and a catalyst for hydrosilylation reaction, and the content ratios of methyl groups bonded to silicon atoms in the first and second organopolysiloxanes each are 80 mol % or more. (R1R2R3SiO1/2)a(R4R5SiO2/2)b(R6SiO3/2)c  Formula (1A) (R1R2R3SiO1/2)a(R4R5SiO1/2)b(R6SiO3/2)c  Formula (1B) (R51R52R53SiO1/2)p(R54R55SiO2/2)q(R56SiO3/2)r  Formula (51A) (R51R52R53SiO1/2)p(R54R55SiO2/2)q(R56SiO3/2)r  Formula (51B)

摘要翻译： 本发明提供一种能够抑制固化物的表面粘性的光半导体装置用密封剂，能够提高固化物的耐热性和热循环特性。 根据本发明的光学半导体器件的密封剂，其包括：由式（1A）或式（1B）表示并具有与硅原子键合的烯基和甲基的第一有机聚硅氧烷; 由式（51A）或式（51B）表示的具有与硅原子键合的氢原子和与硅原子键合的甲基的第二有机聚硅氧烷; 和用于氢化硅烷化反应的催化剂，并且与第一和第二有机聚硅氧烷中的硅原子键合的甲基的含量比分别为80摩尔％以上。 （R1R2R3SiO1 / 2）a（R4R5SiO2 / 2）b（R6SiO3 / 2）c式（1A）（R1R2R3SiO1 / 2）a（R4R5SiO1 / 2）b（R6SiO3 / 2）c式（1B）（R51R52R53SiO1 / 2） （R54R55SiO2 / 2）q（R56SiO3 / 2）r式（51A）（R51R52R53SiO1 / 2）p（R54R55SiO2 / 2）q（R56SiO3 / 2）

公开(公告)号：US08519429B2

公开(公告)日：2013-08-27

申请号：US13390768

申请日：2011-06-22

申请人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Shintaro Moriguchi ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Ryosuke Yamazaki ,  Ayuko Oki

发明人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Shintaro Moriguchi ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Ryosuke Yamazaki ,  Ayuko Oki

IPC分类号： H01L33/56

CPC分类号： H01L33/56 ,  C08G77/12 ,  C08G77/20 ,  C08G77/80 ,  C08L83/04 ,  C09K3/1018 ,  C08L83/00

摘要： The present invention provides a sealant for an optical semiconductor device which is less likely to reduce its luminance and is also less likely to change its color even used in an energized state in harsh environments of high temperature and high humidity.The sealant for an optical semiconductor device includes: a first organopolysiloxane not containing a hydrogen atom bound to a silicon atom, but containing an alkenyl group bound to a silicon atom and an aryl group bound to a silicon atom, a second organopolysiloxane containing a hydrogen atom bound to a silicon atom and an aryl group bound to a silicon atom, and a platinum-alkenyl complex. The platinum-alkenyl complex is a reaction product obtained by reacting chloroplatinic acid hexahydrate with not less than 6 equivalent of a bi- or more-functional alkenyl compound. The ratio of the number of the alkenyl group bound to a silicon atom in the organopolysiloxane to the number of the hydrogen atom bound to a silicon atom in the organopolysiloxane in the sealant is not less than 1.0 and not more than 2.5.

摘要翻译： 本发明提供了一种用于光学半导体器件的密封剂，其不太可能降低其亮度，并且即使在高温和高湿度的恶劣环境中的通电状态下使用也不太可能改变其颜色。 用于光学半导体器件的密封剂包括：不包含与硅原子结合的氢原子但含有与硅原子键合的烯基和与硅原子结合的芳基的第一有机聚硅氧烷，含有氢原子的第二有机聚硅氧烷 结合到硅原子和与硅原子结合的芳基，以及铂 - 烯基复合物。 铂 - 烯基络合物是通过使氯铂酸六水合物与不少于6当量的双官能或更多官能的烯基化合物反应而获得的反应产物。 与有机聚硅氧烷中的硅原子结合的烯基的数量与密封剂中的有机聚硅氧烷中与硅原子结合的氢原子数的比例为1.0以上2.5以下。

