公开(公告)号：US20150243816A1

公开(公告)日：2015-08-27

申请号：US14421030

申请日：2013-08-15

申请人： Alan K. NACHTIGAL ,  ANDREW T. RUFF ,  CHRISTOPHER S. LYONS ,  Guy D. JOLY ,  Joseph C. SPAGNOLA ,  Mark D. WEIGEL ,  Michael D. DELMORE ,  Samuel KIDANE ,  Thomas P. KLUN ,  3M INNOVATIVE PROPERTIES COMPANY

发明人： Aan K. Nachtigal ,  Andrew T. Ruff ,  Christopher S. Lyons ,  Guy D. Joly ,  Joseph C. Spagnola ,  Mark D. Weigel ,  Michael D. Delmore ,  Samuel Kidane ,  Thomas P. Lun

IPC分类号： H01L31/048 ,  B32B37/12 ,  B32B37/10 ,  H01L51/44

CPC分类号： H01L31/0481 ,  B32B27/06 ,  B32B27/30 ,  B32B37/1018 ,  B32B37/12 ,  B32B2307/40 ,  B32B2307/412 ,  B32B2307/546 ,  B32B2307/7265 ,  B32B2307/748 ,  B32B2333/08 ,  B32B2457/20 ,  C23C14/08 ,  H01L51/448

摘要： The present disclosure generally relates to methods of forming barrier assemblies. Some embodiments include application and removal of a protective layer followed by application of a topsheet. Some embodiments include application and removal of a protective layer including a release agent and a monomer.

摘要翻译： 本公开一般涉及形成屏障组件的方法。 一些实施方案包括施加和去除保护层，然后施加顶片。 一些实施方案包括施加和去除包括脱模剂和单体的保护层。

公开(公告)号：US20140283910A1

公开(公告)日：2014-09-25

申请号：US14236692

申请日：2012-07-30

申请人： Mark D. Weigel ,  Mark A. Roehrig ,  Samuel Kidane ,  Andrew T. Ruff ,  Michael D. Delmore

发明人： Mark D. Weigel ,  Mark A. Roehrig ,  Samuel Kidane ,  Andrew T. Ruff ,  Michael D. Delmore

IPC分类号： H01L31/048

CPC分类号： H01L31/0481 ,  H01L31/03928 ,  H01L31/048 ,  H02S20/23 ,  Y02B10/12 ,  Y02E10/541

摘要： The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a substrate adjacent the electronic device, a barrier stack adjacent the substrate opposite the electronic device, and a weatherable sheet adjacent the barrier stack opposite the substrate. The multilayer film is transparent and flexible and the barrier stack and the substrate are insulated from the environment.

摘要翻译： 本申请涉及一种包括电子器件和多层膜的组件。 多层膜包括邻近电子器件的衬底，与电子器件相对的衬底相邻的势垒层，以及与衬底相对的阻挡层的邻近的耐候性片。 多层膜是透明和柔性的，并且阻挡层叠层和衬底与环境绝缘。

公开(公告)号：US09997657B2

公开(公告)日：2018-06-12

申请号：US13175495

申请日：2011-07-01

申请人： Mark D. Weigel ,  Mark A. Roehrig ,  Alan K. Nachtigal ,  Samuel Kidane ,  Andrew J. Henderson

发明人： Mark D. Weigel ,  Mark A. Roehrig ,  Alan K. Nachtigal ,  Samuel Kidane ,  Andrew J. Henderson

IPC分类号： B32B27/08 ,  B32B27/36 ,  B32B27/42 ,  B32B7/12 ,  B32B7/02 ,  H01L31/048 ,  B32B17/10 ,  B32B27/30 ,  B32B27/28 ,  B32B27/32 ,  B32B27/34

CPC分类号： H01L31/0481 ,  B32B7/02 ,  B32B7/12 ,  B32B17/10018 ,  B32B27/08 ,  B32B27/281 ,  B32B27/283 ,  B32B27/286 ,  B32B27/302 ,  B32B27/304 ,  B32B27/308 ,  B32B27/32 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2307/412 ,  B32B2307/416 ,  B32B2307/42 ,  B32B2307/546 ,  B32B2307/71 ,  B32B2307/712 ,  B32B2307/7246 ,  B32B2307/732 ,  B32B2327/12 ,  B32B2367/00 ,  B32B2457/12 ,  B32B2551/00 ,  Y02E10/50 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/31663 ,  Y10T428/31667

摘要： An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.

