公开(公告)号：US20240162077A1

公开(公告)日：2024-05-16

申请号：US18388661

申请日：2023-11-10

Applicant: ASM IP Holding B.V.

Inventor： Rajmohan Muthaiah ,  Shubham Garg ,  Todd Dunn ,  Hong Gao ,  Joaquin Aguilar Santillan ,  Arjav Prafulkumar Vashi

IPC: H01L21/687

CPC classification number: H01L21/68785 ,  H01L21/68742 ,  H01L21/68757

Abstract: Various embodiments of the present technology may provide an apparatus for use within a reaction chamber. The apparatus includes a susceptor plate having through-holes for which lift pins may be disposed therein. In addition, the susceptor may include an electrostatic chucking function. The susceptor may also include a metal interconnect that is electrically connected to other metal interconnects with a brazing material.

公开(公告)号：US20240218506A1

公开(公告)日：2024-07-04

申请号：US18395801

申请日：2023-12-26

Applicant: ASM IP Holding B.V.

Inventor： Eric James Shero ,  Jonathan Bakke ,  Arjav Prafulkumar Vashi ,  Todd Robert Dunn ,  Paul Ma ,  Jacqueline Wrench ,  Jereld Lee Winkler ,  Shuaidi Zhang ,  Shubham Garg ,  YoungChol Byun

IPC: C23C16/448 ,  C23C16/455 ,  C23C16/52

CPC classification number: C23C16/448 ,  C23C16/45557 ,  C23C16/45561 ,  C23C16/52

Abstract: The substrate processing system includes a delivery vessel having a first inner volume, disposed in a first location on a substrate processing platform, a remote refill vessel in fluid communication with the delivery vessel via a chemical delivery line, the remote refill vessel comprising a second inner volume greater than the first inner volume and disposed in a second location remote from the substrate processing platform, and a first heating device or a first pressurizing device, or a combination thereof, proximate the remote refill vessel, operable to heat or pressurize, or a combination thereof, a chemical disposed in the remote refill vessel sufficient to change a phase of the chemical from a first phase to a second phase.

公开(公告)号：US20250092516A1

公开(公告)日：2025-03-20

申请号：US18884515

申请日：2024-09-13

Applicant: ASM IP Holding B.V.

Inventor： Nirmal Gokuldas Waykole ,  Jereld Lee Winkler ,  Yeonsu Rhee ,  Jonathan Bakke ,  Shubham Garg ,  Arjav Prafulkumar Vashi ,  Qi Qi ,  Shuaidi Zhang ,  Joshua Tyler Aragon ,  Chen Zhang

IPC: C23C16/44 ,  C23C16/455 ,  C23C16/458

Abstract: A substrate processing apparatus includes an upper chamber space, a lower chamber space, a susceptor, and a flow control ring assembly comprising a seal ring and a flow control ring having a shape to surround the susceptor, the flow control ring assembly sealing or substantially sealing the upper chamber space from the lower chamber space while the susceptor in a first position.

公开(公告)号：US20240133033A1

公开(公告)日：2024-04-25

申请号：US18403024

申请日：2024-01-03

Applicant: ASM IP Holding B.V.

Inventor： Jacqueline Wrench ,  Shuaidi Zhang ,  Arjav Prafulkumar Vashi ,  Shubham Garg ,  Todd Robert Dunn ,  Moataz Bellah Mousa ,  Jonathan Bakke ,  Ibrahim Mohamed ,  Paul Ma ,  Bo Wang ,  Eric Shero ,  Jereld Lee Winkler

IPC: C23C16/455 ,  C23C16/52

CPC classification number: C23C16/45561 ,  C23C16/52

Abstract: Herein disclosed are systems and methods related to delivery systems using solid source chemical fill vessels. The delivery system can include a vapor deposition reactor, two or more fill vessels, of which one of more can be remote from the vapor deposition reactor. Each fill vessel is configured to hold solid source chemical reactant therein. An interconnect line or conduit can fluidly connect the vapor deposition reactor with one or more of the fill vessels. A line heater can heat at least a portion of the interconnect line to at least a minimum line temperature.