公开(公告)号：US20190118281A1

公开(公告)日：2019-04-25

申请号：US16227658

申请日：2018-12-20

Applicant: AGC, Inc.

Inventor： Motoshi ONO

IPC: B23K9/013 ,  B23K26/382 ,  B26F1/28 ,  B23K26/384

Abstract: Disclosed is a through-hole forming method including a process of forming, by condensing and irradiating a laser beam onto an insulation substrate through a lens, a through-hole that passes through the insulation substrate in a thickness direction of the insulation substrate. A medium between the lens and the insulation substrate is air. A converging half angle θ that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2): (d/2)/f=tan θ  (1), and 0.16≤sin θ≤0.22  (2).

公开(公告)号：US20220102864A1

公开(公告)日：2022-03-31

申请号：US17643232

申请日：2021-12-08

Applicant: AGC Inc.

Inventor： Yasuo MORIMOTO ,  Takeshi MOTEGI ,  Toshiki SAYAMA ,  Motoshi ONO ,  Osamu KAGAYA

IPC: H01Q9/16 ,  H01Q7/00 ,  H05K1/02

Abstract: An antenna includes an antenna conductor to be provided on an exterior side of a chassis and a flexible substrate. The flexible substrate includes a first insulating portion that is a portion of a sheet-shaped dielectric where the sheet-shaped dielectric is folded, a grounding conductor provided between the first insulating portion and the chassis, a second insulating portion that is a portion of the sheet-shaped dielectric where the sheet-shaped dielectric is not folded, and a signal line configured to feed power to the antenna conductor. A thickness of the first insulating portion is greater than a thickness of the second insulating portion.

公开(公告)号：US20240124698A1

公开(公告)日：2024-04-18

申请号：US18527512

申请日：2023-12-04

Applicant: AGC Inc.

Inventor： Motoshi ONO ,  Kanji ARAI

IPC: C08L27/12 ,  B05D7/14 ,  C08K3/22 ,  C08K3/36

CPC classification number: C08L27/12 ,  B05D7/14 ,  C08K3/22 ,  C08K3/36 ,  B05D2202/45 ,  B05D2506/10 ,  C08K2003/2237 ,  C08K2201/005 ,  C08L2205/025

Abstract: To provide a composition whereby it is possible to obtain a metal-clad laminate having low relative permittivity and dissipation factor and having adhesion of the composition layer to the metal layer improved, as well as the metal-clad laminate comprising a composition layer made of the composition, and a method for its production. A composition comprising a fluorinated polymer A1 containing units based on a fluoroolefin and units based on a monomer having an adhesive functional group, and an inorganic filler having a specific surface area of less than 5.5 m2/g, wherein the content of the inorganic filler in the solid content of the composition is at least 55 vol % to the entire volume of the solid content of the composition.

公开(公告)号：US20190021170A1

公开(公告)日：2019-01-17

申请号：US16030216

申请日：2018-07-09

Applicant: AGC Inc.

Inventor： Mamoru ISOBE ,  Motoshi ONO ,  Shigetoshi MORI ,  Kohei HORIUCHI

IPC: H05K3/00 ,  H05K1/11 ,  H05K1/03 ,  B23K26/046 ,  B23K26/064 ,  B23K26/142 ,  B23K26/382 ,  B23K26/402

Abstract: A glass substrate includes a first surface and a second surface that are opposite to each other. Multiple through holes pierce through the glass substrate from the first surface to the second surface. Each of five through holes randomly selected from the multiple through holes includes a first opening at the first surface and a second opening at the second surface. The approximate circle of the first opening has a diameter greater than a diameter of the approximate circle of the second opening. The first opening has a roundness of 5 μm or less. Perpendicularity expressed by P=tc/t0 ranges from 1.00000 to 1.00015, where P is the perpendicularity, tc is the distance between the center of the approximate circle of the first opening and the center of the approximate circle of the second opening, and t0 is the thickness of the glass substrate.

公开(公告)号：US20220145043A1

公开(公告)日：2022-05-12

申请号：US17580798

申请日：2022-01-21

Applicant: AGC Inc.

Inventor： Motoshi ONO ,  Kanji ARAI

IPC: C08K3/36 ,  C08J5/18

Abstract: To provide a substrate with low dielectric loss tangent, relative permittivity, transmission loss and thermal expansion coefficient and excellent in mechanical strength, and a metal laminated substrate using this substrate.
A substrate comprising a tetrafluoroethylene polymer and an inorganic filler, wherein the rate of change in dielectric loss tangent at 10 GHz before and after 72 hours of unsaturated pressure cooker test at 120° C. under 85% RH on a 127-μm-thick specimen cut out from the substrate is at most 30%.

公开(公告)号：US20190224783A1

公开(公告)日：2019-07-25

申请号：US16375036

申请日：2019-04-04

Applicant: AGC INC.

Inventor： Motoshi ONO

IPC: B23K26/362 ,  B23K26/08 ,  C03B25/02 ,  C03C15/00

Abstract: A manufacturing method of a glass substrate having holes includes irradiating a plurality of hole formation target positions of a dummy glass substrate with a laser under a first condition, to form a plurality of holes in the dummy glass substrate; heating the dummy glass substrate under a second condition; measuring, for each of the hole formation target positions, a deviation between the hole formation target position and a position of the hole after the heating formed by irradiating the hole formation target position of the dummy glass substrate; irradiating irradiation target positions of a glass substrate, having substantially same shape, dimension and composition as the dummy glass substrate, with a laser under the first condition, to form a plurality of holes, the irradiation target positions of the glass substrate with the laser being determined taking into account the deviation; and heating the glass substrate under the second condition.