公开(公告)号：US20130221400A1

公开(公告)日：2013-08-29

申请号：US13880366

申请日：2011-09-15

申请人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Ryosuke Yamazaki ,  Yusuke Kobayashi

发明人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Ryosuke Yamazaki ,  Yusuke Kobayashi

IPC分类号： C08K5/04 ,  C08K5/5419 ,  H01L33/52

CPC分类号： C08K5/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/80 ,  C08K5/0091 ,  C08K5/057 ,  C08K5/5419 ,  C08K5/5425 ,  C08K5/5435 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  C09K3/1018 ,  H01L23/296 ,  H01L33/501 ,  H01L33/52 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： Provided is an encapsulant for optical semiconductor devices, which is capable of enhancing the adhesion between a housing and the encapsulant when an optical semiconductor device is encapsulated in the housing, and which is also capable of enhancing the bonding reliability with respect to humidity. The encapsulant for optical semiconductor devices includes: a first organopolysiloxane having an alkenyl group bonded to a silicon atom and an aryl group bonded to a silicon atom, but not having a hydrogen atom bonded to a silicon atom; a second organopolysiloxane having a hydrogen atom bonded to a silicon atom and an aryl group bonded to a silicon atom; a catalyst for hydrosilylation reaction; and an organic compound having a titanium atom.

摘要翻译： 提供了一种用于光学半导体器件的密封剂，当光学半导体器件被封装在外壳中时，其能够增强外壳和密封剂之间的粘附性，并且还能够提高相对于湿度的粘合可靠性。 光学半导体装置的密封剂包括：具有与硅原子键合的烯基的第一有机聚硅氧烷和与硅原子键合而不具有与硅原子键合的氢原子的芳基; 具有与硅原子键合的氢原子和与硅原子键合的芳基的第二有机聚硅氧烷; 氢化硅烷化反应的催化剂; 和具有钛原子的有机化合物。

公开(公告)号：US20090091045A1

公开(公告)日：2009-04-09

申请号：US12226690

申请日：2007-04-25

申请人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Takashi Nishimura

发明人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Takashi Nishimura

IPC分类号： H01L23/29 ,  C08L83/04

CPC分类号： C08G59/306 ,  C08G59/42 ,  C08G77/14 ,  C09D183/06 ,  H01L23/296 ,  H01L33/56 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A thermosetting composition for an optical semiconductor containing a silicone resin having a cyclic ether-containing groups and a thermosetting agent capable of reacting with said cyclic ether-containing group, wherein the silicone resin has, as the principal components, a structural unit expressed by the following formula (1) and a structural unit expressed by the following formula (2). The content of the structural unit expressed by the formula (1) is 0.6 to 0.95 (on a molar basis) and the content of the structural unit expressed by the formula (2) is 0.05 to 0.4 (on a molar basis) when total number of the structural units contained is taken as 1, and the content of the cyclic ether-containing group is 5 to 40 mol %:[formula 1] (R1R2SiO2/2)  (1) and [formula 2] (R3SiO3/2)  (2) at least one of R1, R2 and R3 represents a cyclic ether-containing group, R1, R2 and R3 other than the cyclic ether-containing group represent hydrocarbon having 1 to 8 carbon atoms or fluoride thereof.

摘要翻译： 一种用于光学半导体的热固性组合物，其含有具有环状含醚基团的硅氧烷树脂和能够与所述含环状醚基团反应的热固性涂料，其中所述硅树脂具有以下成分的结构单元： （1）表示的结构单元和下述式（2）表示的结构单元。 由式（1）表示的结构单元的含量为0.6〜0.95（摩尔数），式（2）表示的结构单元的含量为0.05〜0.4（摩尔数），当总数 所含的结构单元为1，含环状醚的基团的含量为5〜40摩尔％：[式1] <？在线式描述=“在线式”末端=“铅 （R1R2SiO2 / 2）（1）<？in-line-formula description =“In-line formula”end =“tail”？>和[formula 2] <？in-line-formula description =“In- （R3SiO3 / 2）（2）<？in-line-formula description =“In-line Formulas”end =“tail”？> R1，R2和R3中的至少一个表示 除含环状醚的基团以外的含环状醚的基团R1，R2和R3表示碳原子数为1〜8的碳原子或氟原子。