公开(公告)号：US20120003448A1

公开(公告)日：2012-01-05

申请号：US13175598

申请日：2011-07-01

申请人： Mark D. Weigel ,  Mark A. Roehrig ,  Alan K. Nachtigal ,  Samuel Kidane ,  Andrew J. Henderson

发明人： Mark D. Weigel ,  Mark A. Roehrig ,  Alan K. Nachtigal ,  Samuel Kidane ,  Andrew J. Henderson

IPC分类号： B32B7/02

CPC分类号： H01L31/0481 ,  B32B7/02 ,  B32B7/12 ,  B32B17/10018 ,  B32B27/08 ,  B32B27/281 ,  B32B27/283 ,  B32B27/286 ,  B32B27/302 ,  B32B27/304 ,  B32B27/308 ,  B32B27/32 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2307/412 ,  B32B2307/416 ,  B32B2307/42 ,  B32B2307/546 ,  B32B2307/71 ,  B32B2307/712 ,  B32B2307/7246 ,  B32B2307/732 ,  B32B2327/12 ,  B32B2367/00 ,  B32B2457/12 ,  B32B2551/00 ,  Y02E10/50 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/31663 ,  Y10T428/31667

摘要： An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.

摘要翻译： 提供了一种包括介于第一聚合物膜基材和压敏粘合剂层的第一主表面之间的阻挡膜的组合件。 第一聚合物膜基材具有第一热膨胀系数，在一些实施方案中为高达每百万开氏百万分之50。 压敏粘合剂层具有与设置在第二聚合物膜基材上的第一主表面相对的第二主表面。 第二聚合物膜基底通常耐紫外线降解。 在一些实施方案中，第二聚合物膜基材具有比第一热膨胀系数高至少40ppm /开氏度的第二热膨胀系数。 组件对可见光和红外光透射。

公开(公告)号：US10038111B2

公开(公告)日：2018-07-31

申请号：US13175598

申请日：2011-07-01

申请人： Mark D. Weigel ,  Mark A. Roehrig ,  Alan K. Nachtigal ,  Samuel Kidane ,  Andrew J. Henderson

发明人： Mark D. Weigel ,  Mark A. Roehrig ,  Alan K. Nachtigal ,  Samuel Kidane ,  Andrew J. Henderson

IPC分类号： B32B7/02 ,  H01L31/048 ,  B32B17/10 ,  B32B27/08 ,  B32B27/30 ,  B32B27/36 ,  B32B7/12 ,  B32B27/28 ,  B32B27/32 ,  B32B27/34

CPC分类号： H01L31/0481 ,  B32B7/02 ,  B32B7/12 ,  B32B17/10018 ,  B32B27/08 ,  B32B27/281 ,  B32B27/283 ,  B32B27/286 ,  B32B27/302 ,  B32B27/304 ,  B32B27/308 ,  B32B27/32 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2307/412 ,  B32B2307/416 ,  B32B2307/42 ,  B32B2307/546 ,  B32B2307/71 ,  B32B2307/712 ,  B32B2307/7246 ,  B32B2307/732 ,  B32B2327/12 ,  B32B2367/00 ,  B32B2457/12 ,  B32B2551/00 ,  Y02E10/50 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/31663 ,  Y10T428/31667

摘要： An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.

公开(公告)号：US20120003451A1

公开(公告)日：2012-01-05

申请号：US13175495

申请日：2011-07-01

申请人： Mark D. Weigel ,  Mark A. Roehrig ,  Alan K. Nachtigal ,  Samuel Kidane ,  Andrew J. Henderson

发明人： Mark D. Weigel ,  Mark A. Roehrig ,  Alan K. Nachtigal ,  Samuel Kidane ,  Andrew J. Henderson

IPC分类号： B32B27/08 ,  B32B27/36 ,  B32B27/42 ,  B32B7/12 ,  B32B7/02

CPC分类号： H01L31/0481 ,  B32B7/02 ,  B32B7/12 ,  B32B17/10018 ,  B32B27/08 ,  B32B27/281 ,  B32B27/283 ,  B32B27/286 ,  B32B27/302 ,  B32B27/304 ,  B32B27/308 ,  B32B27/32 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2307/412 ,  B32B2307/416 ,  B32B2307/42 ,  B32B2307/546 ,  B32B2307/71 ,  B32B2307/712 ,  B32B2307/7246 ,  B32B2307/732 ,  B32B2327/12 ,  B32B2367/00 ,  B32B2457/12 ,  B32B2551/00 ,  Y02E10/50 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/31663 ,  Y10T428/31667

摘要： An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.

