公开(公告)号：US10693024B2

公开(公告)日：2020-06-23

申请号：US16017128

申请日：2018-06-25

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Mark D. Weigel ,  Mark A. Roehrig ,  Alan K. Nachtigal ,  Samuel Kidane ,  Andrew J. Henderson

IPC: H01L31/048 ,  B32B7/02 ,  B32B7/12 ,  B32B27/28 ,  B32B27/30 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B17/10 ,  B32B27/08

Abstract: An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.

公开(公告)号：US20150243816A1

公开(公告)日：2015-08-27

申请号：US14421030

申请日：2013-08-15

Applicant: Alan K. NACHTIGAL ,  ANDREW T. RUFF ,  CHRISTOPHER S. LYONS ,  Guy D. JOLY ,  Joseph C. SPAGNOLA ,  Mark D. WEIGEL ,  Michael D. DELMORE ,  Samuel KIDANE ,  Thomas P. KLUN ,  3M INNOVATIVE PROPERTIES COMPANY

Inventor： Aan K. Nachtigal ,  Andrew T. Ruff ,  Christopher S. Lyons ,  Guy D. Joly ,  Joseph C. Spagnola ,  Mark D. Weigel ,  Michael D. Delmore ,  Samuel Kidane ,  Thomas P. Lun

IPC: H01L31/048 ,  B32B37/12 ,  B32B37/10 ,  H01L51/44

CPC classification number: H01L31/0481 ,  B32B27/06 ,  B32B27/30 ,  B32B37/1018 ,  B32B37/12 ,  B32B2307/40 ,  B32B2307/412 ,  B32B2307/546 ,  B32B2307/7265 ,  B32B2307/748 ,  B32B2333/08 ,  B32B2457/20 ,  C23C14/08 ,  H01L51/448

Abstract: The present disclosure generally relates to methods of forming barrier assemblies. Some embodiments include application and removal of a protective layer followed by application of a topsheet. Some embodiments include application and removal of a protective layer including a release agent and a monomer.

Abstract translation: 本公开一般涉及形成屏障组件的方法。 一些实施方案包括施加和去除保护层，然后施加顶片。 一些实施方案包括施加和去除包括脱模剂和单体的保护层。

公开(公告)号：US20150214405A1

公开(公告)日：2015-07-30

申请号：US14421035

申请日：2013-08-15

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Alan K. Nachtigal ,  Andrew T. Ruff ,  Christopher S. Lyons ,  Guy D. Joly ,  Joseph C. Spagnola ,  Mark D. Weigel ,  Michael D. Delmore ,  Samuel Kidane ,  Thomas P. Klun

IPC: H01L31/048 ,  B32B27/08 ,  B32B27/36 ,  H01L51/52

CPC classification number: H01L31/048 ,  B32B27/08 ,  B32B27/36 ,  B32B2250/42 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2307/412 ,  B32B2307/71 ,  B32B2457/12 ,  C08J7/045 ,  C08J7/18 ,  C08J2367/02 ,  C08J2433/00 ,  H01L51/524 ,  Y10T428/2848

Abstract: The present disclosure generally relates to methods of forming barrier assemblies. Some embodiments include application of an adhesive layer and/or a topsheet to protect the exposed uppermost layer of the barrier stack during roll-to-roll processing. Some embodiments include application of an adhesive layer and/or a topsheet before the exposed, uppermost layer of the barrier film contacts a solid surface or processing roll. Inclusion of an adhesive layer and/or a topsheet protects the oxide layer during processing, which creates an excellent barrier assembly that can be manufactured using roll-to-roll processing.

Abstract translation: 本公开一般涉及形成屏障组件的方法。 一些实施例包括在卷对卷处理期间施加粘合剂层和/或顶片以保护暴露的阻挡层的最上层。 一些实施方案包括在暴露的最上层的阻挡膜接触固体表面或加工辊之前施加粘合剂层和/或顶片。 粘合剂层和/或顶片的包含在加工过程中保护氧化物层，这产生可以使用卷对卷加工制造的优异的阻挡组件。

公开(公告)号：US10038112B2

公开(公告)日：2018-07-31

申请号：US15429649

申请日：2017-02-10

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Mark D. Weigel ,  Mark A. Roehrig ,  Samuel Kidane ,  Michael D. Delmore ,  Tracie J. Berniard

IPC: H01L31/048 ,  H01L31/049 ,  H01L31/032

CPC classification number: H01L31/0481 ,  H01L31/0322 ,  H01L31/049 ,  Y02B10/12 ,  Y02E10/50

Abstract: The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device; and a weatherable sheet adjacent the barrier stack opposite the electronic device. The assembly additionally comprises a protective layer in contact with the electronic device and the weatherable sheet. The present application allows for the combination of any of the disclosed elements.

公开(公告)号：US20150224695A1

公开(公告)日：2015-08-13

申请号：US14416243

申请日：2013-06-26

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Karl K. Stensvad ,  Stanley Rendon ,  Samuel Kidane

IPC: B29C45/73 ,  B29C45/76

CPC classification number: B29C45/7306 ,  B29C45/73 ,  B29C45/76 ,  B29C2033/023 ,  B29C2045/7343 ,  B29C2045/7368 ,  B29K2995/0013 ,  B29L2031/00

Abstract: Apparatus and methods for injection molding, in which at least one portion of at least one cavity surface that defines a mold cavity, includes a thermally controllable array.

Abstract translation: 用于注塑的装置和方法，其中限定模腔的至少一个空腔表面的至少一部分包括热可控阵列。