公开(公告)号：US20060240198A1

公开(公告)日：2006-10-26

申请号：US10559529

申请日：2004-06-04

申请人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Yuichi Oyama ,  Takuya Yamamoto ,  Sadamu Uwagawa

发明人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Yuichi Oyama ,  Takuya Yamamoto ,  Sadamu Uwagawa

IPC分类号： C09K19/00 ,  B32B27/38 ,  C08L63/00 ,  B32B9/04

CPC分类号： C08G59/1466 ,  C08F283/10 ,  C08F290/06 ,  C08L63/10 ,  G03F7/027 ,  G03F7/031 ,  G03F7/0388 ,  Y10T428/1073 ,  Y10T428/31515

摘要： It is the object of the invention to provide a curable resin composition which causes no liquid crystal contamination, which are excellent in the adhesive property to a glass, and which causes no cell gap inequality in the case it is used as a sealant for a liquid crystal display element to produce a liquid crystal display element by a one drop fill process, a sealant for a liquid crystal display element, and a liquid crystal display element. The invention is a curable resin composition, which contains a curable resin to be cured by light and/or heat and a polymerization initiator, the curable resin being a crystalline (meth)acrylic acid-modified epoxy resin comprising a (meth)acrylic group and an epoxy group in one molecule.

摘要翻译： 本发明的目的是提供一种不会产生液晶污染的可固化树脂组合物，它们对玻璃的粘合性能优异，并且在用作液体密封剂的情况下不会产生电池间隙不均 晶体显示元件，通过一滴填充工艺制造液晶显示元件，用于液晶显示元件的密封剂和液晶显示元件。 本发明是一种可固化树脂组合物，其含有通过光和/或热固化的可固化树脂和聚合引发剂，该固化树脂是包含（甲基）丙烯酸基团的结晶（甲基）丙烯酸改性环氧树脂和 一个分子中的环氧基。

公开(公告)号：US20090134358A1

公开(公告)日：2009-05-28

申请号：US12274103

申请日：2008-11-19

申请人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Yuichi Oyama ,  Takuya Yamamoto ,  Sadamu Uwagawa

发明人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Yuichi Oyama ,  Takuya Yamamoto ,  Sadamu Uwagawa

IPC分类号： C08G59/17 ,  C09K19/52

CPC分类号： C08G59/18 ,  C08F290/06 ,  C08F290/064 ,  C08L63/10 ,  G02F1/1339

摘要： It is the object of the invention to provide a curable resin composition which causes no liquid crystal contamination, which are excellent in the adhesive property to a glass, and which causes no cell gap inequality in the case it is used as a sealant for a liquid crystal display element to produce a liquid crystal display element by a one drop fill process, a sealant for a liquid crystal display element, and a liquid crystal display element.The invention is a curable resin composition, which contains a curable resin to be cured by light and/or heat and a polymerization initiator, the curable resin being a crystalline (meth)acrylic acid-modified epoxy resin comprising a (meth)acrylic group and an epoxy group in one molecule.

摘要翻译： 本发明的目的是提供一种不会产生液晶污染的可固化树脂组合物，它们对玻璃的粘合性能优异，并且在用作液体密封剂的情况下不会产生电池间隙不均 晶体显示元件，通过一滴填充工艺制造液晶显示元件，用于液晶显示元件的密封剂和液晶显示元件。 本发明是一种可固化树脂组合物，其含有通过光和/或热固化的可固化树脂和聚合引发剂，该固化树脂是包含（甲基）丙烯酸基团的结晶（甲基）丙烯酸改性环氧树脂和 一个分子中的环氧基。

公开(公告)号：US20090061117A1

公开(公告)日：2009-03-05

申请号：US11920060

申请日：2006-05-08

申请人： Yuichi Oyama ,  Hideyasu Nakajima ,  Takashi Watanabe ,  Takuya Yamamoto ,  Mitsuru Tanikawa

发明人： Yuichi Oyama ,  Hideyasu Nakajima ,  Takashi Watanabe ,  Takuya Yamamoto ,  Mitsuru Tanikawa

