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公开(公告)号:US5739046A
公开(公告)日:1998-04-14
申请号:US657058
申请日:1996-05-28
申请人: Water Lur , Shih-Chanh Chang , Jiun Yuan Wu , Der Yuan Wu
发明人: Water Lur , Shih-Chanh Chang , Jiun Yuan Wu , Der Yuan Wu
IPC分类号: H01L21/285 , H01L21/768 , H01L21/44
CPC分类号: H01L21/76864 , H01L21/28518 , H01L21/76843 , H01L21/76855 , H01L21/76856
摘要: A new method of forming a metal diffusion barrier layer is described. Semiconductor device structures are formed in and on a semiconductor substrate. At least one dielectric layer covers the semiconductor structures and at least one contact hole has been opened through the dielectric layer(s) to the semiconductor substrate. A metal diffusion barrier layer is now formed using the following steps: In the first step, a thin layer of titanium is deposited conformally over the surface of the dielectric layer(s) and within the contact opening(s) and annealed in a nitrogen atmosphere at a temperature of between about 580.degree. to 630.degree. C. for between about 20 to 120 seconds. The second step is to form stable and adhesive titanium compounds on the pre-metal dielectric layer as well as to form a low resistance silicide on the contact silicon by annealing at between about 800.degree. to 900.degree. C. for between about 5 to 60 seconds. The final step is to release the system stress by tempering the layer at a temperature of between about 600.degree. to 750.degree. C. This completes the barrier layer which has good adhesion to the dielectric layer(s) and, therefore, promotes improved pad bonding yield.
摘要翻译: 描述形成金属扩散阻挡层的新方法。 在半导体衬底中形成半导体器件结构。 至少一个电介质层覆盖半导体结构,并且至少一个接触孔已经通过介电层被打开到半导体衬底。 现在通过以下步骤形成金属扩散阻挡层:在第一步骤中,将薄的钛层保形地沉积在电介质层的表面和接触开口内,并在氮气气氛中退火 在约580℃至630℃之间的温度下进行约20至120秒。 第二步是在金属前介电层上形成稳定且粘合的钛化合物,并在接触硅上形成低电阻硅化物,在约800-900℃之间退火约5至60秒 。 最后一步是通过在约600至750℃的温度下回火层来释放系统应力。这完成了与电介质层具有良好粘附性的阻挡层,因此促进改进的焊盘接合 产量。
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公开(公告)号:US5668393A
公开(公告)日:1997-09-16
申请号:US606463
申请日:1996-03-04
申请人: Water Lur , Der Yuan Wu , Jiunn Yuan Wu
发明人: Water Lur , Der Yuan Wu , Jiunn Yuan Wu
IPC分类号: H01L21/762 , H01L29/76 , H01L29/94 , H01L31/062
CPC分类号: H01L21/76216 , H01L21/76213
摘要: A field oxide structure having a reduced number of defects is described. A field oxide mask is formed over a substrate having openings which expose portions of the substrate where the field oxide structures are to be formed. Silicon nitride spacers are formed on the sidewalls of the openings. Channel stop ions are selectively implanted through the opening into the substrate and then the thick field oxide structures are formed. Stress-generated crystalline defects are formed underlying the field oxidation regions at the edges of the openings. The silicon nitride spacers are removed. An additional source/drain ion implantation is performed by implanting ions to doped regions in the substrate deep enough into the substrate so that the crystalline defects are enclosed within the implanted regions to reduce junction leakage. The silicon dioxide, silicon nitride, and pad silicon oxide layers are removed to complete the field oxide structure.
摘要翻译: 描述了具有减少数量的缺陷的场氧化物结构。 在具有开口的基板上形成场氧化物掩模,所述开口暴露要形成场氧化物结构的基板的部分。 氮化硅间隔物形成在开口的侧壁上。 沟道阻挡离子通过开口被选择性地植入到衬底中,然后形成厚的氧化物结构。 应力产生的晶体缺陷形成在开口边缘的场氧化区域的下面。 去除氮化硅间隔物。 通过将离子注入衬底中的掺杂区域足够深地进入衬底来执行附加的源极/漏极离子注入,使得晶体缺陷被包围在注入区域内以减少结漏电。 去除二氧化硅,氮化硅和焊盘氧化硅层以完成场氧化物结构。
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公开(公告)号:US20230011578A1
公开(公告)日:2023-01-12
申请号:US17833849
申请日:2022-06-06
申请人: Yuan WU
发明人: Yuan WU
IPC分类号: G06K1/12
摘要: The present disclosure provides a method and control apparatus for burning an address code of LED lamp beads, and relates to the technical field of LEDs. The method for burning the address code of the LED lamp beads described by the present disclosure is applied to a burner and includes: generating, by the burner, an optical signal; and sending the optical signal to the LED lamp beads such that the LED lamp beads sense the optical signal, convert the optical signal into an address code and store the address code. The present disclosure makes use of a light sensing effect of the LED lamp beads, sends the optical signal to the LED lamp beads through the burner such that the LED lamp beads generate an address code according to the optical signal, and burn the address code into the LED lamp beads.
