公开(公告)号：US20240368365A1

公开(公告)日：2024-11-07

申请号：US18687345

申请日：2022-09-08

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Pierre Reinhard Bieber ,  Roman Konietzny ,  Tom Gaide ,  Michael Kempf ,  Craig W. Lindsay ,  Thomas Apeldorn ,  Simon Plugge ,  Jeffrey P. Kalish ,  Margaret M. Vogel-Martin ,  Kazuhiko Mizuno ,  Bernd Dippel

IPC: C08J9/00 ,  C08G77/12 ,  C08J9/34 ,  C08K3/22 ,  C08K7/14 ,  C08K9/04 ,  C08K13/06 ,  H01M10/653 ,  H01M50/293 ,  H01M50/383

Abstract: A thermal insulation/protection barrier that provides thermal insulation and protection to battery cells of a battery assembly. The barrier includes a cured silicone rubber foam layer comprising a plurality of firming particles disposed within the silicone rubber foam layer in an amount sufficient to impart additional firmness to the silicone rubber foam layer so that it takes a greater compressive force to compress the foam layer to a desired compression value, compared to the same silicone rubber foam layer without the firming particles.

公开(公告)号：US20220243102A1

公开(公告)日：2022-08-04

申请号：US17607279

申请日：2020-04-22

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ahmad Shaaban ,  Adrian Jung ,  Manfred Ludsteck ,  Adrian Eckert ,  Li Yao ,  Simon Plugge ,  Lingjie Tong

IPC: C09J133/08 ,  C09J133/10 ,  C08K3/22 ,  C08F220/18 ,  C08F220/06 ,  C08F220/28 ,  C08F222/10 ,  C08F230/02

Abstract: The present disclosure relates to a curable precursor of an adhesive composition, comprising: a) a (meth)acrylate-based (co)polymer base component comprising the free-radical (co)polymerization reaction product of a (co)polymerizable material comprising: i. C1-C32 acrylic acid ester monomer units; ii. optionally, C1-C18 methacrylic acid ester monomer units; and iii. optionally, ethylenically unsaturated monomer units having a functional group and which are copolymerizable with monomer units (i) and/or (ii); b) a crosslinker for the (meth)acrylate-based (co)polymer base component, which comprises at least one acid-functional group derived from phosphoric acid and at least one free-radical (co)polymerizable reactive group; c) a polyether oligomer having a number average molecular weight of at least 2000 g/mol and which comprises at least one free-radical (co)polymerizable reactive group; and d) a thermally conductive particulate material. According to another aspect, the present disclosure is directed to a curing system suitable for such curable precursor. According to still another aspect, the present disclosure relates to a method of manufacturing such curable precursor. In yet another aspect, the disclosure relates to the use of such curable precursor for industrial applications, in particular for thermal management applications in the automotive industry.