公开(公告)号：US11008487B2

公开(公告)日：2021-05-18

申请号：US16253376

申请日：2019-01-22

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kengo Imamura

IPC: C09J163/00 ,  C09J5/06 ,  C08K7/22 ,  C08L21/00 ,  B32B7/02 ,  B32B7/12 ,  B32B15/04 ,  B32B37/06 ,  B32B37/12

Abstract: A thermoset adhesive for bonding two materials having different linear expansion coefficients with reduced warping and without spaces being formed therebetween. The thermoset adhesive of the present invention comprises an epoxy resin, a core-shell rubber, thermally expansive microparticles, and a curing agent. The thermally expansive microparticles can have at least one or any combination of an average particle size of from 9 to 19 μm, an expansion initiation temperature of from 70 to 100° C., and a maximum expansion temperature of from 110 to 135° C.

公开(公告)号：US20210009863A1

公开(公告)日：2021-01-14

申请号：US16604104

申请日：2018-04-04

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Hidetoshi Abe ,  Kengo Imamura ,  Katsuya Ono ,  Yoshihiko Takeda ,  Takeo Yamamoto

IPC: C09J7/38 ,  C09J7/25 ,  C08K3/22 ,  C08F220/06 ,  C08F220/18 ,  C08F236/20

Abstract: An adhesive sheet of an embodiment of the present disclosure is an adhesive sheet including: a rigid resin film having a thickness of 80 micrometers to 500 micrometers, and a first pressure sensitive adhesive layer being disposed on or above a surface of the rigid resin film, wherein the first pressure sensitive adhesive layer includes elastic resin microspheres having a volume average particle diameter of 110 micrometers or greater and a tacky binder, and the first pressure sensitive adhesive layer has an uneven surface due to the presence of the microspheres.

公开(公告)号：US10316225B2

公开(公告)日：2019-06-11

申请号：US14439678

申请日：2013-11-05

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kengo Imamura

IPC: C09J163/00 ,  B32B37/06 ,  C09J5/06 ,  B32B7/02 ,  B32B7/12 ,  B32B15/04 ,  B32B37/12 ,  C08K7/22 ,  C08L21/00

Abstract: A thermoset adhesive for bonding two materials having different linear expansion coefficients with reduced warping and without spaces being formed therebetween. The thermoset adhesive of the present invention comprises an epoxy resin, a core-shell rubber, thermally expansive microparticles, and a curing agent. The thermally expansive microparticles can have at least one or any combination of an average particle size of from 9 to 19 μm, an expansion initiation temperature of from 70 to 100° C., and a maximum expansion temperature of from 110 to 135° C.

公开(公告)号：US20190153275A1

公开(公告)日：2019-05-23

申请号：US16253376

申请日：2019-01-22

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kengo Imamura

IPC: C09J163/00 ,  B32B7/12 ,  B32B7/02 ,  B32B37/12 ,  C08K7/22 ,  C09J5/06 ,  C08L21/00 ,  B32B37/06 ,  B32B15/04

Abstract: A thermoset adhesive for bonding two materials having different linear expansion coefficients with reduced warping and without spaces being formed therebetween. The thermoset adhesive of the present invention comprises an epoxy resin, a core-shell rubber, thermally expansive microparticles, and a curing agent. The thermally expansive microparticles can have at least one or any combination of an average particle size of from 9 to 19 μm, an expansion initiation temperature of from 70 to 100° C., and a maximum expansion temperature of from 110 to 135° C.

公开(公告)号：US11407925B2

公开(公告)日：2022-08-09

申请号：US16604104

申请日：2018-04-04

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Hidetoshi Abe ,  Kengo Imamura ,  Katsuya Ono ,  Yoshihiko Takeda ,  Takeo Yamamoto

IPC: C09J7/38 ,  C09J7/25 ,  C08F220/18 ,  C08F220/06 ,  C08K3/22 ,  C09J133/08 ,  C09J7/29 ,  C08K7/16 ,  C08F236/20

Abstract: An adhesive sheet of an embodiment of the present disclosure is an adhesive sheet including: a rigid resin film having a thickness of 80 micrometers to 500 micrometers, and a first pressure sensitive adhesive layer being disposed on or above a surface of the rigid resin film, wherein the first pressure sensitive adhesive layer includes elastic resin microspheres having a volume average particle diameter of 110 micrometers or greater and a tacky binder, and the first pressure sensitive adhesive layer has an uneven surface due to the presence of the microspheres.

公开(公告)号：US20150284607A1

公开(公告)日：2015-10-08

申请号：US14439678

申请日：2013-11-05

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kengo Imamura

IPC: C09J163/00 ,  B32B37/06 ,  B32B7/12 ,  B32B37/12 ,  B32B15/04 ,  B32B7/02

CPC classification number: C09J163/00 ,  B32B7/02 ,  B32B7/12 ,  B32B15/043 ,  B32B37/06 ,  B32B37/12 ,  B32B2037/1253 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2605/08 ,  C08K7/22 ,  C08L21/00 ,  C09J5/06 ,  C09J2205/11 ,  C09J2400/163 ,  C09J2421/00 ,  C09J2463/00 ,  Y10T428/24942

Abstract: A thermoset adhesive for bonding two materials having different linear expansion coefficients with reduced warping and without spaces being formed therebetween. The thermoset adhesive of the present invention comprises an epoxy resin, a core-shell rubber, thermally expansive microparticles, and a curing agent. The thermally expansive microparticles can have at least one or any combination of an average particle size of from 9 to 19 μm, an expansion initiation temperature of from 70 to 100° C., and a maximum expansion temperature of from 110 to 135° C.

Abstract translation: 一种用于粘合具有不同线膨胀系数的两种材料的热固性粘合剂，具有减小的翘曲并且在它们之间形成空隙。 本发明的热固性粘合剂包含环氧树脂，核 - 壳橡胶，热膨胀性微粒和固化剂。 热膨胀性微粒可以具有平均粒度为9〜19μm，膨胀开始温度为70〜100℃，最大膨胀温度为110〜135℃的至少一种或任意组合。