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公开(公告)号:US20220265054A1
公开(公告)日:2022-08-25
申请号:US17671153
申请日:2022-02-14
申请人: Guo-Yuan WU
发明人: Guo-Yuan WU
摘要: A pelvic tilt detecting chair is provided to a user to sit and configured to detect a pelvic angle of the pelvis of the user in sitting position. The pelvic tilt detecting chair comprises a base, a supporting component, a carrying component and a detector. The base has a horizontal surface. The supporting component comprises a first end connected to the base and a second end. The carrying component is moveably configured and comprises an installing surface coupled to the second end and a chair surface configured to contact the pelvis of the user. The chair surface and the horizontal surface form a tilt angle when the user sits on the carrying component. The detector stores a tilt angle threshold value and is configured to the carrying component to detect the tilt angle. The detector generates a warning signal when the tilt angle is not matched up with the tilt angle threshold value.
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公开(公告)号:US20200245498A1
公开(公告)日:2020-07-30
申请号:US16843898
申请日:2020-04-09
申请人: Chang-Yuan Wu
发明人: Chang-Yuan Wu
IPC分类号: H05K7/20
摘要: A heat dissipation module adapted for an electronic device is provided. The heat dissipation module includes a heat dissipation structure and a heat dissipation fan. The heat dissipation structure is disposed in a casing of the electronic device and has a heat dissipation portion, wherein a heat dissipation flow channel is formed between the heat dissipation portion and the casing. The heat dissipation fan is adjacent to the heat dissipation portion, wherein the heat dissipation fan or the heat dissipation structure has an air flow guiding portion with a slot connected to the heat dissipation flow channel, the heat dissipation fan provides a heat dissipation air flow, and the air flow guiding portion guides a part of the heat dissipation air flow to pass through the slot along a direction not parallel to an outflow direction of the heat dissipation fan and then pass through the heat dissipation flow channel.
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公开(公告)号:US20190208662A1
公开(公告)日:2019-07-04
申请号:US16233111
申请日:2018-12-27
申请人: Shang-Che Lee , I-Lung Chen , Yi-Hsuan Wu , Wang-Hung Yeh , Chang-Yuan Wu , Jie-Ting Hsieh , Yu-Fan Chuang
发明人: Shang-Che Lee , I-Lung Chen , Yi-Hsuan Wu , Wang-Hung Yeh , Chang-Yuan Wu , Jie-Ting Hsieh , Yu-Fan Chuang
CPC分类号: H05K7/20154 , G06F1/1624 , G06F1/1669 , G06F1/20 , H05K5/0221 , H05K7/20509
摘要: A laptop computer including a main body, a fan disposed in a receiving space of the main body, a keyboard assembly movably disposed on the main body, and a heat dissipation assembly movably disposed in the main body and linked with the keyboard assembly is provided. The main body has an air outlet and at least one first air inlet. In a process of the keyboard assembly gradually moving out of the main body, the keyboard assembly drives the heat dissipation assembly to move in the main body and form a second air inlet in the main body to communicate with the receiving space.
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公开(公告)号:US20190059177A1
公开(公告)日:2019-02-21
申请号:US15894886
申请日:2018-02-12
申请人: Tse-An Chu , Ching-Ya Tu , Chang-Yuan Wu , Hao-Wu Yang , Huan-Yang Yeh
发明人: Tse-An Chu , Ching-Ya Tu , Chang-Yuan Wu , Hao-Wu Yang , Huan-Yang Yeh
摘要: A heat dissipation module adapted for an electronic device is provided. The heat dissipation module includes a heat dissipation structure and a heat dissipation fan. The heat dissipation structure is disposed in a casing of the electronic device and has a heat dissipation portion and an extending portion, wherein the extending portion has a slot, and a heat dissipation flow channel is formed between the heat dissipation portion and the casing. The heat dissipation fan is detachably assembled to the extending portion to be adjacent to the heat dissipation portion, wherein the heat dissipation fan covers the slot, the slot is connected to the heat dissipation flow channel, the heat dissipation fan is adapted to provide a heat dissipation air flow, and a part of the heat dissipation air flow passes through the slot and the heat dissipation flow channel in sequence.