IPC分类号： C09K19/00 ,  C08F232/04 ,  C08F232/08 ,  C08F20/10

CPC分类号： G02F1/1339 ,  G02F1/1341 ,  G02F2001/13415 ,  G02F2202/023 ,  Y10T428/1077

摘要： It is an object of the present invention to provide a sealant for a One prop Fill process which hardly causes a peeling phenomenon between the sealant and a substrate in production of liquid crystal display device since the sealant has excellent adhesion to the substrate, and which is most suitable for producing a liquid crystal display device having low color irregularity in liquid crystal display since the sealant does not cause liquid crystal contamination, and relates to a sealant for a One prop Fill process, in which in production of liquid crystal display device by a One prop Fill process, even a portion where light may be not directly irradiated can be adequately cured, a liquid crystal is not deteriorated by ultraviolet light to be irradiated in curing the sealant, and high display quality and high reliability of the liquid crystal display device can be realized, a vertically conducting material, and a liquid crystal display device obtained by using these.The present invention is directed to a sealant for a One prop Fill process, which contains a (meth)acrylate compound having a structure represented by the following general formula (1), 10 to 70% by weight of a curable resin component contained in the sealant being the (meth)acrylate compound. In the general formula (1), R1 represents a hydrogen atom or a methyl group, X represents one species selected from the group expressed by the following chemical formula (2), Y represents one species selected from the group expressed by the following chemical formula (3), A represents a ring opening structure of cyclic lactone, and n has a value of zero or one.

摘要翻译： 本发明的目的是提供一种用于单支填充方法的密封剂，因为密封剂与基材的粘合性优异，因此液晶显示装置的生产中难以引起密封剂和基板之间的剥离现象， 最适合于制造液晶显示器中具有低颜色不规则性的液晶显示装置，因为密封剂不会引起液晶污染，并且涉及用于One prop填充方法的密封剂，其中在液晶显示装置的制造中 一支撑填充工艺，即使是不能直接照射光的部分也可以充分固化，在固化密封剂时要照射的紫外线不会降低液晶，液晶显示装置的高显示质量和高可靠性 可以实现垂直导电材料，以及通过使用这些材料获得的液晶显示装置。 本发明涉及一种含有（甲基）丙烯酸酯化合物的单支填充方法用密封剂，其具有下述通式（1）所示的结构，10〜70重量％的固化性树脂成分 密封剂为（甲基）丙烯酸酯化合物。 在通式（1）中，R 1表示氢原子或甲基，X表示选自下述化学式（2）所示的一种，Y表示选自下述化学式 （3）中，A表示环状内酯的开环结构，n表示0或1。

公开(公告)号：US08084530B2

公开(公告)日：2011-12-27

申请号：US12452058

申请日：2008-06-13

申请人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Takashi Nishimura

发明人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Takashi Nishimura

IPC分类号： C08K3/34 ,  H01J1/62

CPC分类号： H01L23/296 ,  C08L83/12 ,  H01L33/56 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： The sealing agent for an optical semiconductor device, which comprises: a silicone resin having a cyclic ether-containing group in the molecular structure; a heat curing agent capable of reacting with the cyclic ether-containing group; and a fine particulate material of silicon oxide, and the sealing agent having a viscosity of 500 to 10,000 mPa·s measured by an E-type viscometer at 25° C. at 5 rpm, a thixotropic value of 1.2 to 2.5 calculated by dividing a viscosity measured by the E-type viscometer at 25° C. at 1 rpm by a viscosity measured at 10 rpm (viscosity at 1 rpm/viscosity at 10 rpm), and a minimum viscosity of 100 mPa·s or higher measured at 1 s−1 in the temperature range of 25° C. to a curing temperature by a parallel plate rheometer.

摘要翻译： 一种光学半导体装置用密封剂，其特征在于，具有：具有分子结构的含环状醚的基团的有机硅树脂; 能够与含环状醚的基团反应的热固化剂; 和氧化硅微粒材料，密封剂的粘度为500〜10,000mPa·s，用E型粘度计在25℃，5rpm下测定，触变值为1.2〜2.5，除以 通过E型粘度计在25℃，1rpm下以10rpm（1rpm下的粘度/ 10rpm的粘度）测定的粘度，在1秒时测定的最小粘度为100mPa·s以上 -1，在25℃的温度范围内，通过平行板流变仪测定固化温度。