Abstract:
A device configured to determine the location and magnitude of a touch on a surface of the device. The device includes a transparent touch sensor that is configured to detect a location of a touch on the transparent touch sensor. The device also includes a force-sensing structure disposed at the periphery of the transparent touch sensor. The force sensor includes an upper capacitive plate and a compressible element disposed on one side of the upper capacitive plate. The force sensor also includes a lower capacitive plate disposed on a side of the compressible element that is opposite the upper capacitive plate.
Abstract:
An aesthetically pleasing docking station that is able to support electronic devices with only an interface connector. The docking station is further equipped with mechanisms that protect the electronic device from damage if it's deflected too far while mated to the docking station.
Abstract:
Embodiments are directed to a wearable device including first and second band straps attached to a device body. A buckle mechanism is configured to attach the first band strap to the second band strap and includes a spring bar attached to an end of the first band strap and a buckle loop engaged to the spring bar. A tang is configured to engage a hole formed in the second band strap to secure the first band strap to the second band strap. The tang defines an aperture that receives the spring bar and is configured to pivot about an offset axis that is offset with respect to an axis of the bar. As the tang is rotated, a restoring force biases the tang toward the buckle loop.
Abstract:
A method and apparatus for injection molding plastic parts is described. In one embodiment, at least two materials are simultaneously injected into a mold. The resulting molded part can include at least two different regions. Each region can have distinct physical properties. Positions of the regions within the molded part can be at least partially controlled by controlling flow fronts of the at least two materials within the mold.
Abstract:
An electronic device may have housing structures, electrical components, and other electronic device structures. Stress sensing structures may be formed using coatings on these electronic device structures. Stress sensing structures may have strip-shaped links that extend between pads or may be formed from blanket films. A stress sensing coating may be formed from a transparent thin film. The transparent thin film may be illuminated with monochromatic light while a video camera captures video images of resulting optical interference patterns. The video images may be captured during a test in which a device structure is exposed to stress from an impact between the device and an external object. Stress sensing coatings may also be formed from layers of material that develop cracks upon exposure to stress. Stress sensing structures may be used to evaluate stress during tests and to monitor stress during normal device use.
Abstract:
This application relates to various button related embodiments for use with a portable electronic device. In some embodiments, a snap clip can be integrated with a button bracket to save space where two separate brackets would take up too much space in the portable electronic device. In other embodiments, a tactile switch can be waterproofed by welding a polymeric layer atop a tactile switch assembly. In this way water can be prevented from contacting moisture sensitive components of the tactile switch assembly. The weld joining the polymeric layer to the tactile switch can include at least one gap to trapped gas surrounding the tactile switch assembly to enter and exit during heat excursions caused by various operating and/or assembly operations.
Abstract:
An electronic device is configured to detect the presence or absence of a case that is positioned over at least one surface of the electronic device. When a case is present, the electronic device is configured to determine one or more characteristics of the case and adjust one or more operations of the electronic device based on at least one characteristic of the case.
Abstract:
An electronic device with seamless protective cover glass is disclosed. In the described embodiments, the cover glass is coupled to the housing such that the cover glass or portions of the cover glass move with respect to the housing. This movement can be used as an interface for receiving user inputs that can be used to provide control signals to the electronic device.
Abstract:
Systems and methods for forming button assemblies for electronic devices are disclosed. According to some embodiments, the button assemblies include one or more sound improvement features to improve the sound that the button assemblies make when pressed by users of the electronic devices. According to some embodiments, the button assemblies include shims that provide proper alignment of the various components of the button assemblies and to accommodate any tolerance stack up of the various components of the button assemblies. The shims can include alignment features to prevent the shims from shifting within the button assemblies. According to some embodiments, thicknesses of the shims are customized to accommodate varying tolerance stack ups of the components of the button assemblies. In some embodiments, the button assemblies include a combination of sound improvement features and shims.
Abstract:
An electronic device may contain electrical components mounted on one or more substrates such as printed circuit boards. During a drop event, the printed circuit boards and components may be subjected to stresses. Strain gauges may be formed from metal traces embedded within dielectric layers in the printed circuit boards. The strain gauges may be used to make stress measurements at various locations on the boards. Stress data may be collected in response to data from an accelerometer indicating that the device has been dropped. Stress data collection may be halted in response to determining that the device has struck an external surface. Impact may be detected using accelerometer data, strain gauge output, or other sensor data. Stress data may be analyzed by the electronic device or external equipment.