摘要翻译： 提供了一种包括介于第一聚合物膜基材和压敏粘合剂层的第一主表面之间的阻挡膜的组合件。 第一聚合物膜基材具有第一热膨胀系数，在一些实施方案中为高达每百万开氏百万分之50。 压敏粘合剂层具有与设置在第二聚合物膜基材上的第一主表面相对的第二主表面。 第二聚合物膜基底通常耐紫外线降解。 在一些实施方案中，第二聚合物膜基材具有比第一热膨胀系数高至少40ppm /开氏度的第二热膨胀系数。 组件对可见光和红外光透射。

公开(公告)号：US09614113B2

公开(公告)日：2017-04-04

申请号：US14236700

申请日：2012-07-30

申请人： Mark D. Weigel ,  Mark A. Roehrig ,  Samuel Kidane ,  Michael D. Delmore ,  Tracie J. Berniard

发明人： Mark D. Weigel ,  Mark A. Roehrig ,  Samuel Kidane ,  Michael D. Delmore ,  Tracie J. Berniard

IPC分类号： H01L31/048 ,  H01L31/049

CPC分类号： H01L31/0481 ,  H01L31/0322 ,  H01L31/048 ,  H01L31/049 ,  Y02B10/12 ,  Y02E10/50

摘要： The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device; and a weatherable sheet adjacent the barrier stack opposite the electronic device. The assembly additionally comprises a protective layer in contact with the electronic device and the weatherable sheet. The present application allows for the combination of any of the disclosed elements.

公开(公告)号：US20140224327A1

公开(公告)日：2014-08-14

申请号：US14236700

申请日：2012-07-30

申请人： Mark D. Weigel ,  Mark A. Roehrig ,  Samuel Kidane ,  Michael D. Delmore ,  Tracie J. Berniard

发明人： Mark D. Weigel ,  Mark A. Roehrig ,  Samuel Kidane ,  Michael D. Delmore ,  Tracie J. Berniard

IPC分类号： H01L31/048

CPC分类号： H01L31/0481 ,  H01L31/0322 ,  H01L31/048 ,  H01L31/049 ,  Y02B10/12 ,  Y02E10/50

摘要： The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device; and a weatherable sheet adjacent the barrier stack opposite the electronic device. The assembly additionally comprises a protective layer in contact with the electronic device and the weatherable sheet. The present application allows for the combination of any of the disclosed elements.

摘要翻译： 本申请涉及一种包括电子器件和多层膜的组件。 多层膜包括邻近电子器件的势垒层; 以及与电子设备相对的阻挡层堆叠的耐候片。 组件还包括与电子设备和耐候性片材接触的保护层。 本申请允许组合任何公开的元件。

公开(公告)号：US20140230892A1

公开(公告)日：2014-08-21

申请号：US14236729

申请日：2012-07-31

申请人： Mark D. Weigel ,  Samuel Kidane

发明人： Mark D. Weigel ,  Samuel Kidane

IPC分类号： H01L31/048

CPC分类号： H01L31/048 ,  H01L31/03926 ,  H01L31/049 ,  H01L51/448 ,  Y02E10/549

摘要： The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a substrate adjacent the electronic device, a barrier stack adjacent the substrate opposite the electronic device, and a weatherable sheet adjacent the barrier stack opposite the substrate. The multilayer film has been fused.

摘要翻译： 本申请涉及一种包括电子器件和多层膜的组件。 多层膜包括邻近电子器件的衬底，与电子器件相对的衬底相邻的势垒层，以及与衬底相对的阻挡层的邻近的耐候性片。 多层薄膜已经融合。

公开(公告)号：US10693024B2

公开(公告)日：2020-06-23

申请号：US16017128

申请日：2018-06-25

申请人： 3M INNOVATIVE PROPERTIES COMPANY

发明人： Mark D. Weigel ,  Mark A. Roehrig ,  Alan K. Nachtigal ,  Samuel Kidane ,  Andrew J. Henderson

IPC分类号： H01L31/048 ,  B32B7/02 ,  B32B7/12 ,  B32B27/28 ,  B32B27/30 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B17/10 ,  B32B27/08

摘要： An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.