公开(公告)号：US20130221400A1

公开(公告)日：2013-08-29

申请号：US13880366

申请日：2011-09-15

申请人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Ryosuke Yamazaki ,  Yusuke Kobayashi

发明人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Ryosuke Yamazaki ,  Yusuke Kobayashi

IPC分类号： C08K5/04 ,  C08K5/5419 ,  H01L33/52

CPC分类号： C08K5/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/80 ,  C08K5/0091 ,  C08K5/057 ,  C08K5/5419 ,  C08K5/5425 ,  C08K5/5435 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  C09K3/1018 ,  H01L23/296 ,  H01L33/501 ,  H01L33/52 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： Provided is an encapsulant for optical semiconductor devices, which is capable of enhancing the adhesion between a housing and the encapsulant when an optical semiconductor device is encapsulated in the housing, and which is also capable of enhancing the bonding reliability with respect to humidity. The encapsulant for optical semiconductor devices includes: a first organopolysiloxane having an alkenyl group bonded to a silicon atom and an aryl group bonded to a silicon atom, but not having a hydrogen atom bonded to a silicon atom; a second organopolysiloxane having a hydrogen atom bonded to a silicon atom and an aryl group bonded to a silicon atom; a catalyst for hydrosilylation reaction; and an organic compound having a titanium atom.

摘要翻译： 提供了一种用于光学半导体器件的密封剂，当光学半导体器件被封装在外壳中时，其能够增强外壳和密封剂之间的粘附性，并且还能够提高相对于湿度的粘合可靠性。 光学半导体装置的密封剂包括：具有与硅原子键合的烯基的第一有机聚硅氧烷和与硅原子键合而不具有与硅原子键合的氢原子的芳基; 具有与硅原子键合的氢原子和与硅原子键合的芳基的第二有机聚硅氧烷; 氢化硅烷化反应的催化剂; 和具有钛原子的有机化合物。

公开(公告)号：US3971709A

公开(公告)日：1976-07-27

申请号：US514789

申请日：1974-10-15

申请人： Akira Ohsawa ,  Ryosuke Yamazaki ,  Osamu Ohe ,  Ryoji Okamura

发明人： Akira Ohsawa ,  Ryosuke Yamazaki ,  Osamu Ohe ,  Ryoji Okamura

IPC分类号： B05D3/06 ,  C08G59/34 ,  C09D5/44 ,  C25D13/00 ,  C25D13/08 ,  C25D13/06

CPC分类号： C08G59/027 ,  C09D5/4407

摘要： Smooth cured coated films having excellent properties are formed by electrodepositing and coating a film on a cathode of an electroconductive material in an electrodeposition bath containing a cationically electrodepositing composition, which is composed of a polymer resin having amino groups and acryloyl or methacryloyl groups and of acrylic or methacrylic acid, and curing the coated film by the irradiation of an ionic radiation.

摘要翻译： 通过在包含阳离子电沉积组合物的电沉积浴中，在导电材料的阴极上电沉积和涂覆薄膜来形成具有优异性能的光滑固化涂膜，阳离子电沉积组合物由具有氨基和丙烯酰基或甲基丙烯酰基的聚合物树脂和丙烯酸 或甲基丙烯酸，并通过离子辐射的照射固化涂膜。

公开(公告)号：US20120146088A1

公开(公告)日：2012-06-14

申请号：US13390768

申请日：2011-06-22

申请人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Shintaro Moriguchi ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Ryosuke Yamazaki ,  Ayuko Oki

发明人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Shintaro Moriguchi ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Ryosuke Yamazaki ,  Ayuko Oki

IPC分类号： H01L33/56 ,  C08L83/07

CPC分类号： H01L33/56 ,  C08G77/12 ,  C08G77/20 ,  C08G77/80 ,  C08L83/04 ,  C09K3/1018 ,  C08L83/00

摘要： The present invention provides a sealant for an optical semiconductor device which is less likely to reduce its luminance and is also less likely to change its color even used in an energized state in harsh environments of high temperature and high humidity.The sealant for an optical semiconductor device includes: a first organopolysiloxane not containing a hydrogen atom bound to a silicon atom, but containing an alkenyl group bound to a silicon atom and an aryl group bound to a silicon atom, a second organopolysiloxane containing a hydrogen atom bound to a silicon atom and an aryl group bound to a silicon atom, and a platinum-alkenyl complex. The platinum-alkenyl complex is a reaction product obtained by reacting chloroplatinic acid hexahydrate with not less than 6 equivalent of a bi- or more-functional alkenyl compound. The ratio of the number of the alkenyl group bound to a silicon atom in the organopolysiloxane to the number of the hydrogen atom bound to a silicon atom in the organopolysiloxane in the sealant is not less than 1.0 and not more than 2.5.