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公开(公告)号:US20170112267A1
公开(公告)日:2017-04-27
申请号:US15208977
申请日:2016-07-13
申请人: Ming-Yuan Wu
发明人: Ming-Yuan Wu
IPC分类号: A45F4/04 , A45C5/14 , A45C13/10 , E04H15/02 , E04H15/18 , E04H15/62 , E04H15/32 , E04H15/40 , E04H15/54 , E04H15/56 , E04H15/58 , E04H15/64 , A45F3/04 , E04H15/30
CPC分类号: A45F4/04 , A45C5/143 , A45C13/02 , A45C13/1076 , A45C13/1092 , A45C13/385 , A45C2013/026 , A45F3/04 , A45F3/047 , E04H15/02 , E04H15/18 , E04H15/30 , E04H15/322 , E04H15/40 , E04H15/54 , E04H15/56 , E04H15/58 , E04H15/62 , E04H15/64
摘要: A backpack structure is adapted to provide a storage space, and integrated with a tent structure. The backpack body has a right connection portion and a left connection portion to connect the left sidewall and the right sidewall, wherein the connections are pins, buttons, strips or velcros. The tent structure is stored in the compartment of the backpack body, or the left sidewall and the right sidewall. The tent structure includes a tent base, a left tent portion and a right tent portion. The compartment may has pads, made of cushioning materials, such as foam, to replace the camping mat, for rest. Therefore, the backpack structure of the invention is light for the users of outdoor activities. Moreover, the backpack structure may combine with a trolley structure for drawing easily, or the backpack structure may be designed as a luggage suitcase.
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公开(公告)号:US09559189B2
公开(公告)日:2017-01-31
申请号:US13447286
申请日:2012-04-16
申请人: Chin-Cheng Chien , Chun-Yuan Wu , Chih-Chien Liu , Chin-Fu Lin , Chia-Lin Hsu
发明人: Chin-Cheng Chien , Chun-Yuan Wu , Chih-Chien Liu , Chin-Fu Lin , Chia-Lin Hsu
IPC分类号: H01L29/76 , H01L29/66 , H01L29/78 , H01L29/165
CPC分类号: H01L29/7853 , H01L29/0653 , H01L29/0847 , H01L29/165 , H01L29/66795
摘要: The present invention provides a non-planar FET which includes a substrate, a fin structure, a gate and a gate dielectric layer. The fin structure is disposed on the substrate. The fin structure includes a first portion adjacent to the substrate wherein the first portion shrinks towards a side of the substrate. The gate is disposed on the fin structure. The gate dielectric layer is disposed between the fin structure and the gate. The present invention further provides a method of manufacturing the non-planar FET.
摘要翻译: 本发明提供一种非平面FET,其包括衬底,鳍结构,栅极和栅极电介质层。 翅片结构设置在基板上。 翅片结构包括与基底相邻的第一部分,其中第一部分朝向基底的一侧收缩。 门设置在翅片结构上。 栅介质层设置在鳍结构和栅极之间。 本发明还提供了一种制造非平面FET的方法。
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公开(公告)号:US09341809B2
公开(公告)日:2016-05-17
申请号:US13588519
申请日:2012-08-17
申请人: Shang-Yu Hsu , Kun-Shih Lin , Fu-Yuan Wu
发明人: Shang-Yu Hsu , Kun-Shih Lin , Fu-Yuan Wu
IPC分类号: G02B7/02 , G02B7/08 , H02K41/035
CPC分类号: G02B7/08 , H02K41/0356
摘要: A lens focusing device includes a lens holder for holding a lens therein, a base, and an electrically conductive spring member elastically connected to between the lens holder and the base. The base is provided on a side wall with two terminal recesses, in which two connecting terminals are disposed. The connecting terminals respectively include a first terminal portion forward extended along a light axis to electrically connect to the spring member, a second terminal portion rearward extended along the light axis, and a connecting portion located between the first and the second terminal portion. The spring member is further electrically connected to two ends of a winding wound around the lens holder, so that external electric current can be supplied to the winding via the connecting terminals and the spring member for driving the lens holder to move relative to the base along the light axis.
摘要翻译: 透镜聚焦装置包括用于将透镜保持在其中的透镜保持器,基部和弹性地连接到透镜保持器和基座之间的导电弹簧构件。 基座设置在具有两个端子凹槽的侧壁上,其中设置有两个连接端子。 连接端子分别包括沿着光轴向前延伸以电连接到弹簧构件的第一端子部分,沿着光轴向后延伸的第二端子部分和位于第一端子部分和第二端子部分之间的连接部分。 弹簧构件进一步电连接到缠绕在透镜架上的绕组的两端,使得外部电流可以经由连接端子和用于驱动透镜夹持器相对于基座移动的弹簧构件供应到绕组 光轴。
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