摘要翻译： 本发明提供了一种用于光学半导体器件的密封剂，其不太可能降低其亮度，并且即使在高温和高湿度的恶劣环境中的通电状态下使用也不太可能改变其颜色。 用于光学半导体器件的密封剂包括：不包含与硅原子结合的氢原子但含有与硅原子键合的烯基和与硅原子结合的芳基的第一有机聚硅氧烷，含有氢原子的第二有机聚硅氧烷 结合到硅原子和与硅原子结合的芳基，以及铂 - 烯基复合物。 铂 - 烯基络合物是通过使氯铂酸六水合物与不少于6当量的双官能或更多官能的烯基化合物反应而获得的反应产物。 与有机聚硅氧烷中的硅原子结合的烯基的数量与密封剂中的有机聚硅氧烷中与硅原子结合的氢原子数的比例为1.0以上2.5以下。

公开(公告)号：US20140175505A1

公开(公告)日：2014-06-26

申请号：US14232544

申请日：2012-07-11

申请人： Ryosuke Yamazaki ,  Mitsuru Tanikawa ,  Takashi Watanabe ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Chizuru Kimu ,  Yusuke Kobayashi ,  Hidefumi Yasui ,  Minoru Suezaki ,  Yasunari Kusaka ,  Tasuku Yamada

发明人： Ryosuke Yamazaki ,  Mitsuru Tanikawa ,  Takashi Watanabe ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Chizuru Kimu ,  Yusuke Kobayashi ,  Hidefumi Yasui ,  Minoru Suezaki ,  Yasunari Kusaka ,  Tasuku Yamada

IPC分类号： H01L33/56

CPC分类号： H01L33/56 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08K5/56 ,  C08L83/04 ,  C08L83/00

摘要： The present invention provides an encapsulant for optical semiconductor devices, which is capable of suppressing surface tackiness of a cured product and is also capable of enhancing the heat resistance and thermal cycle characteristics of the cured product. An encapsulant for optical semiconductor devices according to the present invention which includes: a first organopolysiloxane which is represented by formula (1A) or formula (1B) and has an alkenyl group and a methyl group bonded to a silicon atom; a second organopolysiloxane which is represented by formula (51A) or formula (51B) and has a hydrogen atom bonded to a silicon atom and a methyl group bonded to a silicon atom; and a catalyst for hydrosilylation reaction, and the content ratios of methyl groups bonded to silicon atoms in the first and second organopolysiloxanes each are 80 mol % or more. (R1R2R3SiO1/2)a(R4R5SiO2/2)b(R6SiO3/2)c  Formula (1A) (R1R2R3SiO1/2)a(R4R5SiO1/2)b(R6SiO3/2)c  Formula (1B) (R51R52R53SiO1/2)p(R54R55SiO2/2)q(R56SiO3/2)r  Formula (51A) (R51R52R53SiO1/2)p(R54R55SiO2/2)q(R56SiO3/2)r  Formula (51B)

摘要翻译： 本发明提供一种能够抑制固化物的表面粘性的光半导体装置用密封剂，能够提高固化物的耐热性和热循环特性。 根据本发明的光学半导体器件的密封剂，其包括：由式（1A）或式（1B）表示并具有与硅原子键合的烯基和甲基的第一有机聚硅氧烷; 由式（51A）或式（51B）表示的具有与硅原子键合的氢原子和与硅原子键合的甲基的第二有机聚硅氧烷; 和用于氢化硅烷化反应的催化剂，并且与第一和第二有机聚硅氧烷中的硅原子键合的甲基的含量比分别为80摩尔％以上。 （R1R2R3SiO1 / 2）a（R4R5SiO2 / 2）b（R6SiO3 / 2）c式（1A）（R1R2R3SiO1 / 2）a（R4R5SiO1 / 2）b（R6SiO3 / 2）c式（1B）（R51R52R53SiO1 / 2） （R54R55SiO2 / 2）q（R56SiO3 / 2）r式（51A）（R51R52R53SiO1 / 2）p（R54R55SiO2 / 2）q（R56SiO3 / 2）

公开(公告)号：US08519429B2

公开(公告)日：2013-08-27

申请号：US13390768

申请日：2011-06-22

申请人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Shintaro Moriguchi ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Ryosuke Yamazaki ,  Ayuko Oki

发明人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Shintaro Moriguchi ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Ryosuke Yamazaki ,  Ayuko Oki

IPC分类号： H01L33/56

CPC分类号： H01L33/56 ,  C08G77/12 ,  C08G77/20 ,  C08G77/80 ,  C08L83/04 ,  C09K3/1018 ,  C08L83/00

摘要： The present invention provides a sealant for an optical semiconductor device which is less likely to reduce its luminance and is also less likely to change its color even used in an energized state in harsh environments of high temperature and high humidity.The sealant for an optical semiconductor device includes: a first organopolysiloxane not containing a hydrogen atom bound to a silicon atom, but containing an alkenyl group bound to a silicon atom and an aryl group bound to a silicon atom, a second organopolysiloxane containing a hydrogen atom bound to a silicon atom and an aryl group bound to a silicon atom, and a platinum-alkenyl complex. The platinum-alkenyl complex is a reaction product obtained by reacting chloroplatinic acid hexahydrate with not less than 6 equivalent of a bi- or more-functional alkenyl compound. The ratio of the number of the alkenyl group bound to a silicon atom in the organopolysiloxane to the number of the hydrogen atom bound to a silicon atom in the organopolysiloxane in the sealant is not less than 1.0 and not more than 2.5.

摘要翻译： 本发明提供了一种用于光学半导体器件的密封剂，其不太可能降低其亮度，并且即使在高温和高湿度的恶劣环境中的通电状态下使用也不太可能改变其颜色。 用于光学半导体器件的密封剂包括：不包含与硅原子结合的氢原子但含有与硅原子键合的烯基和与硅原子结合的芳基的第一有机聚硅氧烷，含有氢原子的第二有机聚硅氧烷 结合到硅原子和与硅原子结合的芳基，以及铂 - 烯基复合物。 铂 - 烯基络合物是通过使氯铂酸六水合物与不少于6当量的双官能或更多官能的烯基化合物反应而获得的反应产物。 与有机聚硅氧烷中的硅原子结合的烯基的数量与密封剂中的有机聚硅氧烷中与硅原子结合的氢原子数的比例为1.0以上2.5以下。

公开(公告)号：US20120126282A1

公开(公告)日：2012-05-24

申请号：US13387725

申请日：2011-03-18

申请人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Shintaro Moriguchi ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Ryosuke Yamazaki ,  Ayuko Oki ,  Yasuyuki Ieda ,  Chizuru Kimu ,  Yusuke Kobayashi

发明人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Shintaro Moriguchi ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Ryosuke Yamazaki ,  Ayuko Oki ,  Yasuyuki Ieda ,  Chizuru Kimu ,  Yusuke Kobayashi

IPC分类号： H01L33/52 ,  C09K11/02 ,  C08K9/06 ,  C08L83/04 ,  C08K3/36

CPC分类号： H01L23/296 ,  C08G77/12 ,  C08G77/20 ,  C08G77/52 ,  C08G77/80 ,  C08L83/04 ,  C08L83/14 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： The present invention provides a sealant for an optical semiconductor device which has high gas barrier property against corrosive gas, and is less likely to crack or is less likely to peel off even when used in harsh environments.The sealant for an optical semiconductor device includes: a first silicone resin component including at least one of a first silicone resin A represented by formula (1A) shown below and a first silicone resin B represented by formula (1B) shown below, the first silicone resin A not containing a hydrogen atom bound to a silicon atom, but containing an aryl group and an alkenyl group, the first silicone resin B not containing a hydrogen atom bound to a silicon atom, but containing an aryl group and an alkenyl group; a second silicone resin component including at least one of a second silicone resin A represented by formula (51A) shown below and a second silicone resin B represented by formula (51B) shown below, the second silicone resin A containing an aryl group and a hydrogen atom directly bound to a silicon atom, the second silicone resin B containing an aryl group and a hydrogen atom directly bound to a silicon atom; and a catalyst for hydrosilylation reaction.

摘要翻译： 本发明提供一种用于光学半导体器件的密封剂，其对腐蚀性气体具有高阻气性，并且即使在恶劣环境中使用也不太可能破裂或不太可能剥落。 用于光学半导体器件的密封剂包括：第一有机硅树脂组分，其包含以下所示的由式（1A）表示的第一有机硅树脂A和由下式（1B）表示的第一有机硅树脂B，第一硅氧烷 不含有与硅原子但含有芳基和烯基的氢原子的第一有机硅树脂B不含有与硅原子结合但含有芳基和烯基的氢原子; 第二有机硅树脂组分，其包含如下所示的由式（51A）表示的第二有机硅树脂A和由下式（51B）表示的第二有机硅树脂B中的至少一种，第二有机硅树脂A含有芳基和氢 直接与硅原子结合的原子，第二有机硅树脂B含有与硅原子直接结合的芳基和氢原子; 和氢化硅烷化反应的催化剂。